「SiC研發整合工程師_元件開發部(新竹廠)」的相似工作

Overview: The Senior TCAD Engineer will be a key member of our technology development team, responsible for advanced modeling and simulation of semiconductor devices and fabrication processes. This role involves defining and executing TCAD projects for novel device architectures, optimizing performance, and analyzing results to guide process integration and design teams. Key Responsibilities: • Develop and validate TCAD models for advanced technology nodes. • Run simulations to assess device performance (IV, CV, breakdown, reliability). • Interpret results to guide design and process improvements. • Collaborate with engineering teams to align on technology roadmap. • Act as TCAD expert and provide technical support. • Automate simulation tasks using scripting (Python, Perl, TCL). • Compare simulations with silicon data and resolve discrepancies. • Prepare technical reports and present to cross-functional teams. • Stay updated on TCAD trends and enhance modeling capabilities. • Mentor junior engineers and contribute to IP development. Qualifications: • 5+ years of hands-on experience in TCAD process and device simulation within the semiconductor industry. • Deep understanding of semiconductor device physics and fabrication processes. • Expertise with commercial TCAD simulation tools such as Synopsys Sentaurus or Silvaco Atlas. • Proficiency in scripting languages (e.g., Python, Perl, TCL) for tool automation. • Experience with analog focused process technologies, particularly high voltage transistors such as drain extended CMOS or LDMOS devices.

工作概覽： 參與CMOS平台製程開發、元件設計與電性優化，支持新產品導入、製程整合與技術創新，為特殊應用產品提供完整的製程與元件解決方案。 主要職責： • 負責0.35um CMOS製程模組與整合開發。 • 參與元件(如MOS、HVLDMOS、電容、電阻等)之設計與TCAD模擬驗證。 • 建立元件模型(SPICE/LPE) 與電性分析，協助PDK開發。 • 協同設計團隊進行元件規格定義與效能驗證。 • 支援新產品導入、製程異常分析與良率改善。 資格條件: • 熟悉0.35um CMOS製程平台。 • 具元件設計、TCAD模擬或SPICE建模經驗者尤佳。 • 具備製程整合、電性量測與數據分析能力。

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

Overview: The Senior High Voltage LNDMOS Device Engineer at Diodes, Inc. leads the design and development of advanced power semiconductor devices. This role focuses on enhancing LNDMOS technology to deliver reliable and efficient solutions for automotive, industrial, consumer, and renewable energy applications. By combining device physics with practical manufacturing, the engineer ensures high-performance products that meet industry standards. Key Responsibilities: • Device Design: Develop high-voltage LNDMOS devices using CAD/TCAD tools, optimizing performance and reliability. • Process Integration: Work with process teams to define fabrication flows and ensure manufacturability and yield. • Characterization: Conduct electrical and reliability testing; analyze data to improve device performance. • Technology Innovation: Explore new structures and materials to enhance LNDMOS capabilities. • Failure Analysis: Investigate device issues using diagnostic tools; provide solutions and improvements. • Cross-functional Collaboration: Coordinate with design, process, test, packaging, and product teams. • Documentation: Prepare technical reports and present findings to stakeholders. • Product Qualification: Support reliability testing and ensure compliance with standards. • Yield & Cost Optimization: Analyze production data to improve yield and reduce costs. • Technical Support: Assist application teams and customers with device integration and troubleshooting. Qualifications: • At least 10 years in power semiconductor device engineering, focusing on high-voltage LNDMOS or LDMOS design and fabrication. Experience with IGBT or SiC/GaN MOSFETs is a plus. • Skilled in device/process simulation tools (e.g., Sentaurus, Atlas). • Solid understanding of semiconductor physics, breakdown mechanisms, and reliability. • Practical experience in wafer fabrication, cleanroom operations, and device testing. • Familiar with advanced failure analysis tools and techniques. • Knowledge of reliability standards and ruggedness requirements. • Proficient in statistical analysis and data-driven problem solving.

* OSAT (Assembly/Test) 良率異常分析 & 處理。 量產測試驗證，確保量測參數 & 規格符合設計要求。 * 測試結果資料分析，提供良率改善 & 測試流程優化建議。 * CP / FT / SLT 數據追蹤，擬定調整製程參數 or 條件。 測試開發、Debug & 參數優化，提升測試效率 & 良率穩定度。 * 與內部製程/設備/品保單位進行問題分析，釐清異常並提出改善方案。 * 支援測試需求 & 技術交流，確保產品測試時程 & 品質達成量產目標。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Ref. * CP (Wafer level - Chip Probing) * FT (Packaged chip level - Final Test) * SLT (Packaged chip level - System Level Test) * ATE (Automated Test Equipment)

Overview: MOSFET Design Team offers the innovative environment for talents to dive deep into the world of device design, platform development, and research. We offer working locations in both Xindian and Tainan. Come and join us to focus on the most cutting-edge semiconductor materials and applications! Key Responsibilities: • Develop and execute innovative device layouts in line with customer requirements, ensuring optimal functionality and efficiency. • Partner with PE and Quality teams to enhance device reliability and address any arising issues in time. • Establish and continuously optimize SPICE models to reflect the characteristics of both new and existing devices. • Work alongside the PIE team and collaborate with external foundries, paving the way for the next generation of advanced devices. • Drive the research and patenting efforts centered around novel designs, applications, and advanced materials, such as GaN and SiC. • Accomplish additional tasks delegated by the supervisor. Qualifications: • A Master’s degree in EE, Physics, or a related field. • Expertise in power devices, with a spotlight on UMOS, SGT, LDMOS, MLSJ, GaN and SiC. • Comprehensive understanding of device physics and semiconductor manufacturing processes. • Proficiency in semiconductor simulation tools. • Strong English communication skills, catering to both technical and non-technical stakeholders.

1. 從設計開發階段帶領 SiC 功率元件（如 SiC MOSFET／SBD 等）之製程流程規劃到量產導入。 2. 制定並優化製程模組（EPI／植入／氧化／蝕刻／金屬化／退火／封裝前處理）參數，並監控製程能力以提升良率。 3. 與晶圓代工廠（FAB）及相關製造單位密切溝通技術需求、製程轉移、試產條件驗證及量產交付。 4. 整合設計／製程／封裝／測試團隊，撰寫製程規格書、試產報告及量產流程文件，並負責製程異常分析與改善。 5. 追蹤產品進入量產後的製程效能，提出改善方案以保障產品品質並降低製造成本。

【工作內容】 1. 熟悉2.5D/3D架構，如CoWoS、WoW等技術家族。 2. 具備WoW hybrid bonding技術，能支援開發與量產。 3. 執行電性失效分析（EFA）與產品參數規格特性分析，協助問題釐清與品質提升。 【職務需求】 1. 3年以上製程整合相關經驗，熟悉2.5D, 3DIC, Hybrid Bonding優先。 2. 熟悉半導體DRAM製程技術，包括光罩設計、蝕刻、CMP、鍵合。 3. 具備製程良率分析、故障排除與問題解決能力。 4. 熟悉跨部門溝通與專案管理，能有效協調多方資源。

1.新評估項目導入，稽核及品質相關會議安排與執行，有品質管理經驗佳。 2.具有客戶服務意識和了解客戶需求能力，能夠主動回應客戶並提供有效的解決方案。 3.廠商客戶品質問題的處理與回覆、後續的分析追蹤與執行。 4.撰寫與審核8D Report，具備英文撰寫能力及良好跨部門溝通能力，針對品質問題進行追蹤處理。 5.協同維護氣體鋼瓶及化學品更換，氣體及化學產品出貨與倉儲管理。 6.異常排除，緊急應變處理，需多元性發展以協助其他專案報告及設備相關維護活動。 7.主管交辦事務執行。

1.了解基礎電路設計。 2.測量RF電信。 3.有低良率分析經驗。 4. Characterize and analyze the performance of PA/LNA/Switch and RF Front-end Module. 有以上經驗者佳。

Reporting to MOSFET Development Manager, you will work as Sr. MOS Development Engineer to be responsible for process integration, development and optimization. About the job: Work with product designer to create new device structure ideas and develop the necessary Mosfet/ IGBT /Diode technologies Closely work with internal process experts and external foundry partners to set up the required technologies and processes to produce the prototypes and with test labs to assess results vs. simulations / expected behavior. Responsible for experimental matrix design to evaluate and optimize design vs. specification. Co-work with fab engineering teams to generate the final design rule menu and electrical parametric specifications. Participation in fab selection and evaluation for future foundry locations. Participate and help the Design Engineers and Product Engineers on reverse engineering analysis when necessary. Act as the internal expert of semiconductor devices and processes to provide the necessary information and advices to designers on new technologies. Short term travels for business trips and trainings. About you: Knowledge of semiconductor device physics, such as Diode, BJT, MOSFET, and IGBT…etc and understanding of complex interactions between different fabrication processes. Experiences in semiconductor process development, and basic knowledge in semiconductor device characterization. Ability of arranging tests with 3rd party labs and comfortable with working in Lab for device characterization. Good writing/reading/communication in English is a MUST. The ability to operate independently in a cross-cultural working environment. Experiences in both conventional Bipolar, CMOS, DMOS processe Understanding or experiences in power semiconductor devices assembly and applications would be preferred. Knowledge and experiences of material analysis or Failure analysis tools, such as SRP, SIMS, SEM…etc. Familiar with mask generation, wafer fab process flow and in-line/PCM specifications. Knowledge and experience in one or more of the following areas would be a plus, but not must: o Test pattern generation o Semiconductor process/device modeling o Basic assembly & test processes.

Overview: Join us as a Process Integration Engineer in MOSFET team! If you’re interested in foundry management, product initiatives, and platform migration, you might be the perfect fit to this position. Applicants should hold an advanced degree, possessing expertise in power devices, quality control acumen, and strong communication skills. Key Responsibilities: • Engage with foundry partners to ensure process stability and adhering to stringent product release criteria. • Direct new tape-outs, oversee mask evaluations, and establish efficient process flows in collaboration with R&D for device and platform advancements. • Conduct pivotal failure analyses, such as PFA and EFA, and make necessary adjustments to optimize process conditions. • Guide and manage the transition of platforms to new foundry sites, balancing process adaptation, risk management, and yield quality. • Response promptly to customer’s feedback, lead root cause investigations, and collaborate with the SQE team to implement corrective measures. • Accomplish additional tasks delegated by the supervisor. Qualifications: • A Master degree in EE, Physics, or a related field. • Solid experience in power devices, especially on UMOS, SGT, LDMOS, MLSJ, GaN, and SiC devices. • Proficiency in quality control methodologies, such as Six Sigma, 8D, control plans, and FMEA. • In-depth knowledge of foundry operations and semiconductor fabrication processes. • Strong communication skills, especially in English. • Familiarity with semiconductor simulation tools is a plus.

1.製造流程建立與SOP撰寫、維護 2.產品導入及問題處置追蹤 3.良率提升及製程優化 4.客訴、不良分析與處置 5.工程變更導入及追蹤. 6.設備治工具開發驗證及維護管理與異常檢修 7.工廠與產品開發人員之間的溝通協調 8.其他主管交辦事項

因應半導體產業成長，公司目前擴大招募各項職務專業人才！！！ 歡迎查看104所有職缺，請針對有興趣的職缺【主動應徵】讓主管看到您的履歷， 通過書面審核會主動與您聯絡邀約面試。 不管在生產製程、品質技術、自動化設備、職安環保...等 只要跟化學材料相關的，都可以找到發光發熱的舞台！ 對高階電子材料、生產製程有熱情的你，歡迎加入關東鑫林，一起為世界打造下一顆晶片的力量！ **各項職務上班時段、地點、薪資皆不相同，詳細請查看各項職務內容，或於面試時說明** **請針對有興趣的職缺【主動應徵】讓主管看到您的履歷，通過書面審核會主動與您聯絡邀約面試，勿直接投遞此職缺，謝謝您**

1. 熟悉SolidWorks 3D繪圖 2. 半導體使用之溶液純化技術開發、測試、評估、製程改善及放大 3. 專利、期刊新技術搜索及分析 4. 實驗數據整理、分析與報告 5. 跨部門溝通 6. 品質問題分析 7. 產品技術導入文件編寫 8. 關鍵技術保密 9. 協助研發專案時程管控、成本評估及改善

* Proficient in Mandarin Chinese(native level) and English. * In charge of customer account * To implement problem-solving processes in the Taiwan organization, and work with the Sales and Service organization on the improvement of product reliability at customer sites, and reduce Cost Of Ownership to our customers * Deliver technical presentation to customers, particularly on details of product design, technology, applications and safety * Regional authority for product selection * Promote new product and coordinate the local resources to manage Loan & Evaluation programmes * Resolve technical and applications issues

##職務說明 1.被動元件設計與驗證: 設計並實作被動RF元件（如：RF Divider、Filter、Coupler等）。 2.主動元件設計與驗證: 負責元件電路板的設計、繪圖、測試與除錯。 3.測試流程設計與優化：規劃與執行測試流程，分析測試數據，提升測試效率與準確性，縮短測試時間。 4.文件撰寫與維護：編寫 測試計畫、測試規格、測試報告，確保測試流程標準化。 ##技能需求 1.電子、電機、資工相關科系畢業 2.熟悉 Python 或 C 語言，開發經驗佳。 3.具 RF 測試經驗（如 S11/S21 參數量測、頻譜分析、功率量測）者佳 4.邏輯清晰、學習能力強、積極主動，能夠跨部門溝通與協作

1. To improve device yield &CIP in order to meet customer request and customer service. 2. Identify and solve process and device problems. 3. Support for customer visit and audit.

Overview: This role is responsible for leading new product initiatives, crafting detailed datasheets, and fostering cross-departmental collaboration. The ideal candidate possesses a deep understanding of IC/MOSFET fabrication, semiconductor testing, and is adept at navigating Power industry nuances. Strong communication skills and self-motivation are paramount. Key Responsibilities: • Steer new product development processes, ensuring timely releases and meticulous schedule management. • Craft and disseminate product datasheets to maintain clarity and accuracy. • Provide steadfast support for Sales & Marketing teams in design-in activities, bridging technical knowledge with market needs. • Oversee product life cycles, encompassing EOL, ECR, and PCN in alignment with product roadmaps and BU strategies. • Ensure production-embedded changes through systematic controls and participate in SCS part creations. • Engage actively with multifunctional teams, crossing from Sales & Marketing, Design, and Quality, to address challenges in fabrication, packaging, testing, and application. • Accomplish additional tasks delegated by the supervisor. Qualifications: • Comprehensive knowledge of semiconductor testing, assembly, and IC/MOSFET wafer fabrication processes. • A strong foundation in electronic analysis. • Exceptional communication and negotiation skills. • A self-starter mindset with readiness for individual contributions. • Experience in the Power industry is a plus.

● 矽光波導主被動元件模擬設計與佈局 ● 矽光波導相關技術專利佈局 ● Silica光波導材料與製程開發 ● 矽光波導元件材料與光電量測分析