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荷蘭商臺灣戴爾股份有限公司台灣分公司
共500筆
09/26
台北市大安區8年以上大學以上
Cleansheet Advisor (R274359) Our products drive human progress. Our Purchasing team drives the progress of our supply systems. Within Procurement, the Cleansheet Team plays a critical role in accelerating cost efficiency through strategic sourcing and data-driven initiatives. As a key contributor, you will leverage problem-solving skills to identify opportunities, negotiate optimal manufacturing costs, and ensure best-in-class value across projects. You will also lead program management for new cleansheet initiatives, support process modernization efforts, and deliver regular strategic updates to leadership. Join us to do the best work of your career and make a profound social impact as a Project Management Advisor on our Cleansheet Team in Taipei. What you’ll achieve As a Project Management Advisor, you will be a key player in driving cost reduction through strategic sourcing and analytical initiatives. You’ll apply problem-solving skills to identify, negotiate, and ensure best-in-class manufacturing costs across projects. You will also facilitate program management for new cleansheet initiatives, contribute to process modernization, and provide regular updates on strategic progress to leadership You will: Develop and maintain cost models for Laptop, Desktop, Servers components; collaborate cross-functionally to align outputs (Specifically metals/plastic parts and assembly) Work cross functionally to socialize cost model output and recommend DFM (Design for Manufacturing), DFA (Design for Assembly) and DTC (Design to Cost) Support supplier negotiations and close cost gaps by identifying and driving improvements opportunities. Track and coordinate strategic initiatives, providing timely updates and support to leadership and team members. Leverage analytical and business insights to recommend and support strategic initiatives. Act as a proactive, collaborative team member with strong interpersonal and leadership skills
應徵
09/23
台北市松山區經歷不拘大學
【WE ARE HIRING – TI應用工程師線上招募說明會!】 想在半導體產業開啟職涯新頁? TI 2026預聘暨研發替代役招募正式啟動,參與活動有機會搶先獲得2026 offer! 善於溝通、熱愛科技與解決問題的你,FAE應用工程師將是你的最佳選擇! 想體驗在全球領先半導體企業TI工作? 立即報名,名額有限!>> https://reurl.cc/VWe7vn 活動日期 : 9月25日(四)18:30至19:30 活動形式 : 線上進行 報名後請留意信箱,以收到「報名成功通知信件」為準。 ▋ 關於德州儀器 德州儀器(TI)是位居類比晶片世界領導地位的半導體設計與製造公司,持續提供創新及頂尖的半導體技術與產品,協助客戶開發最先進的電子產品。除此之外,TI也針對在校學生及初入社會新鮮人設計完整的培訓制度與挑戰性的工作內容,並提供具競爭力的薪資與福利、完善的升遷管、輪調培訓計畫以及活潑與國際化的工作環境。 ▋科技菁英計劃 - TI 應用工程師輪調培訓計畫 有思考過RD、IC設計之外的另一種職涯可能嗎? 喜歡與人互動並充滿挑戰的工作卻又擔心新鮮人無法立即上手嗎? 別擔心! TI針對FAE新鮮人提供海內外全面且扎實的系列培訓課程, 透過課堂及工作日常的任務的學習,您將具備FAE應具備的各項知識與技能,在客戶面前成為專業與自信的FAE! 另外,TI亦提供完整的輪調計劃,透過給予新人不同職務內容的學習, 使其能在公司有更多成長及發展的機會。 ▋ 應用工程師職務說明 >>在TI做FAE,您可以… • 參與FAE完整培訓計畫,包含1對1 coach、豐富教育訓練資源 • 與全世界技術專家合作,參與跨國會議及海內外輪調計畫,在國際舞台成長 • 接觸TI多元產品線,包含熟悉的#消費性電子、時下最夯的#車用電子 ,以及工業用等產品,共超過8萬顆產品,學無止境! • 透過專案及團隊合作,快速累積技術硬實力及溝通軟實力 • 享受開放扁平的組織氛圍,不論是專業領域或職涯發展,都能夠勇敢表達 • 走出多元職涯,不論是技術導向的技術專家(technical ladder program) 或是領導團隊的用人主管,TI提供暢通的升遷管道讓您有機會被全世界看見 >>FAE在做什麼 作為“Technical Expert”,與Technical Sales Engineer併肩合作,了解客戶的技術需求、解決客戶的技術痛點,將TI產品特性與客戶系統需求聯結起來。運用產品選擇、系統、實現和調試方面的技術能力,從而實現業務目標。 • 積極與客戶建立關係,及時掌握客戶開案訊息,進而瞭解其需求與系統設計,推展TI的產品讓客戶的設計更有市場競爭力。 • 透過TI全球技術資源,提供專業技術服務,解決TI產品應用在客戶系統上的技術問題,協助客戶順利導入量產。 • 了解TI系統及產品,並研究同業競爭的狀況,反應客戶需求及市場資訊給研發團隊做為未來產品開發的參考。 看更多徵才資訊與FAE工作介紹=> https://www.facebook.com/texasinstrumentsTW/videos/1382188632429211 歡迎至https://www.cakeresume.com/resources/texas-instruments?locale=zh-TW 看更多內容 #R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 #年薪(含紅利)百萬起跳 ▋ 面試準備: • Phone interview: 1. 對德州儀器及此職務的了解: o 針對德州儀器的業務範圍或是德州儀器在台灣的業務發展 2. 投遞動機 o 針對此職務為什麼想要投遞 o 對職務的了解程度 o 未來工作發展方向 • 第一關面試準備: 1. 英文自我介紹 2. 簡報(碩論題目或是DC/Amplifier介紹) • 第二關面試準備: 1. 針對工作內容了解 2. 職涯發展方向 3. 情境考題
應徵
09/23
營邦企業股份有限公司電腦及其週邊設備製造業
桃園市大園區5年以上大學
1. X86 server platform design. 2. SAS/SATA/NVMe back plane design and PCIe riser design. 3. Schematic drawing/review, layout constraint/review, signal measurement ,and debug. 4. Hardware specification writing. 5. New technology specification study. 6. Handle RFQ/RFP and discuss designs with customers.
應徵
09/26
廣達電腦股份有限公司電腦及其週邊設備製造業
桃園市龜山區10年以上大學以上
1. 主導矽光子、CPO 與先進封裝技術在 AI Server 中的技術評估與導入。 2. 與晶圓廠、封裝廠及供應商合作,推動新世代 AI 伺服器技術開發與量產。 3. 評估供應鏈與材料選擇。確保產品符合標準(如可靠性、功耗與成本控制) 4. 參與AI 伺服器架構設計,從概念驗證到原型測試,聚焦於光電整合與高效能運算。 5. 支援跨部門協調專案管理、研發、製造、品保等團隊。 6. 追蹤業界技術趨勢,提供技術洞見,支持公司 AI 伺服器產品的長期發展。
應徵
09/22
立端科技股份有限公司電腦及其週邊設備製造業
新北市汐止區3年以上專科
1. Motherboard schematics design/debug ,at least 5 years experience 2. Familiar with X86 experience is better 3. RISC design experience is better 4. Need to co-work with BIOS and Mechanical RD 5. Prepare related design documents 6. Have experience in Motherboard /Server board /Notebook 7. Making BOM 8. Layout review
應徵
09/22
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新竹市經歷不拘大學以上
【Molex--2025 校園徵才活動】 ▶3/ 15 (六) 國立陽明交通大學-校園徵才博覽會( 攤位137) ▶3/ 22 (六) 國立清華大學-校園徵才博覽會 ( 攤位E91) 【招募職缺】 1. Engineer, SI/Hardware (新竹) Job Content: RF design and simulation for high-speed module PCB and Siliconphotonics PIC Education: Master or above major in electromagnetic, microwave or EE 2. Engineer, Siphotonics PIC (新竹) Job Content: Siphotonics PIC design/ layout/ characterization Education: Master or above major in Electro-Optical Engineering, or relevant 3. PDE Intern(三重/台北) Job Content: Design flexible printed circuits (FPC) from RFQ costing to mass production and supporting manufacturing document generation. Education: Bachelor of Electrical Engineering or similar (interest or experience for FPC design, preferred tools: ViewMate, ODB++, Siemens NX CAD) 4. Layout Engineer(三重/台北) Job Content: Layout design for flexible printed circuits (FPC), including technical design details for customer needs and manufacture capability. Education: Bachelor of Electrical Engineering or similar (experience with layout, preferred tools: Allegro or AltiuM) 5. Engineer (Intern), Production/ IE(三重/台北) Job Content: IE: production cost analysis, efficiency and productivity baseline monitoring and improvement Production: line leader and area supervisor training and internship Education: Bachelor of Industrial Engineering, Statistics or similar fields 6. ME Engineer(三重/台北) Job Content: Flexible printed circuits (FPC) New machine qualification, Process validation, Process capability development for new manufacturing generation Education: Bachelor’s degree in electrical engineering and chemical engineering or similar field 7. Process Automation Engineer(三重/台北) Job Content: Flexible printed circuits (FPC) New automation machine evaluation and development Education: Bachelor’s degree in technical or engineering field Experience in the software design of industrial automation 8. Optical Engineer (WSS)(新竹/新店) Job Content: 1. WSS Product development 2. Optical design 3. Optical component support 4. Bench top LAB optical table work Education: 1. Master/ PhD in Optical related field 2. Optical table / bench work experience, accurate optical alignment experience 3. Optical design / ZEMAX experience (Prefer) 9. Engineer, Firmware (WLM)(新店) Job Content: 1.Work in the product engineering team for firmware design and/or verification. 2.Write/review on the firmware specification and the related documents. Education: Master or above major in Computer Science, Software or Electrical Engineering 10. Engineer, Product Design (Optical Connectivity)(新店) Job Content: 1. Develop protocols and perform product verification and validation testing, build and test prototype designs for proof of concept. 2.Communicates product progress and facilitate decision-making with the core team and throughout their relevant functional organization. Education: 1.Bachelor’s degree above in mechanics or related field. 2.Good ability to use relevant drawing software such as Solid work, NX, Pro-E or CAD for mechanical structure handling 11.Assistant Engineer, Product design(Cage)(淡水) Job Content: Assist in the development, process control, 3D model, 2D drawing and BOM data generating and coordination of functional teams Education: Master or above major in mechanical related 12.Assistant Engineer, Product design(Internal Cable)(淡水) Job Content: Assist in the development, process control,3D model, 2D drawing and BOM data generating and coordination of functional teams Education: Master or above major in mechanical related 13.Assistant Engineer, PDE (NPD)(淡水) Job Content: Assist in product development, Ex: CAD/3D/experiment Education: Master or above major in Mechanical or Thermal/Materials engineering-related. 14.Associate Sales Engineer (2025 Talent Program) (淡水/信義區) Job Content: Design in Molex products to customers Education: Bachelor’s or Master’s Degree
應徵
08/18
香港商栢能科技有限公司消費性電子產品製造業
台北市大同區5年以上大學
Job Summary: 1. We are looking for a highly skilled and experienced Senior Hardware Design Engineer to join our server development team in Taipei. 2. The ideal candidate will be responsible for high-speed hardware design, schematic capture, debugging, and working cross-functionally with layout, validation, firmware, and manufacturing teams to deliver high-quality server products and add-on cards. Key Responsibilities: 1. Responsible for schematic capture, layout review, BOM generation, and debugging/testing of server motherboards and add-on cards. 2. Collaborate with layout engineers, BIOS and firmware engineers, validation and test engineers, and cross-functional teams to identify and resolve engineering issues early in the development cycle. 3. Participate in and contribute to design reviews, architecture discussions, and project planning. 4. Prepare and maintain technical documentation, including product specifications, layout guidelines, test procedures, and design review reports. 5. Ensure product compliance with engineering specifications, safety, and energy regulations if any (e.g., ErP), and customer performance expectations. 6. Provide clear documentation and technical support to contract manufacturers and production teams during prototype and mass production stages. 7. Lead root cause analysis and provide corrective actions for hardware-related production or field issues. Required Qualifications: 1. Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 2. Minimum 5 years of experience in hardware design for server, PC, or embedded systems. 3. Proficient in schematic capture tools (e.g., OrCAD). 4. Solid understanding of high-speed signal integrity, power delivery design, and board-level debugging. 5. Hands-on experience with lab equipment such as scopes, logic analyzers, and multimeters. 6. Strong problem-solving and analytical skills. 7. Good communication and documentation skills in both English and Mandarin.
應徵
09/24
驊陞科技股份有限公司被動電子元件製造業
新北市汐止區3年以上大學
PRIMARY PURPOSE: As a SI Engineer, you are responsible for verification and characterization in connector design. You will work closely with the mechanical engineer to ensure new design rules, manufacturing processes and material that can fit our goals. DUTIES AND RESPONSIBILITIES: 1.Provide technical support to sales team for CCDC high speed products and helpcustomer to solve interconnect challenges. 2. Perform SI simulation and solve the challenge of SI terms to meet customers. 3.Be responsible for high-speed connector design, simulation and validation through product development cycles for CCDC. 4.Perform pcb design and layout reviews. Conduct measurement and perform the good correlation or find the approach to minimize the gap. 5. Research the next generation platform and committee’s latest specification. 6.Help devise strategies to differentiate our products and solutions from our competitors. 工作簡介: 作為SI工程師,您將負責連接器設計的驗證和特性分析。您將與機械工程師緊密合作,確保新的設計規則、製造流程和材料符合我們的目標。 工作內容: 1. 為CCDC高速產品銷售團隊提供技術支持,並協助客戶解決互連挑戰。 2. 進行SI仿真,並解決SI術語的挑戰,以滿足客戶需求。 3. 負責CCDC產品開發週期內的高速連接器設計、模擬與驗證。 4. 進行PCB設計和佈局評審。進行測量並進行良好的相關性分析,尋找最小化差異的方法。 5. 研究下一代平台和委員會的最新規範。 6. 協助制定策略,使我們的產品和解決方案與競爭對手脫穎而出。
應徵
09/23
台北市松山區經歷不拘大學
【WE ARE HIRING – TI應用工程師線上招募說明會!】 想在半導體產業開啟職涯新頁? TI 2026預聘暨研發替代役招募正式啟動,參與活動有機會搶先獲得2026 offer! 善於溝通、熱愛科技與解決問題的你,FAE應用工程師將是你的最佳選擇! 想體驗在全球領先半導體企業TI工作? 立即報名,名額有限!>> https://reurl.cc/VWe7vn 活動日期 : 9月25日(四)18:30至19:30 活動形式 : 線上進行 報名後請留意信箱,以收到「報名成功通知信件」為準。 ▋ 關於德州儀器 德州儀器(TI)是位居類比晶片世界領導地位的半導體設計與製造公司,持續提供創新及頂尖的半導體技術與產品,協助客戶開發最先進的電子產品。除此之外,TI也針對在校學生及初入社會新鮮人設計完整的培訓制度與挑戰性的工作內容,並提供具競爭力的薪資與福利、完善的升遷管、輪調培訓計畫以及活潑與國際化的工作環境。 ▋科技菁英計劃 - TI 應用工程師輪調培訓計畫 有思考過RD、IC設計之外的另一種職涯可能嗎? 喜歡與人互動並充滿挑戰的工作卻又擔心新鮮人無法立即上手嗎? 別擔心! TI針對FAE新鮮人提供海內外全面且扎實的系列培訓課程, 透過課堂及工作日常的任務的學習,您將具備FAE應具備的各項知識與技能,在客戶面前成為專業與自信的FAE! 另外,TI亦提供完整的輪調計劃,透過給予新人不同職務內容的學習, 使其能在公司有更多成長及發展的機會。 ▋ 應用工程師職務說明 >>在TI做FAE,您可以… • 參與FAE完整培訓計畫,包含1對1 coach、豐富教育訓練資源 • 與全世界技術專家合作,參與跨國會議及海內外輪調計畫,在國際舞台成長 • 接觸TI多元產品線,包含熟悉的#消費性電子、時下最夯的#車用電子 ,以及工業用等產品,共超過8萬顆產品,學無止境! • 透過專案及團隊合作,快速累積技術硬實力及溝通軟實力 • 享受開放扁平的組織氛圍,不論是專業領域或職涯發展,都能夠勇敢表達 • 走出多元職涯,不論是技術導向的技術專家(technical ladder program) 或是領導團隊的用人主管,TI提供暢通的升遷管道讓您有機會被全世界看見 >>FAE在做什麼 作為“Technical Expert”,與Technical Sales Engineer併肩合作,了解客戶的技術需求、解決客戶的技術痛點,將TI產品特性與客戶系統需求聯結起來。運用產品選擇、系統、實現和調試方面的技術能力,從而實現業務目標。 • 積極與客戶建立關係,及時掌握客戶開案訊息,進而瞭解其需求與系統設計,推展TI的產品讓客戶的設計更有市場競爭力。 • 透過TI全球技術資源,提供專業技術服務,解決TI產品應用在客戶系統上的技術問題,協助客戶順利導入量產。 • 了解TI系統及產品,並研究同業競爭的狀況,反應客戶需求及市場資訊給研發團隊做為未來產品開發的參考。 看更多徵才資訊與FAE工作介紹=> https://www.facebook.com/texasinstrumentsTW/videos/1382188632429211 歡迎至https://www.cakeresume.com/resources/texas-instruments?locale=zh-TW 看更多內容 #R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 #年薪(含紅利)百萬起跳 ▋ 面試準備: • Phone interview: 1. 對德州儀器及此職務的了解: o 針對德州儀器的業務範圍或是德州儀器在台灣的業務發展 2. 投遞動機 o 針對此職務為什麼想要投遞 o 對職務的了解程度 o 未來工作發展方向 • 第一關面試準備: 1. 英文自我介紹 2. 簡報(碩論題目或是DC/Amplifier介紹) • 第二關面試準備: 1. 針對工作內容了解 2. 職涯發展方向 3. 情境考題
應徵
09/23
台北市松山區5年以上大學
The Analog Field Applications Engineer (AFAE) is responsible for partnering with Sales and providing Analog related technical expertise throughout the sales cycle. The AFAE proactively identifies current products and/or creative solutions to solve existing customer projects and create new functionality/opportunities. In this role, the AFAE uses in-depth product knowledge to provide technical expertise to gain credibility and develop relationships with customers. ▋Job Description : • Solve customer technical challenges from system prospective. Build up customer relationship and maximize TI product contents in customer’s applications. • Work together with sales force in driving revenue growth. • Provide and feedback product/solution gap to business unit and uncover opportunities for future product development. ▋Preferred qualifications • Power background with hands-on experience on schematic/layout design tools and issue debugging. • Working experience with OEM Taiwan design center and proper Multiphase power knowledge are a plus. • In addition to Power product knowledge (DC/DC, Multiphase, POE…etc.), it will be plus to have general non-power product knowledge (USB PD, High speed, ADC, DAC…etc.) • Ability to collaborate effectively with customers to solve their complete analog system requirements utilizing TI components • Strong verbal and written English communication skills • Strong presentation skills, with ability to effectively relate materials to customers • Demonstrated strong analytical and problem-solving skills and support system-level board testing and validation • Strong willingness to work as a team player, share the knowledge and experiences with other colleagues. • Analyze competition landscape and leverage internal or external influence and resources to win business. • Ability to take the initiative and drive for results The ability to multitask in a high energy environment • Ability to work effectively in a fast-paced and rapidly changing environment • Strong time management skills that enable on-time project delivery • Demonstrated ability to build strong, influential relationships • Execute the business target in the ways of discipline, consistency and resilience. • Leverage tools to work smart. • Passionate in learning new product and system knowledge. • Participate in and facilitate failure analysis and corrective actions 看更多徵才資訊與FAE工作介紹=> https://www.facebook.com/texasinstrumentsTW/videos/1382188632429211 歡迎至https://www.cakeresume.com/resources/texas-instruments?locale=zh-TW 看更多內容 #R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 #年薪(含紅利)百萬起跳
應徵
09/22
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市新店區5年以上大學以上
Molex possesses a rich heritage in the optical industry. We provide the highest performing and field-proven wavelength management solutions from components, modules to integrated line-cards. Continuous innovation in passive component function integration, miniaturization, and manufacturing automation, cutting edge WSS and amplification technology and comprehensive optical, mechanical, electrical and software design capabilities enable us to serve the needs of high-density, high-bandwidth, and flexible optical networks of telecom, datacom, hyperscale datacenter, artificial intelligence, and supercomputing. In New Taipei, Taiwan, we serve global clients in telecom and datacom industries in providing next generation optical modules to support 5G Networks. We are looking for a Senior Electrical Design Engineer. We are building a new capability to accelerate our leading edge optical networking capabilities. We are looking for a Senior Engineer that will design, review, and improve a variety of optical equipment, including OTDR, OCM, OSC and other electronic products for 5G and other advanced optical networking systems and data communications networks. Responsibilities: • Develop, review, release, and support advanced optical modules and sub-systems such as OTDR, OSC, OCM, etc. • Work with product marketing and engineering team consisting of optical, hardware, mechanical, software, and process engineers to enable high performance, cost effective, and robust products, and repeatable and efficient manufacturing • Ensure successful transition from architecture to new product introduction and to volume production • Drive and recommend innovative solutions to ensure product meets customer performance, cost, schedule, and other requirements • Select components, generate schematic design, create PCB layout instructions, and closely work with FPGA, software, mechanical, thermal, optical, process and other teams to optimize the design • Perform circuit simulation for high speed signals using HFSS, ADS, or similar • Complete board bring-up, debug and validate performance of electronic systems; conduct experiments to characterize components and subsystems • Generate documentation of the design and results of the experiments and testing • Help develop DVT, manufacturing, assembly, diagnostic, test, qualification plans and other documents. Provide technical guidance to resolve manufacturing issues • Resolve customer technical issues. Work with FAE, QA, and other technical-support teams • Work with global teams for new product designs • Perform other duties as assigned by management Requirements: • Bachelors degree in Electrical Engineering • At least 8 years electrical engineering experience in Telecom, Datacom industry or related fields • Proficient in designing high speed boards • High speed digital transmission and signal integrity knowledge • Proficient with electronic design and simulation tools, such as OrCAD with CIS, Allegro, HFSS What will put you ahead • Masters of Electrical Engineering • Experience EDFA and Raman optical amplifiers • Experience in designing and resolving ESD, EMI, Immunity and other compliance and safety related items • Proficient in analog electronics: TIA, PD, filters, ADC, DAC, analog PLLs, etc.
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07/02
台北市內湖區5年以上大學
Welcome to apply from NVIDIA Career page: Server: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Taiwan-Taipei/Senior-System-Application-Engineer_JR1996786-1 Notebook: https://nvidia.wd5.myworkdayjobs.com/NVIDIAExternalCareerSite/job/Taiwan-Taipei/Senior-System-Application-Engineer_JR1996805 We're Application Engineering team and searching for System Engineer to engage for partner development in ARM-based (Grace CPU) and X86-based servers with NVIDIA solutions. NVIDIA is creating the future of computing and looking for passionate, dedicated, and forward-thinking individuals to help make that happen. What you’ll be doing: - System-level tool development/debug from the product segment needed. - Join the partner design review through system architecture, schematics, and layout, thermal and validation plan. - Work with partners for issue analysis and root cause. - Drive with partner's design quality. - Provide tech training to customers. - Overseas travel will be required if needed. What we need to see: - Master's Degree or equivalent experience in Computer Science/Computer Engineering/Electrical Engineering or related field. - 5+ years of server or PC design work experience. - High-Speed Signal design/ Strong knowledge of GPU Server System Architecture includes X86 and ARM-based. - Familiar with Linux. Good concept of thermal and mechanical design. - Skills of ARM Server System Architecture are a strong plus. Skills of Python/Perl is a plus - Knowledge of the PCIe architecture with AER (Advanced Error Reporting). - Excellent communication skills, flexibility in task assignments, and working under pressure. - Strong communications skills in English, Innovative, Independent, results-oriented problem solver. Ways to stand out from the crowd: -Strong oral & written communication skill (both English and Chinese). -Development experiences in datacenter design or server product. -Self-motivated and aggressive to learn
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09/23
新北市五股區6年以上大學以上
Responsibilities include: 1. Act the staff/sr. role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.
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09/24
Advantech_研華股份有限公司電腦系統整合服務業
新北市林口區3年以上大學
在研華這幸福企業的大家庭,我們創建一個讓員工學習和發展,並發掘職業潛能的工作環境。 【職務介紹】 研華正在招募一位有經驗的硬體研發工程師加入組織。希望找尋具備相關性產業的硬體研發經驗者,投入嵌入式板卡研發的工作中,期待藉由人才的專業精進研華硬體研發的品質。 【主要工作內容】 1. X86標準品新專案研發/ 除錯/ BOM表操作撰寫。 2. 客製專案研發/ 除錯/ BOM表操作撰寫。 3. 舊專案維護,修改與測試除錯。 4. 底板專案開發。 5. 協助分析已量產專案客訴回饋問題。 6. 跨部門溝通討論產品issue。 【人才具備】 -工作經驗:3-5年PC/NB/Server或相關性產業硬體研發經驗。 -學歷要求:大學、碩士工程學科類畢業。 -語文條件:英文(聽:中等、說:中等、讀:中等、寫:中等)。 -擅長工具:熟悉x86架構,OrCAD, Allegro使用。 -工作技能: 1.電子電路、PCB Layout 設計與規劃能力。 2.硬體問題分析能力。 3.設計經驗分享與除錯。 【關於研華】 研華是全球工業電腦的領導廠商,提供嵌入式電腦與工業自動化的解決方案,產品涵蓋工業電腦、嵌入式系統、單板電腦、 工業用主機板、液晶平板電腦、醫療用電腦、車載電腦、工業用I/O等。研華成為提供海外智慧製造輸出服務的之大型系統整合商,協助海內外台商在有智慧工廠、智慧倉儲、節能減碳需求之產業升級,並建構智慧機械所需數位轉型訂閱制軟體服務,打造雲端服務解決方案領導品牌。 研華相關資訊與鏈接 研華官網 研華共創物聯網世界的未來 (advantech.com) 研華LinkedIn https://www.linkedin.com/company/advantech 研華科技Advantech Careers Facebook
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09/25
醫揚科技股份有限公司電腦及其週邊設備製造業
台北市大安區3年以上大學
(1)X86主機板開發 (2)醫療電腦設計 (3)具電池或電力系統管理設計經驗 (4)熟悉MCU/IoT及電池和DC/DC電源相關管理設計
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09/22
鴻海精密工業股份有限公司消費性電子產品製造業
新北市土城區2年以上大學以上
CESBG 產品線: Server產品 1.技術可行性分析 2.硬體線路設計 3.硬體設計審查和BOM產出 4.審查 PCB Layout 5.執行開機測試和執行除錯
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09/24
台北市信義區經歷不拘專科
Job Title: Junior Engineer Department: Project Engineering Reports To: Senior Engineer / Engineering Manager Location: Taipei, Xinyi District Job Type: Full-Time Job Summary: We are looking for a motivated and detail-oriented Junior Engineer to support our engineering team in the design, development, and implementation of projects. This entry-level role is ideal for recent graduates or those with up to two years of experience, offering a great opportunity to gain hands-on experience and grow within a collaborative team environment. Key Responsibilities - Mechanical Engineering Focus * Create and revise 2D and 3D models using engineering design software such as SolidWorks, SolidEdge, or Inventor. * Edit and manage engineering data, drawings, and documentation in line with project requirements and version control standards. * Support the design and development of components and assemblies, ensuring functionality, manufacturability, and compliance. * Collect, analyse, and organize technical data using tools such as Excel and company-specific systems (e.g., SAP, PLM). * Prepare and maintain technical documentation, including part lists, specifications, and test reports. * Participate in engineering reviews, site visits, and cross-functional meetings to support collaborative decision-making. * Assist in troubleshooting technical issues and propose solutions in coordination with senior engineers. * Deliver assigned tasks on time and to specification, maintaining high levels of accuracy and attention to detail. * Follow established KPI metrics, such as drawing accuracy, timely task completion, and adherence to documentation standards. * Ensure that all activities comply with company procedures, quality standards, and health & safety regulations. Qualifications & Skills: * Bachelor’s degree in Engineering (e.g., Mechanical, Electrical, Civil, etc.). * 0–2 years of engineering experience (internships or co-op roles count). * Strong analytical and problem-solving skills. * Proficiency in CAD software (e.g., AutoCAD, SolidWorks) and Microsoft Office Suite. * Excellent written and verbal communication skills. * Willingness to learn and take direction from senior staff. * Ability to manage time and multiple tasks in a dynamic environment. * Exposure to project management or manufacturing processes.
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09/22
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
台北市信義區8年以上大學
PRIMARY PURPOSE: We are seeking individuals who are proactive, humble, unafraid of learning new things, and have the potential for growth. The R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. You are responsible for designing and optimizing a product or create valuable or quality of product that will scale with Molex continued growth. As a Product Design Engineer, you will design and evaluate product, identify product requirements and contribute to research and project planning. DUTIES AND RESPONSIBILITIES: 1. Apply design, engineering, and technical expertise to influence cross-functionally and deliver reliable mass production components and solve time-sensitive problems. 2. Make significant contributions to design, development, and validation of different solutions (Specifically focused on the cooling solution for the cage and the design of the connectors.) 3. Manage the product design, provide guidance to team members, and communicate progress, and request feedback to prevent/remove roadblocks. 4. Anticipate and address product design issues or risks, analyze data, and validate product design to suggest or implement design improvements. 5. Conducts feasibility studies for new projects leveraging existing designs while also generating new designs and IP, drives consistency and thoroughness across portfolio. EDUCATION Required: Bachelor’s degree in mechanical engineering, Process Engineering, Manufacturing Engineering or equivalent practical experience. Required Experience and Skills:  8~10+ of work experience as a hands-on engineer.  Possesses thorough understanding of the product development process (Design Concept, EVT, DVT, PVT).  Demonstrated experience working with cross functional teams in English.  Engineering Design Software: NX (preferred), Creo, Pro/E, etc.  Knowledge in molding of different kind of materials, stamping, assembly process, product development process.  Ability to independently complete design and manage projects.  Understand thermal and mechanical of liquid cooling system.  Good problem-solving skill and able to deeply analyze testing failure mode.  Tolerance stack-up Analysis, review thermal, and reliability testing report. Desirable Requirements:  Experience in server or switch liquid cooling systems.  Experience in the high-speed connector industry.  Relevant knowledge of seal product design.  Experience with simulation or performance analysis of liquid cooling thermal solutions, precision machining, brazing (furnace, vacuum), molding (plastic & metal), soldering, stamping/assy, welding or sintering processes.  Passionate about design work and innovation, creating new products to address gaps in the industry.
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09/23
緯穎科技服務股份有限公司電腦及其週邊設備製造業
新北市汐止區10年以上碩士以上
我們提供的挑戰與機會 • 參與公司最前沿的 AI 伺服器與高效能運算平台設計,影響新一代資料中心的核心產品。 • 研究新技術與產業趨勢,從需求評估到系統方案定義,直接影響全新架構專案的走向。 • 負責跨模組設計整合(Compute、Networking、Thermal、Power、Mechanical),確保系統設計可行並能成功落地。 • 直接參與與國內外客戶的架構討論,影響產品 roadmap 與技術策略。 工作職責 1. 前期評估公司收到的新專案規格,釐清技術需求並進行可行性分析。 2. 主導系統架構規劃,定義模組分工與介面 (compute board, GPU, switch, power, cooling)。 3. 研究與引入新技術 (如液冷、CPO/光互連、800V HVDC 等),提出系統解決方案。 4. 跨部門協作,確保 EE、ME、Thermal 與 FW 設計符合整體架構要求。 5. 協助客戶進行技術方案評估與設計 review,並提供決策建議。 職涯亮點 • 參與全新架構專案,從需求到量產全程影響產品決策。 • 接觸並應用最新前沿技術,提升系統架構與整合能力。 • 建立跨國專案經驗,累積系統工程與架構規劃的職涯競爭力。
應徵
09/24
宏門有限公司其他電子零組件相關業
台北市松山區經歷不拘專科以上
1. DC-DC 電源測試 2. 需會設定及使用示波器(太克/力肯),存圖及做成excel報告 3. 異常問題分析與處理、故障排除、資料匯整及撰寫報告 4. 需會使用烙鐵(更換SMD零件),電錶,熱風槍 5. 交辦主管交代事宜 6. 上班地點德州儀器 7. 能懂以下英文測試專有名詞尤佳: Bode plot measurement and fine tune, Output voltage ripple measurement, Open short test, load transient test, Jitter performance measurement, High/Low MOS VDS measurement, Efficiency measurement…etc. 男女不拘,具備基本電子學知識、有責任感,配合度高、歡迎加入。
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