「Hardware Development Engineer 硬體研發工程師 - Taipei (Req: 20929)」的相似工作

1. X86 / ARM base 主板/周邊線路規劃、設計開發、測試驗證 2. Panel PC訊號量測、分析，方案評估與相關技術問題對策 3. OEM/ODM 專案評估與整合 4. 工廠生產異常問題分析與解決

1.負責車用 ECU 產品的硬體系統架構設計、原理圖繪製與 PCB layout 規劃。 2.開發基於Renesas、NXP車用 SoC的ECU。 3.設計與驗證高速訊號，如 DDR4/5、SerDes、PCIe、Ethernet、LVDS。 4.建構 8~12 層 HDI PCB、盲/埋孔設計、stacked via 結構與 EMC/EMI/ /ESD對策。 5.協助系統 bring-up、功能測試、信號完整性分析與熱分析。 6.熟悉 ISO 26262 功能安全規範，並導入車規元件與安全設計。

1. SSD及相關產品開發 2. 高速訊號完整性模擬 3. 驗證及量產測試設備開發 *熟悉並擅長運用ANSYS SIWAVE尤佳

1.電池模組整合：熟悉 BBU 電源與電池模組（BMS、電芯、保險絲、Relay）的電氣介面。 2.硬體電路設計與驗證：包含原理圖設計、PCB Layout指導、電路模擬與實測驗證。 3.安規與可靠度測試：配合UL1973、UL9540A、IEC62619、EMC/ESD/安規要求進行設計與調整。 4.量產導入：支持 EVT/DVT/PVT 全流程，協助產線測試治具規劃與量產品質控制。 5.跨部門合作：與機構/軟體/系統工程師協作，加速新產品開發

• Design, develop, code, and debug BMC\Firmware by applying knowledge of server hardware architecture and system design. • Review and provide strong feedback on firmware and software architecture specifications and design specifications. • Layout and establish design documents with the engineering team • Study computer motherboard and BMC system specifications and configuration requirements to plan and develop reliability and compatibility • Plan and execute reference code and collateral • Participate in key product development and technical teams • Participate in new platform power-on events • Engage various cross-team validation organizations.

Overview: At Ubiquiti, our mission is to rethink IT—not just by making powerful networking technology more accessible, but by delivering frictionless product experiences tailored to our users. This pursuit begins at our R&D Center in Taiwan, where we not only build innovative products, but a culture of trust, transparency, and collaboration. Responsibilities - 5~8 years’ work experience as a Key EE designer for VoIP, Conference, Mobile, or Tablet products. - Mainly focus on system schematic review and mechanical stacking review with mechanical engineers and PCB layout review with layout engineers. - Work with Audio, ME teams to figure out performance issues of radios and work with SI and DQA engineers to qualify features and make sure product quality is ready to move further. - Review design derating and suggest design update due to DFM (design for manufacturing), DFA(design for assembly), and DFC (Design For Cost). - Schematic and BOM maintenance and review. - Write test plans for testing coverage, execute tests, and document test results for projects. - Report projects’ status and issue tracking to the internal team. - Teardown and review new products in the market. - Participate in the hardware design and system architecture of VoIP products, including ATA devices, IP Phones, and voice-enabled access control systems. - Design and implement audio circuits including CODEC, I2S, SLIC/SLAC, analog amplification, echo cancellation (AEC), and noise reduction (NR). - Integrate Ethernet/PoE, USB, SPI, UART, I2S, TDM, and other communication/audio interfaces. - Collaborate with the software team to implement and debug Android/Linux audio drivers, HAL layers, and power control strategies. - Support low-power design techniques such as Dynamic Voltage and Frequency Scaling (DVFS). Minimum Qualifications - Have the MP experience with VoIP, Conference, Mobile, or Tablet products. - Solid knowledge of audio hardware design and VoIP communication protocols (SIP, RTP). - Experience with Android and/or Linux system integration for embedded hardware platforms. - Familiarity with high-speed signal design. - Solid knowledge of audio hardware design and VoIP communication protocols (SIP, RTP). - Experience with Android and/or Linux system integration for embedded hardware platforms. - Proficiency in using OrCAD Capture CIS, Power PCB viewer, and Allegro viewer - Knowledge of electronic components (Ex, R/L/C/Diode/MOS/BJT/Logic ICs/Sensors) - Strong knowledge of ESD, EMI, and Surge. - Debug skills with the basic operation of oscilloscopes and logical analyzers. - Strong knowledge to support the thermal solution. Preferred Qualifications - Experience with DVFS implementation and system-level power optimization. - Background in developing products such as SIP intercoms, IP Phones, VoIP gateways, or voice-enabled control terminals. - Proficient in diagnosing audio issues such as echo, feedback, and electrical noise. - Experience integrating ALSA, PulseAudio, or Android Audio HAL layers. - Leadership in projects - Aggressive, open-minded, and positive attitude - Familiarity with the network configuration - Familiarity with test equipment like TDR, Network Analyzers

職務介紹： 做為一名硬體研發工程師，您將負責產品評估、硬體規劃及設計，Layout佈局及走線檢查，電子電路訊號量測及除錯系統設計，零件料號申請、BOM表建立與修改，以及專案技轉量產，品質分析等。主要產品為Intel /AMD Server, x86 Motherboard, ODM專案等產品開發。 職務匯報： 此職務會匯報於研發主管 主要工作內容： 1. 電子電路之研發，新產品設計，硬體除錯，良率提升等工作 2. 硬體線路及工程樣品製作 3. 研發新產品，改善現有產品，改善作業流程 4. 與客戶或公司的硬體部門的同仁共同研發或解決問題 5. 舊專案維護或改良，BOM變更與維護 人才需具備： 1.工作經驗：3年以上Server/PC/Notebook相關產業x86硬體研發經驗為佳 2.學歷要求：大學、碩士 3.科系要求：電機電子工程相關為佳 4.語文條件：英文(讀:中等、寫:中等) 5.擅長工具：擅長OrCAD, Allegro 等EDA軟體、Microsoft Office 軟體和示波器、電表等儀器之操作 6.工作技能：電子零件及電子線路解析能力 7.其他條件：細心、思考靈活，積極主動，良好的溝通能力，富有團隊合作精 神以及強烈的學習意願也是我們重視的條件。

你將在高速成長的網通產品事業單位中，扮演關鍵技術領導角色，負責Server主機板的核心設計與研發，推動創新並打造高效能解決方案。 職務內容: 1. Server主機板電路設計：主導高效能主機板的電路架構設計、原理圖繪製與Layout指導，確保設計品質與效能。 2. 技術領導與設計審查：擔任專案技術負責人，引領設計方向、進行技術審查與風險控管，確保專案技術決策正確。 3. 產品驗證與技術問題解決：負責產品功能驗證、測試與故障排除，持續提升產品穩定性與可靠度。 4. 商品化與設計優化：推動產品從設計到量產的轉化，並持續優化設計以提升品質、降低成本。 5. 專案管理與預算控管：掌握專案進度與資源分配，有效控管開發成本與預算，確保專案如期達標。 【我們在找的人】 一位對技術充滿熱情、具備深厚硬體設計經驗的工程師，渴望在Server領域發揮影響力。這個職務不只是執行者，更是技術的引領者，能夠在複雜挑戰中找到創新解法 ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

NVIDIA is seeking an outstanding Lead Design Engineer to join our team. In this role, you will collaborate with other key design teams to develop NVIDIA’s next-generation products including GeForce, Virtualization, Datacenter, and Automotive products. We have crafted a team of exceptional people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of AI computing. Are you passionate about technology enabling growth in AI markets and want to change the world? Then apply now to join NVIDIA! What you will be doing: -Design responsibility for the creation of new products designed around our GPUs, DPUs, and CPUs to cover Graphics, Self-driving platforms, and Data centers. -The LDE is responsible for driving every aspect of design execution, initial testing, bringing, and managing the documentation required to release the product to manufacturing and partners. It also serves as the primary interface to the Silicon/Thermal/Mechanical/SI/EMC engineers. -The scope of the LDE role has been carefully tailored to allow these individuals to consistently deliver world-class product quality on a challenging schedule while applying great attention to detail and quality of execution. -Research the new feature/circuits/architecture and involve the establishment/discussion of industry standards, then implement them in the next-generation product/platform development. What we need to see: -BS/MSEE and 3+ years of board/System design experience -Knowledgeable in high-speed signal design rules and power design methodologies -Proficiency in digital/analog circuit simulation and fault diagnosis. -Proven ability to deliver complex projects from specification through to production. -Your work displays your passion for circuit development and strong problem-solving skills. -Strong communication and Critical thinking are required. -Deep system knowledge of at least 2 areas: Switch tray /Computer tray/Datacenter architecture development or PC/Graphics/Automotive product development. Ways to stand out from the crowd: Experience in high-speed interconnection technology in switch tray development. Proficient in IB/Ethernet switching chip system design and bring-up. Successful Candidate will possess the following traits: Can-do attitude; Critical thinking; Leadership; Ability to learn complex concepts in a fast-paced environment; Strong desire for creativity; Strategic thinking and good decision-making skills; Good interpersonal skills. NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most brilliant and talented people on the planet working for us. We welcome candidates from all backgrounds and are committed to building a diverse and inclusive team. If you are creative and autonomous, we want to hear from you!

1. X86及 RISC系統之功能測試、產品整合測試、壓力測試、軟硬體相容性測試、效能測試 2. 規劃測試計畫、收集問題資訊、撰寫測試報告 3. 系統 BOM 建立 4. Cable routing 5. Panel ; Touch Panel ; Thermal printer 等周邊設備應用 ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

Immersive Optics System Engineer / AR VR Engineer ⭐有機會達到百萬年薪!歡迎對外商感興趣的你，保障年薪13.5個月⭐ Responsibilities: Provides expert knowledge regarding the selection, evaluation, qualification and procurement of visual system in different varieties of display size applications. Collaborates and communicates with internal and outsourced development partners about design requirements, regulatory requirements, and user needs. Participates as a member of project team of other engineers, Program Managers, and internal and outsourced development partners to develop reliable, cost effective and high-quality solutions for the immersive visual system products. Experience on NPI and manufacture process. Familiar with display industry production. EE experience to bring up the display system (including MIPI / Vx1 / eDP etc…). To review the EE design with supplier and system designer. Knowledge of HDMI and DP. Education and Experience Required: MS in Display Engineering, Materials Science, Optical Engineering, Physics or related field and/or equivalent experience. Typically 5+ years experience, with 3+ years at related field. Knowledge and Skills: Solid knowledge in different form factor product. Such as VR/AR, Monitor, TV, AIO etc. Display design (Array / FEOL / BEOL) and quality control Display system hardware design. Basic knowledge of Geometrical optics and Optical imagery. Camera ALS / Proximity Sensor Depth sensing (Structure light/TOF) Good communication skills in English and Mandarin with ability to work under pressure. Proven track of record on development and implementation of innovative LCD, AMOLED, or other display solutions for consumer electronics. Experience with at least one of the focus areas of visual system technology below: -VR display system (Panel + Lens) -Video passthrough system (Dual camera + ISP) -AIO touch monitor system -IWB system -SLAM system (camera + sensor fusion)

基本元素 1.產品研發進度追蹤、開發之溝通與協調。 2.物料選型、索樣及承認。 3.樣品製作，驗證，測試及問題解決。 4.新產品電路設計及研發。 5.製作產品文件說明書。 6.生產線導入與量產後技術支援。 7.部門交辦事項 必要元素 1.對產品設計工作有高度熱情跟創意。 2.善於溝通與團隊合作，並著重專案執行。 3.積極主動、有企圖心、負責任。

Are you passionate about AI, robotics hardware design, or the physical realization of cutting-edge technology? Do you want to physically build the core hardware that defines future intelligent devices? KBay Consulting is looking for an innovative AI/Tech/Robotics Hardware Engineer to join our dynamic team. If you're eager to translate abstract AI concepts into reliable, efficient physical hardware solutions within the fast-evolving tech landscape, this opportunity is for you! ________________________________________ Responsibilities: • Participate in the hardware system design, development, testing, and validation of AI, robotics, or technology-related products. • Responsible for circuit design, PCB layout, component selection, and vendor management. • Collaborate closely with cross-functional teams (including software engineers, mechanical engineers, and project managers) to ensure seamless hardware-software integration. • Conduct hardware performance tuning, diagnostics, and troubleshooting. • Write hardware design documentation, test reports, and technical specifications. • Continuously learn and explore emerging hardware technologies, applying them to projects. Qualifications: • Bachelor's degree in Electrical Engineering, Electronic Engineering, Control Engineering, or a related field (Master's degree preferred). • Strong understanding of analog/digital circuit design principles. • Basic programming skills (e.g., C++, Python,ROS2) for hardware control or testing. • Strong interest and passion for hardware applications in AI/robotics and emerging technologies. • Experience working with software. • Excellent problem-solving and analytical skills. • Strong teamwork spirit and good communication skills. • Fluency in both Chinese (Mandarin) and proficiency in English are required. Salary & Benefits: • Salary commensurate with experience • Benefits Package: Includes commission/profit sharing

Why Join Us? / 為什麼加入我們？ • 與來自全球的客戶合作，工作充滿國際視野 • 深入瞭解各國貨幣安全特徵，參與專業軟體應用 • 有機會出國出差，提供現場技術服務與培訓 • 在專業領域持續成長，累積跨國技術經驗 What You’ll Do / 工作內容 • 提供專業、迅速的技術支援（主要透過英文 Email 與即時通訊） • 使用公司軟體，為不同國家客戶客製化鈔票模板 • 撰寫技術文件、FAQ 與維護指南 • 海外出差支援技術問題並執行教育訓練 Who We’re Looking For / 我們希望你… • 英文溝通流利（加分：會其他語言） • 樂於學習各國貨幣與新技術 • 能適應短期國際出差，並樂於與不同文化的客戶互動

1.硬體線路設計、驗證及除錯 2.評估零件與規格，選用適合零組件 3.PCB Layout評估規劃 4.配合軟韌體工程師開發硬體 5.獨立作業及跨部門協調整合 薪資將依個人學歷、經歷及專業能力做為核薪依據。

工作內容 1. PCB電路設計 Layout 2. MCU程式開發撰寫周邊硬體連結的設計 3.做波形訊號量測驗證 條件要求 工作經歷：5年以上 科系要求：電機電子工程相關、電機電子維護相關 擅長工具：MCU 工作技能：韌體工程開發、電路板佈局規劃、PCB Layout軟體操作 其他條件 1. 具PCB電路設計Layout及MCU程式開發撰寫經驗 2. 熟悉基本電路設計,可繪製電路圖。

我們是 EGNAS，專注於打造嵌入式數位儀錶的技術型公司，結合 Linux 系統、高效能硬體與車規設計，為商用車與特殊車輛提供可靠的解決方案。前代產品已成功導入多款車型並投入實際量產，現正邁入新一代數位儀錶的開發關鍵期。 如果你熱愛智慧移動工具，對電動車、自行車、重機或工業車輛的技術充滿熱情，並擁有電子電路設計與量產導入經驗，歡迎加入我們的核心研發團隊，共同打造從零開始、實際落地的產品！ 【主要工作內容】 負責嵌入式數位儀錶的電路設計、驗證與量產導入，工作範圍涵蓋從產品研發初期的設計到後期生產落地，包括： 【嵌入式硬體架構設計與整合】 ・具備 MCU / MPU 系統架構理解，熟悉嵌入式應用電路設計・熟悉車用電子設計規範（如：安規認證、EMC／EMI 解決方案）尤佳 【電路設計與 PCB 佈局整合】 ・使用 Altium Designer、OrCAD、Allegro 等工具進行電路圖設計 ・進行 layout review、多層板設計、高速訊號線佈局 ・建立並管理 BOM 表，配合產品結構整合需求 【硬體電路驗證與測試】 ・執行 Power / Signal Integrity / 功能驗證等測試 ・能進行手焊件作業，熟悉基本儀器操作（如三用電錶、示波器、函數產生器） ・具備設計基礎測試設備（如測試治具、測試台）能力尤佳 【跨部門與對外協作】 ・與軟體、PM、工業設計、機構設計與外部協力廠合作，整合電子零件規格、廠牌型號與成本考量 【產品維護與量產支援】 ・協助工廠樣品打樣與量產導入，處理產測問題 ・維護與優化既有產品電路設計，處理生產端突發狀況並提升良率 【文件撰寫與技術傳承】 ・撰寫設計與測試相關技術文件、維修手冊、操作說明等 本職務將直接參與公司核心產品的硬體設計與落地過程，橫跨嵌入式電路設計、測試驗證、量產整合與跨部門協作等多個環節。你將不只是做設計，而是能全程參與一個產品從無到有、從樣品到量產的技術實現之旅。這份工作非常適合希望技術能力持續深化、對最終產品品質與完整研發過程有責任感的工程師。 我們提供 保障年薪制度、彈性信任的工作環境，以及與核心技術團隊共事的成長機會。期待有志之士與我們一同推動智慧移動領域的創新與實現。

FIH作為全球移動通訊設備領導廠商，持續擴展多元商業機會，跨足通訊產品生產製造、自動化機器設備研發、車載軟硬體整合研發等類別。我們相信-創新源於開放的思維和無限的可能性。我們追求的不僅僅是技術的突破，更是一個共同創造的過程，園區智能生產線連接著各個環節，我們的產品從零件到成品，都經過嚴格的品質控管，確保最優質的創新產物。 我們歡迎不同背景、不同專業領域的人才加入我們的團隊! 【主要工作職責】 1.負責AI行動裝置,手機與物聯網（IoT）相關產品之電子EE電路設計與研發。 2.執行EE基頻功能測試與問題除錯，確保產品性能與穩定性。 3.持續追蹤並研究基頻領域之新興技術，導入創新解決方案以提升產品競爭力。 4.與製造端協同合作，參與試產與量產計畫，並推動良率提升與製程優化。 5.跨部門協作並與客戶進行技術溝通，確保專案需求準確落實並維持良好合作關係。 6.其他主管交辦相關工作任務。

⚫ Design server system and relative boards and review high-speed PCB layout. ⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Come out test plans to ensure base function of hardware. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management topology. ⚫ Support manufacturing teams during the production phase.

1. 按市場需求進行充電樁用電路設計開發 2. 遵照安規標準，執行產品設計、分析與驗證 3. 問題追蹤與分析，並修正改善 4. 製作工程樣品，並提供測試驗證報告 5. 驗證是否符合相容性與安全規範，並因應修改設計 6. BOM表建立與確認 7. 選用電子零件 8. 評估並驗證工程設計變更 9. 產品開發進度管理 10. 配合生產導入相關工作 11. 其他主管交辦事項