PDE Technology development Engineer
- 台中市后里區
- 經歷不拘
- 大學
Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/PDE-Technology-development-Engineer_JR46913 Micron’s Assembly Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end , bonding and back end) for Micron’s memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are every day responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An important topic is the path finding of innovative package technology : Deep fundamental understanding of the key risks in Bumping and Flip chip/ TCB technologies. Actual experience with HBM, FOP(Fan Out Package) and WLCSP is a plus. Finally the hands on integration experience in Pkg Assembly and WL package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems. JOB REQUIREMENT Experience needed : < 3 years' experience in semiconductor industry. Family as development experience of Photo, Wafer bonding, wafer de-bonding, and die stacking TCB/ FC process are better. Education level : PhD/Masters Degree in Electrical & Electronic, Material, Mechanical, Chemical Engineering, Physics & Applied Physics, or Equivalent Work Experience Required