5/03 功率模組設計與模擬分析工程師
- 能創半導體股份有限公司
- 半導體製造業
- 新竹縣竹北市
- 2年以上
- 碩士
1. Perform 2D drawings and 3D modeling of module design and give recommendations on layout optimization based on performance requirements. 2. Using FEM simulation tools to perform analysis to meet the electrical, mechanical, thermal, reliability, cost and customer's requirements 3. Comparison from chip, package and subsystem level characterization, data analysis, qualification, failure analysis, root cause analysis and benchmarking 4. Develop and standardize simulation methodologies, improve process efficiency by automation and validate models with measurement results. MUST 1. Master's Degree in Mechanical, or another related field of Engineering above 2 years working experience 2. Structured way of thinking and working with ability to identify problems and find appropriate solutions 3. Experience in using CAD tools (AutoCAD/Solidworks/ProE/CATIA..etc) or FEM tools (COMSOL or ANSYS..etc). Nice to have 1. Experience with IC, power packaging and power module design and simulation 2. Knowledge and experience of power device (ex: Si IGBT/MOSFET/SiC MOSFET) 3. Language skills: good reading/writing/speaking skills in Mandarin and English 4. Experience in improving reliability, yield, cost, performance, FMEA and AEC-Q101/AQG 324.