Job Description
As a member of the Workstation R&D lab team, you will be responsible for leading entry workstation thermal development and integrating the motherboard, components, and accessories into world’s best workstation solution. The successful candidate will have a proven track record of delivering performance platforms with low cost, good quality and on schedule.
Duties include:
· Work cross-functionally with architects, ID, EE, procurement, quality and supply chain to deliver high quality chassis and thermal solutions against aggressive cost and Time-to-Market goals.
· Collaborate with other HP business unit or external partners to explore and realize leverage opportunities for thermal solution development
· Design and develop products using broad engineering concepts and through directing and providing technical consultation to ODM.
· Perform platform thermal design, integration and reliability testing
· Develop platform thermal and acoustic validation plan, issue tracking and resolution
· Develop fan control algorithms and ensure that it gets implemented correctly
· Lead the thermal development communication and issue troubleshooting where engaging cross-functional teams is the norm.
· Oversee off-site shock and vibration testing. Where there is an issue, work with ODM and internal functional experts and take ownership for issue resolution
Education and Experience Required:
· Bachelor's or Master's degree in Mechanical Engineering.
· Typically 5-8 years experience.
Knowledge and Skills:
· Track record of great sense of ownership, proactive attitude and being a team player
· Strong interpersonal skills to influence
· Experience in developing chassis and thermal solution for high performance computing systems
· Experience in studying SIO spec and developing fan control algorithms based on it
· Using ProEngineer or other 3D CAD software as a mechanical design tool.
· Using CFD and thermal mockups to validate thermal solution.
· Knowledge for shock & vibration issue debug and solution implementation
· Experience working with both Asian ODMs and US team
· Excellent written and verbal communication skills. Fluent in Mandarin Chinese and good command of English
· Ability to establish clear goals and formulate plans to achieve them
· Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.
