***本職缺將安排完整的教育訓練*** 一、講座教育訓練(系統構成、機台構成、作業SOP) 二、實機教育訓練(操作教育、OHT台車調整教育、軌道檢查教育、電源盤調整教育) 【工作內容】 1.入廠設備調整機台、確認機台運作及執行狀況。 2.進行機台設備異常排除、分析、位置調整等。 3.提交工作進度報告、回報工作狀況與進度。 4.客戶機台生產參數調校設定。 5.其他主管交辦事項。 6.維持顧客滿意度。 7.工作地點依據客戶所在地調動(各科學園區)-提供出差、視情況提供住宿津貼。 8.須爬高、蹲低、進入機台內部作業 【其他條件】 1.個性需積極、細心、負責、配合度高。 2.具半導體或光電產業設備工程師或客服工程師等經驗佳，無亦可，人格特質重視。 3.可配合在無塵室內工作(著全套無塵衣)。 4.可配合任務性調度。 5.可配合設備導入常駐客戶端工作。 6.語言無特殊要求。 7.具有基本看工程圖面能力佳，沒有也沒關係。
-協助工程師於客戶端進行新機移機、裝機、調驗機作業。 -培養新鮮人成為獨當一面工程師。 -無塵室作業,需長時間穿著無塵服,站立走動。 -需配合加班以及出差 (加班費優於勞基法)。 歡迎理工科畢業新鮮人!! 歡迎有相關工作經驗者,薪資可議!! 職缺優點: -不需輪班 -表現優異者優先提供晉升管道(成為正職社員) -滿一年調薪 -三個月發放一次季獎金 -獎金最高可領4個月 歡迎有意應徵者投遞履歷，經審核後符合資格者會在與您連絡，謝謝 本公司將於2/8-2/14春節休假 歡迎找工作的朋友先投遞履歷 開工後會陸續審核通知，請勿重複投遞! 祝福 新年快樂 龍年行大運
【年薪可達16個月或以上(年終+績效+紅利獎金)】 在欣陽，你學會的不只是設備維修，你學會的是"一技之長"，即使日後不是在欣陽服務，這項維修技能，也會跟著你一輩子，永遠受用。 工作內容: 伺服馬達維修 減速機維修 驅動器維修 技術文件撰寫 維修SOP建立 製程良率改善 本職缺享 就任獎金-任職三個月期滿且通過考核：NT$ 4,000。 就任獎金-任職六個月期滿且通過考核：NT$ 5,000。 需大學、四技、專科以上，電機、電子、光電科系畢業，無經驗可
Artilux is currently looking for a Testing & Validation Engineer to act as a position agent on a one-year contract. The candidate will closely collaborate with cross-functional teams from the design phase through product launch, ensuring that our testing and validation procedures meet the highest standards of product quality and performance. Roles & Responsibilities： • Make plans and outline details to test the optical module and IC • Work closely with RD, EE, FW, SW, and Optics teams throughout the test development process • Perform the test. Analyze the test results and write the test report • Summarize test results and propose product improvement suggestions * This position welcomes applications from second-time employment(二度就業者) or engineering assistants(工程助理職人員) with the above-mentioned relevant experience to challenge. * Salary payment is the same as for full-time employees. If the performance is outstanding, the contract may be extended or converted to a permanent position depending on the circumstances.
1. Flip chip package substrate design. 2. Capable provide optimization design proposal. 3. Capable to co-work with substrate/material suppliers directly. 4. Design rule maintenance. 5. Work closely and Interface with various teams (product, PE group and supplier…etc) 6. A plus for Good command of written and oral in English.
【職缺類型】 此職缺剛開始合約為8個月，依工作表現最多可沿簽至2年。 The Design Verification and Testing (DVT) organization within QCA is responsible for verifying system-level performance of reference designs with leading-edge wireless IC technologies. Tests currently encompass TX and RX RF evaluation including NXN MIMO performance, under an extensive number of conditions. 【Responsibilities】 The role involves hands-on DVT evaluation of reference designs in a controlled environment, working closely with other DVT engineers and lab technicians, driving data gathering and consolidation, and presenting results to engineering teams. 【job description】 1. Utilize internal automation tools to verify system-level performance of WLAN reference designs 2. Conduct DVT entry reviews in preparation for DVT 3. Generate DVT exit review material and conduct data reviews for engineering team 4. Generate DVT reports for internal and external customer release 5. Be responsible for integrity of DVT data. Address discrepancies promptly and verify solution 6. Contribute to internal DVT standards and procedures 7. Identify and enable new test capabilities using solid scripting/programming skills 8. Work with lab technicians to design and implement new test setups as needed 9. Provide timely feedback to the engineering teams with regards to progress and status of DVT 【工作福利】 1. 報到即享有年假。 2. 全薪病假15天。 3. 生日/新年/端午/中秋禮金
1. 雙束型聚焦離子束(FIB)相關建置及委託服務業務。 2. FIB相關技術開發 3. TEM試片製備及技術開發。 4. 基本TEM量測觀察 5. 學習相關材料分析設備。 6. 主管臨時交辦事項。
Responsibilities 1. Develop for automation in Unix/Linux environment (1) Python, TCL, shell script, perl 2. Develop, maintain and enhance ASIC design infrastructure (1) Version control, testing automation, … (2) EDA Tool maintenance and license management 3. Work with EDA vendors to (1) Evaluate new tools and flow (2) track and resolve tool issues 4. Install, configure and support foundry PDK
Role Introduction: • We are looking for talented mechanical engineer who has experience in mechanical system design of process machine. • You will become team member of DSC product engineering team, your responsibility is to demonstrate your design skill to fulfill any requirements of product development. • You will be working in an international working environment. We expect the candidate is fluent in English, with mature communication and teamwork skill for better efficiency. Your mission: • Demonstrate your design skill for designing and optimizing the mechanical module of the DSC lithography process machine. • Possess strong DOE ability for system error analysis and execute test plan. • Involved in NPI project to MFG team for new system, feature and technology. Perform trouble shooting, technical support and process improvements to fulfill the goal of production output. • Involved in CIP and maintenance project for mature product. • Initiate and validate engineering changes and familiar with ERP system for document management. • Strong mindset and experience of risk assessment, cost evaluation and cross function cooperation.
The position is accountable for supporting Production at SUSS MicroTec Taiwan to ensure an efficient and trouble-free operation. The job requires the design of complex mechanical assemblies and equipment, the creation of mechanical drawings and creation of parts-lists (BoM). A good understanding of mechanical systems is mandatory. In depth knowledge of a mechanical CAD System is essential for reaching the objectives of this job successfully. Tasks: • Design tasks for devices and equipment for semiconductor manufacturing • Design according to customer’s configuration and specification • Creation of drawings, documents, parts lists and materials in SAP • Production support in the assembly, purchasing support for technical queries • Creation and technical evaluation of self-developed concepts and designs • Creation of risk assessments, assembly and installation instructions, calculations and designs • Involved in ECR (Engineering Change Requests) and CIP (Continued Improvement Projects) • Design must be in compliance with national and international regulations and standards. • Communicate with our counterpart-location in Germany. • Other tasks are assigned by your supervisor.
1. ESD保護元件設計 2. EOS/Surge保護元件設計 3. 積體電路系統ESD防護設計 4. 協助RD處理製程問題、與製程廠聯繫、以及Tapeout，MT Form等相關事宜
This position will be based in Zhubei, Taiwan and report to the Ext MFG BE Process Integration Engineering Manager. The Principal Process Engineer will be responsible for improving all package quality, process, and system at external subcontractors for onsemi. This position will work closely to across internal teams and external subcontractors to execute on the following, • Lead for subcon improvement program. • Lead for task force team of process & quality improvement either for External Manufacturing site or internal systems. • Lead and communicate with BU / customers for program/project/task. • Cooperate quality goal and EFAR reduction achievement. • EFAR & SQIN root cause finding and corrective / preventive actions implementation. • Subcon Process robustness and risk mitigation • BKM fan out and deployment. • Subcon audit Additional responsibilities include, but not limited to, the following, • Continuous improvement activities encompassing yield and scrap performances. • Operation improvement activities via quality, delivery and cost reduction projects • Production support such as maverick material verification and disposition • Execution of qualification for all change management projects involving process, materials, equipment and systems • Supporting customer audit Keys to success will include strong analytical skills, familiar to statistic tool/software application such like JMP, experience in PKG assembly & Test operations, effective communication skills, and an ability to work with cross-functional and cross-organization teams.
1. 發展雲端運算核心技術、提供雲端化服務與自主雲端開發工作。 2. 負責雲端、虛擬化與容器化運算自主服務主機系統管理與開發。 3. 負責雲端運算系統相關效能量測與問題排解。 4. 協助新穎高效能運算加速技術與整合容器化評估與運用。 5. 協助中心任務執行與主管交辦事項。
1.參與晶片驗證，建置系統測試平台以推動產品量產 2.規劃、開發、量測和執行測試以驗證晶片上的特定介面。開發晶片診斷軟體和驗證工具來執行characterization，以確保符合規範標準． 3.尋找晶片和系統級問題的解決方案。 4.調試與邏輯設計和訊號完整性相關的 ASIC 和電路板問題。 5.分析釐清系統/驅動程序/固件/平台相關問題並縮小軟件/硬件問題範圍跟踪問題狀態並積極與團隊溝通。
1. 嵌入式非揮發性記憶體產品 (e-NVM IP)測試程式開發與測試環境建立 2. 嵌入式非揮發性記憶體產品功能 特性測試與驗證 3. 嵌入式非揮發性記憶體產品電性故障分析
1. 電路圖繪製，佈線、佈排 2. 掌握案件進度 3. 依客戶需求完成案件 4. 具良好團隊合作精神與內外溝通能力
1. FT 新產品導入跨機，FT handler trouble shooting 2. 熟EPSON或HONTECH handler 3. 組員安排管理及機況回報 4. 跨部門溝通協調
1.為μLED laser sorting 機台開發 AI Algorithm及程式 2.開發μLED laser機台所需之Firware 3.光路模擬及光路設計for μLED laser sorting機台開發 4.開發無殘膠之Laser transfer-able材料 5.Vertical μLED 設計開發
1.半導體設備裝置組立 2.半導體設備裝置調整 3.半導體設備裝置檢修 4.半導體設備裝置測試 5.半導體設備裝置PM 6.需至客戶端進行service應對 7.需在無塵室作業 8.On call值班(每月平日1週與每月假日1-2日) 9.視情況配合加班 10.因應客戶需求職務調動(新竹/台中/台南/高雄) 11.其他主管交代指派工作 12.需有工安證照 13.如無法配合職務調動者，請勿投遞履歷 14.面試地點：台南科學園區 / 新竹科學園區 本職務更新為每周一次，請直接投遞，謝謝。
Key Responsibilities: Field application support of bonding systems to customers in Taiwan • Conduct and complete final acceptance test at customer site. • Establish process and qualify SUSS bonding systems with customer. • Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions. • Provide both on-site and remote applications support to customers. • Participate in customer meetings and maintain positive relationship with customer contacts. • Provide expertise and advice to SUSS bonder business unit to help product improvement. • Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development • Learn new products through daily work and training events; is required to attend training events upon arrangement. • Take ownership of application projects assigned by supervisor. • Other tasks are assigned by supervisor
- 測試程式開發、驗證與改善 - 新產品導入 - 良率觀察、分析與改善 - 提升生產效率 - 有 tester application經驗尤佳
1.新產品開發導入 2.客訴處理 3.客戶稽核應對 4.客戶特殊需求support ◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
1.新開發專案評估執行 2.新技術資源收集及整理 3.Bumping 製程作業 【薪資說明】 ◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。