3/28 MD Engineer
- 智易科技股份有限公司
- 其他電信及通訊相關業
- 印度
- 3年以上
- 高中
Skill: 1.Skilled at 2D ACAD & 3D Pro E Creo 2.Mold flow analysis reading and judgement Experience: 1. Field expertise in mechanic engineering, mold engineering and related engineering disciplines. 2. 3-5 years experience in 3C product, especially with a focus on network communication product. 3. 3-5 years experience in mechanical design, or mold manufacture and design. 4. 3-5 years experience in package design, or package manufacturing. 5. Familiar with plastic tooling structure, molding knowledge or package design. 6. Job assignment for onsite work at the India factory and with suppliers. Language: 1.Fluent in English 2.Knowledge of Chinese is a plus