1. Baseband 硬體設計驗證(Power/Analog/Digital/Interfaces/Peripheral) 2. 各類網通相關新方案(有線/無線)設計、評估、整合及技轉。 3. 新產品開發及實驗結果分析及開發文件產出。 4.

1. 負責商用網通AP/Controller/Gateway產品硬體開發、驗證 2. 根據產品規格執行線路設計、Layout review、BOM 產出 3. 進行產品bring up、debug、驗證、導入量產 4. 偕同跨部門合作、解決產品問題 5. 確保產品品質、成本最佳化及時程 6. Review ODM廠提供的設計文件與測試報告

a.車用infotainment CPU and 5G C-V2X無線通訊模組硬體整合設計, 設計系統架構、Power Distribution. b.提供Layout guideline, Review Layout c.研擬系統驗證計劃、系統驗證測試及Debug d.協助產線將產品導入量產, 改善良率及分析不良品

a. 接CM case 車用infotainment CPU and 5G 無線通訊模組硬體導入量產 b. 接JDM 修改測試系統及產品schematic並導入量產 c. 提供Layout guideline, Review Layout. d. 研擬系統驗證計劃DVT、DVT(系統驗證)執行及Debug e. 協助產線將產品導入量產, 改善良率及分析不良品 f. BOM的建立,零件料號建立

. - Solid knowledge and experience with Digital HW/baseband system and board level design. - Knowing how to use Sigrity

1. 硬體電路設計, 各項規範 及 EVT/DVT 測試 2. 新系統電路設計或是通訊標準的研究與開發 3. 協助EMI/EMC 認證測試 4. 指導新進人員或其他工程師, 學習新功能及規範測試 具無線 WiFi 、Baseband 硬體研發經

1. 負責Baseband電路及電源電路設計、電路板佈局及專案執行。 2. 負責產品規格測試、除錯、試產及法規認證。 3. 電子元件評估與選用。 4. 分析客戶需求及建議合適的硬體。 5. 與Layout工程師、結構工程師溝通及協調，並完成電路、

我們正在尋找對硬體設計擁有熱情與專業的電源／基頻工程師，對電子硬體設計與系統整合開發有興趣的夥伴，一同參與產品從設計、驗證到量產的完整開發流程。 ##基頻工程師職務說明 1.負責 MCU/FPGA 週邊電路及介面設計(Memory、GPU、Ethernet、ADC/DAC、Clock Tree 等) 2.熟悉 I2C、SPI、USB、PCIE等數位介面規範 3.BOM 維護及電子元件評估與選用 4.與EE工程師、Layout工程師、結構工程師、散熱工程師溝通、協調並完成電路、佈局設計及確認 5.電路板測試驗證、除錯檢討、量產測試規劃、及解決製程相對應問題 6.執行產品研發流程及技術文件產出 7.與品保及合規人員完成可靠度及環境測試規劃 8.協助系統規劃、整合、測試、分析與除錯 ##技能需求 1.熟知電路學、電子學基礎知識 2.具 Analog / Digital 電路設計經驗 3.具 SI/PI 模擬經驗佳 4.具高速訊號量測經驗佳 5.具量產經驗佳 6.具EMI/EMC設計以及 debug 經驗佳 7.熟悉量測儀器使用(示波器、SA、NA) 8.具備基礎焊接能力 ----------------------------------------------------------------------------- ##電源工程師職務說明 1.負責板階及系統階電源電路設計及模擬(AC-DC/DC-DC/FPGA power/PMIC/保護電路) 功率管理、熱管理、效率優化及故障排除 2.板階及系統階 EMI/EMC 設計、抑制、測試及除錯 3.熟悉電力電子知識及相關安規資訊 4.BOM 維護、電子元件、電源模組評估與選用 5.與EE工程師、Layout工程師、結構工程師、散熱工程師溝通、協調並完成電路、佈局設計及確認 6.電路板測試驗證、除錯檢討、量產測試規劃、及解決製程相對應問題 7.執行產品研發流程及技術文件產出 8.與品保及合規人員完成可靠度及環境測試規劃 9.協助系統規劃、整合、測試、分析與除錯 #技能需求 1.熟悉電路學、電子學、電力電子基礎知識 2.具 Power 電路設計經驗 3.具 EMI 模擬、設計、除錯經驗 4.具量產經驗佳熟悉量測儀器使用(示波器、電子負載) 5.具備基礎焊接能力

(1)RTL coding for baseband design (2) FPGA implementation

1. 電子電路設計：熟悉高頻線路設計、MCU週邊介面 2. 天線效能評估：討論並審核供應商所提供的天線產品效能 3. 各國法規研究 4. 量產及支援：新產品導入量產，客訴問題分析

1.Circuit design and integration for BB and RF, and debug for processor. 2.Layout review for signal integrity, EMI improvement. 3.Customized function design for vehicle application. 4.System function validation and development DV/EV stage. 5.EMC , EQT for automotive grade, and field trial conducted. 6.Production line setup and maintain.

1. SAR ADC / Current steering DAC/ SDM ADC/ DAC related 2. Analog Baseband related

1. 協助專案PM/TM評估RFI/RFP，以提供客戶完整的Proposal。 2. 進行 5G 行動通訊 / 工業物聯網 硬體系統模組之研發與設計。 3. 與跨部門RF, MD, SW等共同合作開發與設計並提供相關技術支援。 4. 研擬系統驗證計劃、系統驗證測試及Debug。 5. 負責產品量產導入工廠和後續的良率提升與降低成本等計劃。

Baseband : 1. Based on the product requirement to develop HW circuit 2. Co work with layout engineer for component

1.主導產線 FA 與 客戶端 RMA的不良分析（含 Baseband / RF / 產線），撰寫分析報告與改善對策 2.具獨立分析線路圖與 Layout，能簡單進行信號量測與驗證，協助 RD 問題定位 3.協同 RD、PE、QA 等部門，釐清設

and Development of baseband analog/logic/digital circuit for wireless audio products. 3. Perform circuit integration,

BU Overview Consumer, network and datacenter applications change at an exponential pace and the Data & Devices (D&D) business unit at TE Connectivity is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative and fundamentally agile capabilities and conceive, design and manufacture to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products push markets and meet the ever-changing need of the evolving, more connected, data-driven world. We are enhancing the way we do business, focusing on the most important things and staying agile and responsive to the needs of a faster, more connected world. Job Overview As a Sr. Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry—targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: •Subject matter expert in signal integrity design, simulation and validation activities through product development cycles •Establishing signal integrity design performance/functional requirements for new products •Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. •Performing PCB design schematic and layout reviews •Creating actionable recommendations based upon design reviews and simulation results •Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: •Bachelor’s degree in Electrical Engineering, Master’s degree preferred •Minimum of 5 years of work experience in a signal integrity engineering role •Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables), &/or RF antenna, RF sub-system •Signal integrity analysis tools (Agilent ADS, Ansys HFSS) •A solid understanding of electromagnetic theory and electrical circuit behavior •Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. SixSigma methodologies or other strong data analytics background a PLUS. •Familiarity with printed circuit board design, fabrication and assembly. Proficient in Altium a PLUS •Experience in project leadership, especially as it applies across design, development & manufacturing teams •Excellent verbal and written communication skills •Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies •Individual must be highly motivated, a quick learner, and able to work independently

Architecture assessment, component survey, EVB verification c). ME/Thermal solutions Analysis & Verification d). Baseband Circuit

解碼模組設計 (channel coding/decoding) - 多天線、MIMO、或雷達相關訊號處理 - 通訊基頻信號處理 (communication baseband signal processing) - 通訊相關算法開發 2.

1. SAR ADC / Current steering DAC/ SDM ADC/ DAC related 2. Analog Baseband related 3. 據有類比整合相關經驗佳