Packaging Engineer, Senior (Hsinchu) (3055502)
- 新竹市
- 3年以上
- 大學
Job Description The Qualcomm Package Electrical Team has an opening in the areas of Power Integrity. The candidate will work with Package and IC designers to find ways to optimize the overall package design. The candidate will be responsible for development, implementation, and testing of Power integrity solutions for Qualcomm SoCs. The candidate will be expected to communicate with Design team and conduct design reviews. The candidate will perform Power Integrity simulations of Core rails at the Package level and ensure that they met the Power requirements. The candidate will be communicating with Chip and Board designers to perform the frequency and time domain optimizations. The candidate’s responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with Hard-Macro owners to understand the Specs for various IPs such as CPU, GPU, NSP, Modem, etc, and also with PCB designers to assess the impact of capacitance and its placement to the system level performance. This position offers the opportunity to work across multiple organizations such as Hard-Macro team, Chipset Power team, PCB team and PDN team and providing timely feedback and updating design guideline to the team is essential. The responsibilities will include but not be limited to the following: - Perform PDN Design of experiments to analyze the factors affecting PDN performance. - Perform Power Integrity simulations at Pre-layout and Post layout design phases. - Design and optimize Power Delivery Network across On-Die, Interposer and Substrate. - Work with Multi-functional teams to develop Package Droop target, design, and implementation of Package Power distribution network. - Provide technical support and debug while troubleshooting Package Power delivery. - Perform package extraction for the time domain and frequency domain analysis. - Provide design guidelines for the Package design. - Develop design & analysis flow and automate the process. - Create technical documentation and presentation. - Experiences in DDR, SerDes & Mixed signal interfaces are strong plus but not required.