瑞士商艾發科技股份有限公司台灣分公司

We deliver thin film process solutions in our core markets using competences in evaporation, sputter, PECVD and etch technologies. 1. ADVANCED PACKAGING Our UBM and RDL processes in Flip Chip, Wafer Level Packaging (WLP) and Fan- in/out Technologies running on CLUSTERLINE® 300 II and HEXAGON platforms deliver outstanding cost of ownership. Panel processing solutions on our new PNL Platform for FOPLP and advanced PCB manufacturing deliver high yield production solutions for substrate sizes up to 550x550mm, whilst SOLARIS is the perfect platform for wafer level EMI shielding processes. 2. PHOTONICS From AR coatings to Multibandpass filters, DBRs and TCOs, Evatec solutions using evaporation or sputter on BAK, MSP, CLUSTERLINE® RAD and SOLARIS platforms deliver precision layers for high performance optical interference coatings. Core competences in Advanced Process Control technologies using Broadband Optical Monitoring deliver new levels of quality and yield. 3. MEMS Know how in deposition processes for piezoelectric materials, aligned magnetics and dielectrics on a wide range of Evatec platforms according to your production needs enable technologies like Thin Film Heads, on chip inductors, sensors and actuators . Evatec's Advanced Process Control technologies enable new levels of yield in advanced manufacturing approaches including Wafer Level Optics and Microfluidics. 4. OPTOELECTRONICS Evatec delivers “damage free” thin film processes for LED technologies including GaN on Sapphire, GaN on Si and GaN on GaN . Ask us about high throughput deposition of current spreading layers like ITO, metal contacts and high performance reflectors (DBRs) on platforms like CLUSTERLINE® RAD for the new micro LED technologies too. 5. POWER DEVICES Our proven portfolio of Front and Backside metallisation and precision “lift off” processes enable Bipolar, MOSFET, IGBT and Wide Band Gap (WBG) technologies. Capabilities including thin wafer processing, in situ stress control and in situ ohmic anneal deliver enhanced yields and reduced process times. 6. WIRELESS COMMUNICATION Evatec’s comprehensive portfolio of deposition processes for metals, contacts and electrodes, piezoelectric materials and dielectrics enable device technologies including HBT on GaAs, HEMT Technology on GaN, IR devices and RF Filters ( SAW & BAW)