技鋼科技股份有限公司_技嘉集團

工作內容 產品運輸包裝設計(CARTON、緩衝材料、包裝袋..) 1.設計發想及棧板堆疊設計。 2.包材設計測試驗證。 3.包裝材樣品打樣、追蹤與確認 4.文件管理料件承認及BOM LIST表單維護。 5.包裝SOP撰寫、管理與異常分析處理。 6.客戶端及工廠端的工程技術問題分析與服務事宜。

產品資料管理

1.包裝生產規劃作業。 2.原物料的異常處理。 3.主管交辦事項執行 4.接受培訓

1.負責Server 硬體設計與開發 2.負責Server PCB Layout 規劃, 寫Layout guide 3.板上功能驗証、除錯 4.需跨部門與機構、熱流、韌體等部門相互配合開發

1. 電腦伺服器系統設備配線規劃設計/整合 2. 伺服器 CABLE ROUTING 規劃 3. Pro-E CABLE ROUTING 繪圖 4. 伺服器系統 BOM表製作,組裝 SOP 審核、撰寫、及其他相關作業執行協助

1.依據產品需求，擬定系統整合計畫與驗證項目。 2.系統整機之整合規劃。 3.系統硬體功能測試。 4.系統射頻(RF)功能測試。 5.線材與包材設計以及測試。 6.料件之料號申請與製作IQC檢驗報告。 7.建立專案完善Test Case(包含BOM、WI及檢測流程) 8.量產檢測技術制定與轉移。 9.研發問題反饋與量化，提出修改需求。

水冷大舉擴編徵才，歡迎有相關經驗者加入! 團隊職務有分兩種不同面向，會依據求職者專長，有適性的搭配並能夠發揮所長! A. L7/L10 水冷熱傳工程師 主要負責「水冷」伺服器產品設計與研發，內容包含： 1.前期熱傳模擬評估Flotherm (或ANSYS Fluent/Icepak 同等經驗) 2.熟悉3D繪圖工具Creo (或Solidworks 同等經驗) 3.新水冷模組開發，並與廠商討論設計(含供應商管理) 4.提供高覆蓋式水冷開發，和系統散熱解決方案 5.水冷伺服器測試，與系統架設(含實驗報告整理) 6.良好的團隊溝通與合作 7.完成主管交付事項 (參與每一世代的最新晶片規格，包含CPU/GPU/Networking) B. L11/L12 水冷熱傳工程師 主要負責Rack level 水冷架構規劃,與數據中心IT設備散熱規劃佈局，內容包含： 1.熟悉3D繪圖工具Creo (或Solidworks 同等經驗) 2.Manifold(CDM) 設計開發 3.CDU開發與規格定義 4.制定整櫃IT規格，以及規劃Rack Level散熱方案 5.管路的設計及優化(著重在水路系統) 6.規劃數據中心散熱應用 7.工廠水冷製程優化及新產品導入 8.良好的團隊溝通與合作 9.完成主管交付事項 (會經常與世界級客戶/廠商的會議交流，並有機會前往英日美歐等地出差，佈建數據中心) ⸻ We’re Expanding! Join Our Liquid Cooling Thermal Engineering Team. We’re growing our liquid cooling team and actively seeking talented thermal engineers with relevant experience to join us! We offer two distinct roles within the team, and responsibilities will be matched to your expertise and interests to ensure you can thrive and make the most impact. ⸻ Position A: Liquid Cooling Thermal Engineer (L7/L10) Focus: Liquid-Cooled Server Product Design & Development Key Responsibilities: • Conduct early-phase thermal simulation and analysis using Flotherm (or equivalent tools such as ANSYS Fluent/Icepak) • Design mechanical components using 3D CAD software such as Creo (or SolidWorks) • Develop new liquid cooling modules in collaboration with vendors (including supplier management) • Deliver high-efficiency liquid cooling solutions and complete system-level thermal designs • Support thermal testing and system integration for liquid-cooled servers (including documentation and test reporting) • Collaborate effectively in cross-functional teams • Execute tasks as assigned by management (Opportunity to work on the latest generation of CPUs, GPUs, and Networking chipsets) ⸻ Position B: Rack-Level Liquid Cooling Thermal Engineer (L11/L12) Focus: Rack-Level Liquid Cooling Architecture & Data Center Thermal Planning Key Responsibilities: • Design and develop thermal and mechanical components using 3D CAD tools like Creo (or SolidWorks) • Lead design and development of manifolds (CDM) • Define specifications and develop Coolant Distribution Units (CDUs) • Establish full-rack IT specifications and implement rack-level cooling strategies • Design and optimize cooling loops, with emphasis on liquid distribution systems • Plan and implement thermal strategies for data center infrastructure • Drive process optimization for liquid cooling production and support new product introduction (NPI) • Collaborate closely across teams and functions • Execute tasks as assigned by management (Regular engagement with global, world-class clients and partners; opportunities to travel for data center deployments in the US, Europe, Japan, and beyond) Don't hesitate to join our team!

熟悉PC硬體及相關週邊產品，具IPC經驗者尤佳。

熟悉PC硬體及相關週邊產品，具IPC經驗者尤佳。

1.More than 2 years IT sales experience in EU channel / SI 2.Familiar with embedded product (sales experienced with engineering background is preferred) 3.Being aggressive and fluent in French and German is a plus. 4.Well organization to sales target achievement and with commination skill for team work

1.主機板/系統上的軟/韌/硬體功能測試。 2.主機板/系統可靠度測試 3.主機板/系統相容性測試 4.主機板/系統壓力測試 5.系統機構測試 6.研發問題反饋至BUG系統，完善檢測流程。 7.設備、治工具管理。 8.撰寫測試報告 9.撰寫測試標準流程表。 10.編寫自動化程式、除錯、追蹤與修改程式碼以改善執行效率。 11.配合軟、硬體工程師，提供客戶解決方案。

RFQ文件評估 系統規劃 散熱模組設計 測試與報告編寫

1.IPC產品技術問題初步分析、技術支援 2.複製客戶反應的問題與內部溝通協調 3.替代料零件承認，業務送樣品之前功能測試 4.主管交代事項

1、新產品開發與規劃 2、產品修改 3、產品問題分析與除錯

1、新產品開發Layout Placement 2、產品修改Layout Modify,Gerber Out, 3、與板廠溝通及回覆PCB工程問題

1. BIOS開發、除錯、維護 2. 協助解決客戶BIOS技術問題 3. 韌體相關工具設計與開發 4. 完成主管交代事項 5. 勤奮有責任心

1.Having 3-year experience in OEM/ODM business. 2.Work on RFQ, analyze & identify opportunities for new opportunities. 3.High patience working on cost analysis and preparation. 4.Co-work with PM to get project development status and feedback to customer. 5.Daily communication bridge between customer and internal team (factory, FCST/parts fulfillment, engineers, PMs) to meet customer’s demand. 6.Daily shipment and Inventory control 7.A/R tracking. 8.Review contract with customer. 9.Generate new opportunities through existing relationships.

1.主機板/系統上的軟/韌/硬體功能測試 2.主機板/系統可靠度測試 3.主機板/系統相容性測試 4.主機板/系統壓力測試 5.系統機構測試 6.研發問題反饋至BUG系統，完善檢測流程 7.設備、治工具管理 8.示波器量測 9.各類SOP撰寫 10.除錯、追蹤與修改程式碼以改善執行效率 11.配合各部門提供客戶解決方案

工程助理 工讀生 文書處理

Identify sales opportunities in accordance with the Company’s overall strategic plans and financial objectives in the region •Develop and maintain relationships with distribution channels and strategic accounts •Actively pursue direct sales leads with distributors, value added resellers and System Integrators as well as solution providers •Nurture the relationship with leading CSP, Cloud Service Providers at all levels to ensure that Gigabyte remains the supplier of choice for their installations. Driving the adoption and preference for Gigabyte cloud infrastructure, cloud services, and cloud solutions. •Cultivate, educate, and engage senior-level decision-makers responsible for determining and selecting workload placement with Cloud Service Providers (CSPs) and Cloud services •Assist the product management teams to define and improve the product portfolio for use in the assigned market by regularly gathering feedback from customers, business partners and closely monitoring industry trends •Provide input regarding marketing and product positioning strategies specific to the territory •Manages the daily business decisions, identify gaps or opportunities, and execute sales strategies that result in wining and deploying Gigabyte solutions. Requires extensive theoretical, practical, and industry knowledge. •Applies and/or develops highly advanced technologies, principles, and concepts.