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公司介紹
產業描述
整合記憶體模組
電話
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員工人數
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地址
新北市板橋區遠東路1號6樓A室
公司簡介
About SMART Modular Technologies, Inc. A Penguin Solutions Company SMART Modular Technologies (NASDAQ: PENG) is a publicly traded company on the Nasdaq Stock Market and a subsidiary of PENGUIN Solutions. We deliver high-performance memory and storage solutions to customers around the world. With over three decades of industry leadership, SMART specializes in the design, development, and advanced packaging of integrated memory technologies—from today’s cutting-edge innovations to standard and legacy DRAM and Flash storage products. As a subsidiary of PENGUIN Solutions, SMART serves a wide range of high-growth markets with a comprehensive portfolio of standard, ruggedized, and custom memory and storage solutions, powering next-generation computing across AI, data centers, telecommunications, industrial systems, and more. Visit website for more info: www.penguinsolutions.com 關於SMART Modular世邁科技 (Penguin Solutions 旗下公司) SMART Modular 世邁科技（NASDAQ: PENG）是 PENGUIN Solutions 旗下的子公司，於美國那斯達克掛牌上市，致力於為全球客戶提供高效能的記憶體與儲存解決方案。擁有逾三十年的業界深耕與領導實力，SMART 專注於記憶體技術的設計、開發與先進封裝，產品涵蓋最尖端的創新技術，以及標準型與舊世代DRAM和快閃儲存產品。 作為 PENGUIN Solutions 集團的旗下一員，SMART 提供標準型、強固型及客製化記憶體與儲存解決方案，廣泛應用於AI、資料中心、電信、工業系統等高成長市場，為次世代運算提供強大動能。更多資訊請參考：www.penguinsolutions.com/zh-tw About Penguin Solutions Inc. Penguin Solutions accelerates digital transformation with the power of emerging technologies in HPC, AI, and IoT with solutions and services that span the continuum of edge, core, and cloud. At Penguin Solutions, we support our customers in achieving their ambitions across our Advanced Computing, Integrated Memory, and Optimized LED lines of business. With our expert skills, experience, and partnerships, we turn our customers’ most complex challenges into compelling opportunities. 關於Penguin Solutions Inc. Penguin Solutions致力於協助企業加速數位轉型，運用高效能運算、人工智慧與物聯網等新興技術，提供橫跨邊緣、核心到雲端的全方位解決方案與服務。業務涵蓋三大核心領域：先進運算（Advanced Computing）、整合記憶體（Integrated Memory） 及 LED優化方案（Optimized LED），全力支持客戶實現創新與成長目標。憑藉深厚的技術專業、豐富的產業經驗與策略夥伴關係，Penguin Solutions 能將各種複雜挑戰化為推動企業前進的契機。
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主要商品 / 服務項目
SMART Modular is a pioneer in the development of advanced serial memory, DRAM modules, and Flash storage solutions. Our portfolio includes CXL®-based memory solutions that enable memory expansion and pooling; a wide range of standard and specialty DIMMs designed for high-speed, low-latency communication; and a comprehensive lineup of embedded, industrial-grade Flash storage and RUGGED SSDs engineered to ensure data security, integrity, and reliability in harsh environments. These technologies play a critical role in supporting AI, machine learning, data centers, and other mission-critical applications. SMART Modular世邁科技為先進序列記憶體、DRAM記憶體模組與快閃儲存解決方案的開發先驅。我們的產品組合涵蓋CXL®記憶體解決方案，實現記憶體擴充與資源池化配置；標準與特殊規格的DIMM模組，支援高速、低延遲的通訊需求；以及嵌入式/工業級儲存裝置與強固型固態硬碟，確保資料在嚴苛環境下仍具備高度的安全性與完整性。這些技術廣泛應用於 AI、機器學習、資料中心及關鍵任務型應用中，扮演不可或缺的關鍵角色。
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公司環境照片(6張)
福利制度
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工作機會
9/26
POSITION SUMMARY:
Primary Job Description
Responsible for overseeing and managing all aspects of a company's supply chain and logistics operations, ensuring efficiency, productivity, and cost-effectiveness throughout the entire process—from sourcing raw materials to delivering finished products to customers.
Play a pivotal role in ensuring that products move smoothly and efficiently from suppliers to customers, balancing cost, quality, and delivery performance while supporting overall business objectives.
PRINCIPLE DUTIES AND RESPONSIBILITIES:
• Develop and implement supply chain strategy to maximize customer satisfaction and minimize costs.
• Plan, coordinate, and monitor logistics and distribution activities, including procurement, production, inventory management, and shipping
• Analyze data and processes to identify bottlenecks and optimize performance using key performance indicators (KPIs)
• Maintain detailed records and inventory to ensure adequate supply levels and efficient production flow
• Negotiate and build relationships with suppliers, vendors, and distributors to secure cost-effective deals and reliable partnerships
• Collaborate with internal departments (such as Operations, Sales, Finance, and Customer Service) to align supply chain activities with broader business goals
• Ensure compliance with legal requirements, safety standards, and company policies throughout the supply chain
• Lead and train supply chain teams, fostering a culture of continuous improvement
9/26
POSITION SUMMARY:
Primary Job Description
• Responsible for designing PCIeNVMe/SATA/USB/SD/CF/memory products in various form factors. Start from PCB board design, work with layout and simulation team, debug and test the engineering samples, build test platform and/or scripts, perform qualification tests and work with NPI team for release to production
• Follow SMART defined and documented design and development process and make improvements where applicable
• Will interface with SMART global design teams, suppliers, product and marketing team, and customers
• International traveling may be required for customer on site or manufacturing debug
PRINCIPLE DUTIES AND RESPONSIBILITIES:
• Communicate and work with global design teams to development and design PCIeNVMe/SATA/USB/SD/CF/memory products
• Design memory module with technical specifications from various controller, NAND flash, and component vendors.
• Understand application needs and work with controller vendors/internal FW team for modifying firmware through SOW and/or hardware design as required
• Understand design target and build test plan and DVT platform while managing product from manufacturing to release to production
• Ability to debug and determine root cause for customer issues, EVT/DVT, and production test failure samples and provide justified solutions
• Follow SMART defined and documented design and development process and make improvements to improve efficiency and accuracy
9/26
POSITION SUMMARY:
Primary Job Description
• Responsible for the hardware design and development of custom DRAM DIMM for leading-edge, high-performance server and embedded applications.
• Opportunity to work closely with SMART global engineering, manufacturing, and test groups.
• Requires analytical problem-solving skills and the ability to work independently on multiple projects.
PRINCIPLE DUTIES AND RESPONSIBILITIES:
Familiarity with all phases of hardware product development which includes but not limited to:
• Schematic capture using OrCAD CIS and experience working with a centralized part library and design process.
• Managing design projects from feasibility study to project kick-off, PCB board design, collaboration with layout and simulation teams, debugging and testing engineering samples, setup test paltforms/environment, performing qualification tests, and working with the NPI team for release to production.
• Collaborating with global Layout Engineers to determine placement, topologies, and design constraints.
• Working with SI/PI Simulation Engineers to determine best practices to maximize design margins and implement them into PCB layout design rules.
• Understanding technical specifications from component vendors and JEDEC standards.
• Using high-speed oscilloscopes and protocol/logical analyzers to assist with bring-up, debugging, and RMA processes.
9/26
PRIMARY JOB DESCRIPTION:
• Responsible for performing signal integrity and power integrity simulation analyzing DIMM products in different form factors.
• Work with layout team and NPI team for achieving good board routing and releasing to production
• Will interface with SMART global design teams
PRINCIPAL DUTIES AND RESPONSIBILITIES:
• Perform channel margin analysis to provide design tradeoffs among package, board, and connector on products starting from the technical specifications from different controller and NAND flash vendors in different form factors
• Perform PCB timing analysis, work with layout designers and hardware engineers to implement all signal integrity rules
• Perform PCB power margin analysis, work with layout designers and hardware engineers to implement all power integrity rules
• Develop layout signal/power integrity rules guideline or document on new products starting from the technical specifications from different DRAM vendors in different form factors
• Capability to execute trouble shooting and provide workable solution to SMART global R&D teams and customers
• Communicate and work closely with global R&D teams to achieve targeted schedule for PCB board release
• Write a Layout guidance document. Organize and research technical reports and share
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