美商台灣高新星研發有限公司台灣分公司

About R&D Altanova, Inc. Founded in 1969 as R&D Circuits, the Company is the leading provider of full turn-key test interface solutions and specializing in Advanced Technology Printed Circuit Board Signal Integrity and Power Integrity Engineering, Design, Fabrication, and Assembly and Manufacturing Services. A family-owned and operated business for over forty years, R&D Circuits acquired Altanova in the fall of 2013 and changed the name to R&D Altanova. The company has grown to four locations, with home base and interface board manufacturing in South Plainfield, NJ and assembly and elastomer operations in Allentown, PA; signal integrity and engineering and design engineering and sales services in San Jose, CA and a regional repair and engineering and sales office in Hsinchu, Taiwan. www.rdaltanova.com R&D Altanova is a leading supplier of A.T.E. products to some of the world’s largest semiconductor manufacturers and fabless semiconductor companies. Since R&D began manufacturing semiconductor test boards over 20 years ago, it has grown to be the core competency of our company. R&D Altanova plans and equips its Design, Manufacturing and Assembly facility capabilities expressly in support of the needs of our A.T.E. customers. We utilize the most commonly asked-for software packages for A.T.E. board design in order to support our customers with the format that suits it best. Our production facility has maintained and purchased new equipment to consistently meet the challenges facing our customers today and enable them to plan for the needs of tomorrow. Current A.T.E. Challenges High Aspect Ratio – R&D Altanova regularly manufactures boards with aspect ratios of 35:1 and more. This has become a proven technology, based on our consistent testing with the Interconnect Stress Test (IST) methodology. R&D Altanova has expanded our high-speed drilling capabilities with multiple high-speed drill machines. X-ray drilling and laser drilling and routing are also available. Aspect Ratios are available beyond 35:1. With the expert and experienced engineering staff in designing the best possible manufacturing yields and means of maintaining competitive pricing. Signal Integrity / Signal Performance Loss – Our SI/PI engineering team and our design engineering team have a unique advantage, since we offer all these services, and more, under one roof. They know the board fabrication facility’s capabilities – cold. We don’t have to design to general specifications while you shop around for someone to fabricate your boards, we can design your test needs within the capabilities of our own fabrication facility. Solving problems with stack-ups, material choices, drilling capabilities and the like; we *know* what we can do and we make it happen. One example of that capability is with regard to improving the fidelity of via’s that are an inevitable part of printed circuit design and manufacturing. There are some techniques that can be employed to assist with improving the response of those via’s by making adjustments to the anti-pad in the plane layers in a board is one way. A second example is to depicting the strategic (calculated) placement of ground via’s surrounding a center signal pin. Each of these is fine for use with lower speed digital applications, less than around 10Ghz. Our Mission As the leading provider of full turn-key test interface solutions; leader in meeting the complex, and mission-critical semiconductor testing needs of the world’s most demanding customers, we will be focusing on possible acquisitions both domestically as well as abroad to continue to expand our global presence and ensure our leadership role in the innovation of the ATE market. We strongly believe we can continue to push the limits on what is possible and lead the ATE industry.