美商奧創勝股份有限公司台灣分公司

公司介紹

產業類別

聯絡人

邱小姐

產業描述

其他電子零組件相關業

電話

03-6590218

資本額

傳真

暫不提供

員工人數

暫不提供

地址

新竹縣竹北市惟馨街95號12樓之5 (台元科技園區)


公司簡介

Founded in 2018, we're a Silicon Valley-based startup company aiming to revolutionize the touch user interface with our 3D ultrasound technology, and with this, we could transform any surface into a "user interface" that dramatically changes how humans interact with technology. The company is funded by well-known companies such as Sony, Bosch, and Asahi Kasai, as well as several prestigious VCs in Silicon Valley. We're executing on a rigorously mapped vision, and we're looking for an enthusiastic contributor to take on an important role in the organization. Please visit our website for more company information. https://www.ultrasensesys.com/

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美商奧創勝股份有限公司台灣分公司 商品/服務
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美商奧創勝股份有限公司台灣分公司 商品/服務

Fully integrated sensor SoC with Ultrasound + Strain sensing, AFE and MCU 整合超音波與應變規與MCU合一的 IC https://ultrasensesys.com/solutions/

工作機會

工作性質
廠商排序
8/27
新竹縣竹北市3年以上碩士以上月薪160,000以上
UltraSense Systems, headquartered in Silicon Valley, is revolutionizing human-machine interfaces (HMI) through its cutting-edge SmartSurface technology. Our InPlane Sensing platform seamlessly integrates touch, lighting, and haptic feedback into everyday surfaces, delivering intuitive, responsive, and premium user experiences across automotive, consumer electronics, and other industries. Join our mission to create the next generation of smart, touch-sensitive surfaces that are both functional and aesthetically superior. Summary UltraSense Systems is seeking a creative Senior Engineer, Ultrasound Algorithm Development to help develop the prototype of a groundbreaking new product. In this role, you'll collaborate with a high-caliber team to design and build devices that break new ground in the industry. This role involves hands-on algorithm development, acoustic signal processing, and system development. Key Responsibilities .Lead design, development, and prototyping of ultrasound sensor systems—from concept through testing and iteration (inspired by Xwave Innovations roles) .Develop, implement, and optimize acoustic signal processing algorithms, including beamforming (phased array/delayandsum), synthetic aperture techniques, and advanced array processing .Write clean, efficient, well-documented Python code for simulation, modeling, and real-time signal acquisition/processing .Build and integrate prototype hardware and firmware components (e.g., piezoelectric transducer interfacing, digitizers, array electronics) .Conduct simulations, modeling (e.g., FEA or acoustic propagation), and validation testing; iterate to improve system performance .Analyze sensor data, benchmark performance metrics, debug acoustics chain (from raw signals to processed outputs), and refine algorithms and hardware accordingly .Collaborate with cross-functional teams—mechanical, electrical, software—to define system requirements and drive integrative design (common across R&D roles) Minimum Requirements .Degree: M.S. or Ph.D. in Electrical Engineering, Acoustics, Computer Science, Applied Physics, or a related field .Hands-on experience (3–5+ years) in acoustic/ultrasound signal processing or sensor systems, including beamforming and array processing (phased arrays, delay-and-sum, synthetic aperture, etc.) .Strong proficiency in Python for algorithm development, data analysis, and simulation (e.g., with NumPy, SciPy, MATLAB not essential but a plus) .Practical experience with prototyping hardware—working with transducers, pulser/receiver logic, data acquisition systems, or similar instrument interfacing .Solid understanding of acoustic wave propagation, ultrasound physics, signal-to-noise enhancement techniques, and array signal processing principles .Excellent communication, writing, and documentation skills; ability to draft technical reports, collaborate with teams, and present findings clearly (noted across industry postings) Desired Requirements .Ph.D. in relevant field, with a proven R&D track record, including publications, patents, or conference papers .Experience with FEA modeling or acoustic simulation tools, especially for transducer design or wave propagation analysis .Background in device fabrication, CAD design, or microelectronic processing (e.g., GDS patterning) is a plus .Familiarity with synthetic aperture ultrasound techniques or advanced imaging methods .Experience developing adaptive or data-driven beamforming (e.g., deep learningenabled approaches for ultrasound) .Proficiency in embedded platforms or real-time firmware, including porting signal processing algorithms into C/C++ or FPGA/ASIC environments .Proven ability in small R&D environments—self-motivated, resourceful, and highly collaborative .Comfortable working in a fast-paced, cross-functional environment .Creative thinker with a passion for tackling unfamiliar challenges .Eagerness to contribute to early-stage product innovation and development
應徵
9/03
新竹縣竹北市5年以上大學以上月薪100,000以上
Job Description UltraSense Systems is looking for an experienced and skilled Device Qualification and Reliability Engineering leader for the manufacturing organisation. The role requires both strong technical and a track record of success. You should be comfortable in driving product/device and package qualification and reliability stress testing in order to meet AECQ100 Grade 2 complaincy. You will work closely with customer Engineering to address customer quality issues from yield to reliability by driving “0 PPM”. Responsibilities o Work closely with multi-functional engineering groups and third parties to lead qualification of new products/devices with high quality. Establish plans and manage deliverables. o Drive investigation and resolution on qualification fallouts and product and process nonconformance of MRB, RMA events through means of FA, CAR, 8D, and reporting o Manage customer failure root cause analysis and 8D reporting o Drive Design for Reliability and Design for Test to ensure stress-ability and testability o Lead all aspects of and ensure adequate preparation for qualification including such as corner skew material, BIB/Socket, waveform, electrical bias, thermal effect, lifetime estimation o Perform FAI to ensure critical goals are reviewed before engineering, pre-production and production release for Product Manufacturing o Manage new product/device reliability testing and qualification such as TCT, HAST, and HTOL. o Drive investigation and resolution on qualification fallouts and product and process nonconformance of MRB, RMA events through means of FA, CAR, 8D, and reporting o Evaluate and perform Reliability Risk Assessment o Support PCN or ECN activities Qualifications o BS in EE or Pysics. MS or PhD preferred. >5 Years of relevant industry experience o Silicon engineering experience in the Device/Reliability from multinational companies o Outstanding communication skills required o Experience of silicon product level reliability qualification and lifetime behavior model o Board Level Reliability knowledge preferred o Expertise and working knowledge of commercial and automotive reliability standards (JEDEC, AEC) o Knowledge of reliability stress and test methods, failure mechanism acceleration models. o Good social and communications skills - comfortable working in multicultural teams. o Familiarity with IC components reliability failure modes, mechanisms, and failure analysis techniques preferred
9/18
新竹縣竹北市3年以上大學月薪80,000以上
UltraSense Systems is looking for strong Mechanical & Simulation Engineer. Main responsibilities include integrating UltraSense HMI products across multiple applications from mobile to automotive to IoT and involved in the entire development process from initial concept through manufacturing. Major Responsibilities 1. In charge of product designs of consumer electronics, automotive, and appliances and involved in the entire development process from initial concept through manufacturing 2. Assess/analyze the mechanical structure and new piezoelectrical sensor with commercial finite element software and optimize sensor performance by the simulation result. 3. Provide detail design recommendations to the Product Design teams based on Finite Element Analysis (FEA) results, contributing to the product design and sensor performance assessment. 4. Aim at improving user experience through well-executed design with our sensor interface and build Mockup in practices 5. Cooperate with cross-functional teams for innovative solutions, inclusive of Mechanical Engineering, Optimizing Sensor Design and Issue-resolving Design Minimum Qualifications Master's degree or above in science or technical discipline with a minimum of 3 years of mechanical design/simulation experience 1. Proficient with commercial finite element software, mainly ABAQUS; can build meshes for thermal and structural simulations. Other fields are pluses. 2. Computing expertise in one or more of the following areas: FEM tools, programming language (python, MATLAB, C, Fortran, etc.), PDE solving methodology and technics. 3. Familiar with system/product level characterization and material testing 4. Strong conceptualization and creative problem-solving skills, strong mechanical aptitude, and basic understanding of stress-strain 5. Must be effectively bilingual in Mandarin and English; excellent written and spoken communication skills are required.
應徵
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