加拿大商星力達國際有限合夥台灣分支機構

In this position, you will be responsible for switch/router product architect and lead complex product design. Your responsibilities will include but not be limited to: - Co-work with front end team and program team to response customer technical requirement, lead technical discussion with customer or front end team; - Define system architect, trade off product requirement, performance, cost, and risk, etc.  - Following technology trend and contribute to product roadmap definition. - Lead complex product design like chassis level modular switch/route from technical point of view. - Consultant and lead complex issue debug and troubleshooting; Key Skills: - BS or Master degree in computer science/Electrical/Electronics. - 10+ year experience on networking product development, system architect experience will be a plus. - Familiar with CPU platforms like x86, ARM, PPC, MIPS; multi-platform design experience will be a plus. - Familiar with networking product, experience on leading switch, router or similar product design. - Understand high-speed design, above 100GbE switch design experience is highly recognized. - Knowledge on software and FPGA/CPLD, understand software interface; familiar with FPGA and protocol will be a plus. - Strong debugging and troubleshooting skills; - Good English read, write and conversation skills. - Excellent communication skills. Must have team work spirit. -willing to travel

1.測試產品規格，並執行除錯及法規認證。 2.編寫程式、除錯、追蹤與修改程式碼以改善軟體執行效率。 3.設計通訊演算法，並進行擬真與實現。 4.評估相關零件模組規格。 5.執行系統分割或功能方塊劃分，並評估所需之系統資源。

Job Responsibilities: 1. Following R&D product design process to implement the hardware design. Ability to communicate clearly with team members and teamwork skills. 2. Cooperate with a cross-functional team of Engineers (EE, software, Thermal, mechanical, CAD, DFX, Test, etc.) and others in the development and support of new product introductions. 3. Serve as the senior technical advisor for the product line for the end-to-end life cycle of the product. Ensure operations technical readiness for all phases of the introduction cycle. 4. Identify, prioritize and manage key technical changes and risks of a given product; ensure all technical risks associated with a product are identified and closed or mitigated to enable the quality ramp of a product. 5. Review and submit all equipment requirement plans, along with an assessment of the robustness of the solution to meet the requirements of the operation, and the implementation of any additional solutions to mitigate any risks to the plan. 6. Deriving the functional specification and architecture for a subsystem or circuit pack based on system requirement. 7. Component selection/qualification; interacting with electrical/optical component vendors. 8. Documenting all technical design files. 9. Logic thinking and communication with customers Qualification: 1. A university degree in EE/CS, or a master’s degree is preferred. 2. With 8+ years relevant experience, preferable in communication product design and applications, such as datacenter switch, router, carrier switch, etc. 3. Experience with key switch silicon, such as Broadcom, Marvell, Cavium, etc. Experience in communication interface, such as XAUL/GMII/SGMII /XFI/PCI/PCI-E/ buses required 4. Knowledge on high-speed design, 25G SERDES is preferred 5. Experience in product testing, certification. 6. Excellent understanding of digital hardware design, power design, and high speed interfaces, timing analysis and signal integrity issues. 7. Understanding of analog electronic concepts and EMC. Can supervision of layout design. 8. Working knowledge of Concept schematics capture, Signal Integrity simulation, Verilog HDL, familiarity with Allegro. 9. Experience with high volume run products, test and verification of circuit packs designed. 10. Supporting new product introduction/transition to EMS. 11. Be familiar with EDA tools such as OrCAD, Concept HDL, Allegro etc. 12. Good communication skills, English language proficiency

1.測試產品規格，並執行除錯及法規認證。 2.編寫程式、除錯、追蹤與修改程式碼以改善軟體執行效率。 3.設計通訊演算法，並進行擬真與實現。 4.評估相關零件模組規格。 5.執行系統分割或功能方塊劃分，並評估所需之系統資源。

Location: Thailand Requirements: 1. Bachelor or above degree in Chemical Engineering, Material Engineering, Mechanical Engineering, or consideration of an equivalent combination of education and experience. 2. 11 to 14 years of relevant experience in Server, Storage and Networking products. 3. Project Management 4. Leadership 5. Communication 6. PCB related: ● Good knowledge of PCB materials – Core, PP, copper foils and different types of via filling materials. ● Ability to use PCB software, such as ODB++, to read PCB design files for deep understanding and analysis of PCB designs. ● Familiarity with PCB designs in PTH, via in pad, skip vias, staggered vias, buried vias, VIPPO, backdrill; and different types of PCB surface finishes. ● Understanding of PCB key manufacturing processes, such as sequential lamination, drilling, chemical/electrical plating and the processes for different types of vias manufacturing. ● Deep understanding the thermal mechanical behaviors in PCB assembly process for a PCB with asymmetrical design ● Experience with a variety of PCB qualification methods for rigid and rigid-flex PCBs, and typical failures. ● Good knowledge of IPC standards (IPC-A-600, IPC-6012, IPC-6013, etc.) 7. Soldering process related: ● Good knowledge of DFM for SMT & wave, and solder materials (solder alloys, solder pastes, fluxes, etc.) ● Expertise in soldering techniques (wave soldering, reflow soldering, hand soldering, selective wave soldering, vacuum soldering) ● Experience in SMT and rework of hyper-BGAs in B2B assembly, and other processes -- PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edge bonding, etc. ● Familiarity with evaluation & qualification soldering materials, chemicals, bonding/coating materials and solder joint reliability ● Good understanding of potential failures in seach process and failure analysis methodologies, both destructive & non-destructive ● Familiarity with PCBA assembly equipment ( solder paste printers, pick-and-place machines, reflow ovens, wave soldering machines) ● Knowledge of relevant industry standards, IPC-A-610, IPC-9701,IPC-9704, IPC-9201 etc. 8. Thermal management related: ● Good knowledge of various thermal management techniques (heat sinks, fans, liquid cooling, phase-change cooling, immersion cooling) and the thermal performance of different types of TIMs ● Understanding of the thermal requirements in products of switch, server, networking, data storage, ML & AI etc.. Identify and implement innovative thermal solutions to meet challenging design requirements. ● Experience in thermal modeling and analysis techniques (finite element analysis, lumped parameter modeling) ● Develop and execute rigorous thermal validation and testing plans for both thermal performance and reliability ● Collaborate with hardware and software engineers to optimize thermal performanceand reliability. ● Familiarity with industry standards (e.g., IEC, Telcordia) ● Understanding of reliability engineering principles and failure mechanisms related to thermal stress ● Stay up-to-date with the latest advancements in thermal management technologies and industry standards. ● Collaborate with customers, industry partners and academic institutions to explore new thermal solutions. Responsibilities: ● Responsible for understanding the customer’s technical roadmap, product design architecture and applications ● Understand manufacturing requirements and identify capability deficiency in PCB design, soldering processes and thermal management. ● Evaluate potential manufacturing impact from the design concept of each product. ● Negotiate trade-offs for DFX issues with customers, suppliers of PCB, components and manufacturing for delivering a cost-effective solution with proven reliability. ● Investigate all manufacturing processes related technical issues and provide technical solutions for products in the full life cycle. ● Manage multiple projects simultaneously and meet tight deadlines.

Base in Thailand Responsibilities: - Lead development of production test strategies based on product design specification. - Lead the development of test plans and requirements for customer products including both hardware and software elements. - Lead the procurement, qualification, and installation support for manufacturing across the factory. - Be accountable for the test process optimization with a focus on productivity improvements to cycle time and yield across a factory serving multiple customers - Provide project leadership, including management of (and communication with) team members, suppliers for comprehensive test deployments including structural, functional, system, stress and final test applications at the factory level - Support sales process by providing support to the quoting process. - Work with design to enhance solution with feedback from product testability, test coverage, diagnosability, reparability, firmware/diagnostics and user experience. - Keep up to date with relevant industry knowledge and regulations - Lead and drive complex problems related to product yield or test performance. - Industry recognized expert in a specific test domain - Provide company-wide test strategy support including training, capital investment, aged equipment rotation, supplier relationship management and industry equipment evaluation for the purpose of capital planning. - Set yearly plans and goals for his department, give direction on expected performance, provide regular performance evaluations and ongoing feedback. Accountable for all department objectives and achieving agreed targets for key performance indicators. Requiremements: 1. Bachelor degree or consideration of an equivalent combination of education and experience.Educational Requirements may vary by Geography. 2. 7 to 10 years of relevant experience. 3. Standard Job : Technical Skills - FUNCTIONAL /SYSTEMS /STRESS TEST OPERATIONS : ESD Controls, ESS Hardware, ESS Profile, Functional / System Test Solution Support, RF Test Operations, Test Fixture, Boundary Scan, Test Strategy Creation, Test Plan Creation, FT Software Development, FT Diagnostic and Firmware Development, FT Fixture Development, FT Fixture Mechanical Design, FT Equipment Skills, FT Debug/integration of SW/HW, RF Test Development (<5Ghz), RF Test Development (>20Ghz), High Energy Experience, Electrical - Automation, IPC-10, Engineering Control & System Tools, Quality Data (KPI), Supplier Quality & Component Engineering, Manufacturing Operational Management, System Architecture, EE - Digital, EE - Analog, FW - Firmware, OS, Application Software, PLC programming, Sensors / Moving Parts, Fluidics, Fiber Optics, Tolerance Analysis - STRUCTURAL TEST OPERATIONS : ESD Controls, Component Module Programming, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), Flying Probe, Backplane Test, ICT Equipment Maintenance, ICT Engineering Technical Support, 3070 and Teradyne ICT Test Development Applications and Models Development, Functional / System Test Solution Support, RF Test Operations, Test Fixture, Boundary Scan, Test Strategy Creation, Test Plan Creation, FT Software Development, IPC-610, Engineering Controls & System Tools, Quality Data (KPI), Supplier Quality and Component Engineering, Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFT - Physical Test , DFT - Electrical Test 4. Project Management 5. Leadership 6. Financial Acumen / Business Planning 7. The following competencies may also be required: Coaching/Mentoring; Communication/Negotiation/Presentation; Creative Problem Solving; Customer Interaction/Stakeholder Management; Quality & Lean; Working Effectively with Others; D/PFMEA; 8D/Corrective Action; Equipment Safety; Design of Experiments (DOE).

The successful candidate will be a self-starter who likes to take responsibility and works best with little supervision. Likes to perform a variety of tasks and have the ability to handle multiple priorities and has previously performed in a similar position. This is a 'hands-on' role requiring a strong technical background and product development experience. Duties: • Identify technical issues, troubleshoot and resolve them by coordinating with R&D, Manufacturing and Field teams. • Participate in customer technical meetings and prepare training programs for internal subordinates. • Hardware validation of Networking, Storage, Server products against customer's infield issues, requirements and Mfg. issues during NPI or RMA. • System validation including DVT (Design Validation Trial), SPIT (Signal, Power, Integrity & Timing) environmental & regulatory approval. • Qualify alternative components for compatibility, cost effectiveness and benchmarking. • Support Manufacturing Engineering and Test Engineers on trouble shooting and resolving technical issues and root cause analysis. • Work with software teams to identify root cause of system failure. • Ability to install software such as Linux based Operating Systems, ONIE, BIOS, BMC, SES. • Proficient in using various test and measurement equipment including but not limited to Oscilloscope, Impedance analyzer, Power meter, Signal analyzer, Spectrum. Background: Candidates should have 8+ years' experience in either Network, Storage or Server products. Candidates should have the following essential qualifications and experience: • At least BEng. (Hons.) in Electronics or similar. • Strong electrical design and debug skills required. • Familiar with PCIe, NVMe, SAS, SATA, I2C, SPI, DDR buses. • SDRAM timing and integrity analysis for clocks, strobes, S&H, Power bounce, temp stability. • Hands-on design knowledge of latest peripheral chipsets for Gigabit Ethernet, SCSI, SATA, SAS, USB, Ethernet, & PCI cards etc. • High performance RISC / X86 CPUs and architecture including Intel, AMD, MRVL. • Proficient in using various test and measurement equipment including but not limited to Oscilloscope, Impedance analyzer, Power meter, Signal analyzer, Spectrum analyzer. • Qualify alternative components for compatibility, cost effectiveness and benchmarking. • System validation including DVT (Design Validation Trial), SPIT (Signal, Power, Integrity & Timing) environmental & regulatory approval. • Work with software teams to identify root cause of system failure. • Working knowledge of windows & Linux configuration, installation procedure, network configuration, driver configuration etc. • Working knowledge of Diag, ONIE, BIOS, BMC, Linux and Windows operating systems • Knowledge of the following would be desirable: - Experience of working in medium sized multidisciplinary development teams - Ethernet Switches, Server, Storage products - Orcad Schematics & Allegro PCB layout tools Personal Attributes: The successful candidate will be a self-motivated individual capable of working with a minimum level of supervision in a dynamic team environment. Good interpersonal skills. Be able to communicate effectively (both verbal and written) with members of other teams, departments and clients; a high degree of liaison is needed.

Develop SI and PI design for server/storage/communication products. Major works are to serve as the signal integrity analyst and designer provides the support to internal team, suppliers, and customers to deliver the new products. Job Responsibilities: • PCB material choosing and stack-up definition. • 3D passive channel modeling, perform SerDes channel extraction using electromagnetic tools. • Perform signal integrity pre-layout and post-layout analysis in R&D phase. • Perform static timing and signal integrity analysis of parallel (common clock, source-synchronous) interfaces. • Design and analysis of multi-gigabit serial links, including lab verification and tuning. • Perform power integrity analysis on power delivery network. • Generate and verify PCB layout rules, manage constraints for PCB layout. • Work directly with ASIC and PCB design teams to evaluate design tradeoffs and optimize design performance / risk / cost / manufacturability. • Cooperate with R&D team and signal test engineers on debugging, failure analysis and fixing issues discovered during test. • Be familiar with SAS, PCIe, DDR3/4, 25G/56G Ethernet specification is a plus. Job Requirement: • Experience with at least one PCB post-route SI tool: Cadence SPECCTRAQuest, Mentor ICX, SiSoft SI-Auditor (preferred), Sigrity Power SI. • Experience with Synopsys HSPICE and/or Keysight ADS for both time and frequency domain circuit simulation. • Experience with at least one 3-D field solver (CST Microwave Studio, ANSYS HFSS). • Experience with TDR and VNA measurements. • Proficiency in Electromagnetic, Transmission-line & S-parameters theory and modeling. • Good understanding on power distribution and SerDes design. • BSEE or related field with 8 years of applicable work experience or MSEE or related field with 6 years of experience. • Experience of script languages like VB, Perl or Python. • Use of mathematic tools like Matlab. • Strong written and oral communication in English with customer service skills.

Designs complex printed circuit boards from schematic netlist to production of manufacturing data, typically ranging from 6-56 layers count with a high density per square inch factor including BGA and uBGA packages. Participates as needed, in product design including board planning and design, schematic reviews, DFx reviews, High-speed layout guidelines, validation and introduction to manufacturing. The candidate must also be very comfortable working with team members at other sites and time zones, and working with customers. Be willing to travel if needed. • Capable to lead a complex project PCB design. • Capable top-down the PCB design from Planning to detail PCB design. • Capable maintain PCB design guide and guide the Jr. Engineers; • Capable supervises other designers and helps to troubleshoot and solve CAD software problems. • Estimates effort spending accurately by PCB by project. • Maintains PCB design integrity through updates and records of changes. • Directs workload appropriately. Meets with team leaders, clients and designers to develop and improve designs and processes. • Be the prime customer interface to ensure customer requirements are implemented and any potential issues resolved and customer satisfaction is met. • May lead a work group or project team consisting of one or more support staff and/or tech/professional staff with some coaching from own supervisor, or may provide advice and guidance in area of specialty. • The designer must be able to initiate and lead activities to improve the design process and increase the efficiency of the design tools. • Evaluates, recommends and tests CAD software and other programs necessary for PC design. • Seeks out new approaches for building internal and external relationships; maintains contacts with existing relationships. Background: Candidates should have minimum 8 years direct experience in PCB design, 10+ years preferred. Must be able to read and write in English with spoken English. Candidates should have the following essential qualifications and experience: • University degree, or consideration of an equivalent combination of education and experience. • Extensive computer system and ECAD tools knowledge: - Cadence Allegro/Constraint Manager/Specctra tools V14.2/V15.1 - Mentor Graphics Boardstation, Expedition, Power PCB, nice to have; • The ability to interpret electrical/mechanical/thermal engineering constraints and determine the best strategy for layout implementation. • Has the ability to run signal integrity tools within the design environment and analyze the results to determine compliance with the customer's specification. • In-depth knowledge of electronics and printed circuit board design. • Working knowledge of fabrication, assembly and test processes, including use of Valor's Enterprise tool • In-depth knowledge of drafting procedures for construction and documentation. • Project management skills. • Intermediate level math skills. • Ability to diagnose and prioritize issues and solve design related problems. • Ability to deliver high quality results within tight time deadlines. • Ability to communicate with a variety of internal and external customers. Personal Attributes: • Communications - clear, concise, both written and spoken. • Comfortable with technical report writing. • Candidate must possess strong customer communication skills. • Details orientated. • Personal interest to drive issues to root cause, logical problem solving. • Task independence. Ability to aggressively drive tasks independently and to seek out information internally, externally. • Team orientated. Work well within a team and/or lead some team members.

Responsibility: • Lead thermal design development for leading-edge IT equipment, Thermal design experience on Switch or Server is preferred. • Provide high-quality thermal proposal for RFQs response. • Design robust thermal solutions to meet product and thermal specifications, and conduct comprehensive thermal simulation analysis from Board to system level to verify thermal feasibility/risk. • Interface with a multi-disciplinary group to define system requirements, and design products. Experience in working in medium sized multidisciplinary development teams. • Interface with thermal vendors to manage cost, quality and functionality of thermal parts. • Work with function team to identify route cause of thermal related failure • Keep tracking on advanced cooling technology such as liquid cooling, immersion cooling. Requirement: • Candidates should have 8+ years’ experience in thermal design/simulation/test validation for electronic product, Liquid cooling product experience is preferred • BS or above in Thermodynamic or relevant Engineering • Hands on experience on Flotherm as CFD tool, Celsius and Macroflow for liquid cooling simulation is preferred. • Expertise in various heat sinks, heat pipe, Vapor chamber design/selection. Liquid cooling elements including cold plate, manifolds, CDU is a plus • Expertise and experience in various fan speed control methodology and over temperature protection mechanism • Familiar with thermal measurement technology and test tools such as temperature data logger, IR camera, wind tunnel, air speed meter etc. • Knowledge about Mechanical design tool such as Creo considered as a plus • Knowledge of server/storage/switch system architecture is a plus • Familiar with industry standard including NEBS, GR-63, ASHRAE TC9.9,etc

The candidate will be a member of mechanical/thermal design team, which is responsible to deliver qualified mechanical design service to customers. Job Responsibilities : • Conduct design of various type of product, including activities such as: - Understand customer requirements and refine product specifications - Provide design proposals and establish design goals and objectives for the team review and approve - Support program management on define mechanical design schedule - Perform necessary design analysis including strength analysis, tolerance analysis - Optimize designs through FEA/CFD analysis report, DFx review, and cost analysis - Identify and resolve cross-functional and cross-discipline architectural issues • Support technical proposal, planning and cost estimation that will aid in the initial quoting process. • Work with multi-function to define prototype build strategy and support proto builds. • Support to develop part/system test plan, perform prototype validation, system assembly check/verification, issue analysis and solutions • Release part designs for tooling and support tooling build, provide support during the product manufacturing stage. • Interfacing with overseas counterparts and overseas suppliers, manufacturing and other internal department • Interfacing with overseas customers • Support manager to create tools and processes that result in organizational efficiency. Requirement : • Bachelor or master degree in mechanical engineering • Minimum 8 years of direct working experiences in electronic product mechanical design, switch/communication product design experience is a plus. • Experience in mechanical design in a multi-disciplinary environment, and multiple type of product development cycles • Good knowledge in material property, manufacturing process, tolerance analysis, stress analysis, thermal analysis, skills to perform kinematics analysis is a plus • Good knowledge in industrial standards and system level environmental compliance • Expert in using of CAD design tools, Creo is must, SolidWorks and AutoCAD is a plus • Good skills in Microsoft office software • Fluent in both written and spoken English, ability to work in an international team • Good team work attitude, collaboration and communication skills • Business travel possible (include the oversea travel)

Job Responsibilities : • Primary responsibilities including EMC design and test. Work closely with internal team, customer and suppliers deliver on time, cost and quality from EMC perspective, and improve EMC one time pass rate • Provide guidance during product design, like EMC risk assessment, schematic review, PCB layout review, Mechanical drawings review, lessons learn of EMC related • Be responsible for the EMC test case specification according to the product requirements • Be responsible for verification on EMC test, communication with external test laboratories analysis of test results, generate test report • Be responsible for applying the new product for safety and EMC certification, and get approval • Technical support for customer projects EMC related topics. Requirement : • Full-time Bachelor or Master Major in Microwave, EMC, electrical, electronic, Mechanical engineering, etc. • Minimum 8 years experience in EMC test, design, and certification • Proficient in EMC Principle • Proficient in EMC standard and test, Experience of EMC test equipment and test software • Proficient in using oscilloscope, spectrum analyzer and receiver • Strong ability on trouble shoot or resolve issues related to EMC and safety compliance • Familiar with world-wide certifications and agencies such as UL, TUV, FCC, VCCI, BSMI, KCC, ANATEL, NEBS • Familiar with international regulatory standards such as CISPR32/35, GR1089, EN300386, UL60950, IEC62368, etc. • Experience in EMC design of Storage/Server/Communication (Network switch products) is preferred; • Experience in AC power supply or DC power supply EMC design is preferred • Experience in HFSS/CST/SPICE or other EMC simulation is preferred • Fluent English listening, speaking, reading and writing skill, capable of international communication, CET-4. • Excellent documentation skills including record maintenance/ tracking and understanding of document traceability • Good initiative and positive personal personality , Self-motivation • A detail-oriented individual, and the ability to work in a team environment, as well as individually