艾克爾國際科技股份有限公司

1. leadship for FCBGA EOL Processes 2. Custmer RMA and 8D abnormal cases and customer conference call supporting 3. Cross function team supporting & cooperation 4. Projects hndling and leading CIP team

1. Create and fine tune recipe on NPI phase in. 2. Process yield maintenance and trouble shooting. 3. Project management and handle. 4. Low yield analysis and preventive action proposal. 5. Data mining and big data analysis

1.負責SCSWR工程實驗貨批 2.負責FOL Passivation and U/C 相關製程-材料處理/SPC Chart Review/Tool Cross Qual/Recipe Optimiztion 3.負責PVB and PVP Pill管控 4.負責產線Passivation and U/C 生產製具 Buy Off 5.負責FOL量測機台Recipe maintain and 量測材料異常處理-UV1280

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ 1. Defect 報表讀取/分析/異常 rootcause analysis 2. 製程參數分析設定與優化 3. 協助處理線上異常狀況 4. 系統SPC 流程確認 異常處裡OCAP 處理 5. 未來ATT1 Bumping 5F 自動化 PCN 設立

1.制定製造程序及產品標準 2.檢測製程設備及參數 3.持續改善現有生產製程 4.改善品質報廢與每日產量及良率分析、監控、改善

1. NPI新產品導入量產驗證、製程改善 2. 製造生產流程異常處理、分析、規範制定 3. 改善專案管理執行與規劃

1. 設置製程參數及優化製程 2. 制定製造程序及產品標準 3. 持續改善製程設備異常 4. 技術文件撰寫維護 5. 改善品質異常, 每日產能, 監控, 分析及改善

1.NPI新產品導入量產驗證 2.產線異常排除與真因調查分析 3.提升產品產能及良率 4.製程改善專案執行與規劃

1.廠內協調各部門調查異常，制定行動方案 2.對外部客戶說明流程改善方案 3.持續優化生產流程 4.生產線作業流程定義

1. 設置製程參數及優化製程 2. 制定製造程序及產品標準 3. 持續改善製程設備異常 4. 技術文件撰寫維護 5. 改善品質異常, 每日產能, 監控, 分析及改善

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ 1.Capacity Planning 2.Equipment move in /out 3.Space & Plant Layout 4.Basic IE data management 5.Bump cost reduction meeting 6.Month-end closing

The Advanced Product Development Team at Amkor has an opening for bumping mask design Engineer. This team is responsible for mask/stencil design, tooling order, support factory request. Job responsibilities for this position include DRC verification, tooling design. This involves design report generating, design database system maintenance, txt map generating, stepper shot map generating. Co-work with PDE team on design discussion.

The Advanced Product Development Team at Amkor has an opening for Package mechanical simulation engineer. This team is responsible for package architecting, mechanical & stress simulation, failure analysis, and manufacturing process development. This position involves working with Amkor's Worldwide R&D, manufacturing, quality, design and characterization teams in providing mechanical & stress simulation support, failure analysis, and manufacturing process development for wafer level and laminate based packaging technologies. This requires development of simulation methodology for stress analysis, test methods to validate the simulation, model construction for failure prediction. The candidate must be capable of using advanced Finite Element Analysis (FEA) techniques (such as sub-modeling and non-linear analysis), and test equipment for material characterization testing. They should also understand the concepts of chip, package, and board level interconnect technologies. The candidate is expected to have strong communications and project definition and execution skills.

1.新產品生產程序開發及改良 2.依公司或客戶需求進行新材料開發 3.與客戶即時溝通確保客人需求無誤的執行 4.蒐集數據並分析及完成報告撰寫

The Advanced Product Development Team at Amkor has an opening for Package Si/Pi Engineer. This team is responsible for architecting, design methodology, design implementation and verification for Amkor Greater China customers (ASIC, AI, TPU, AP, DSP, GPU, RF, Analog, PMIC, etc...). Job responsibilities for this position include Si architecture analysis, technology benchmark, and package Electrical modeling. This involves extraction, analysis, and optimize system co-design of IC-PKG-PCB focusing on package footprint constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network constraints. Provides technical guidance to circuit/package/board designer to optimize system performance. Reviews electrical technical specifications and works with package design teams to assure package designs meet those specifications. Determines creative design approaches and parameter. Additional responsibilities: * System level co-design methodology of IC, Package and PCB/Board. * Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs. * Package design flow methodology implementing power distribution network (PDN) constraints for high-speed processor including design optimization techniques at the die/pkg/PCB levels * Working with design teams on competitive analysis and package technology benchmark.

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ 1. New PI material evaluation 2. Process integration 3. Process improvement 4. Root cause analysis and co-work with customer

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ Job responsibilities for this position includes physical design/layout in FC and Wirebond substrate based technology, package selection, and design rule implementation. This involves optimizing system co-design of IC and Package, IC floor-planning, ball array optimization to meet signal & power integrity, assembly, and thermal constraints.

1. 產品分析報告及治具驗證 2. 協助新產品導入及流程驗證 3. 報表製作及自動化改善 4. 線上異常分析及處理 5. 異常貨批處置執行與追蹤

1.產品分析報告及治具驗證 2.協助新產品導入及流程驗證 3.報表製作及自動化改善 4.線上異常分析及處理 5.異常貨批處置執行與追蹤

如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/ 1. 新產品導入及流程驗證 2. 產品分析報告 3. 報表製作及工程分析 4. 線上異常分析及處理