研發-Electrical Simulation Engineer-台元辦公室-ATT250049

The Advanced Product Development Team at Amkor has an opening for Package Si/Pi Engineer. This team is responsible for architecting, design methodology, design implementation and verification for Amkor Greater China customers (ASIC, AI, TPU, AP, DSP, GPU, RF, Analog, PMIC, etc...). Job responsibilities for this position include Si architecture analysis, technology benchmark, and package Electrical modeling. This involves extraction, analysis, and optimize system co-design of IC-PKG-PCB focusing on package footprint constraints, IC floor-planning, PCB, high-speed signal integrity, power distribution network constraints. Provides technical guidance to circuit/package/board designer to optimize system performance. Reviews electrical technical specifications and works with package design teams to assure package designs meet those specifications. Determines creative design approaches and parameter. Additional responsibilities: * System level co-design methodology of IC, Package and PCB/Board. * Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs. * Package design flow methodology implementing power distribution network (PDN) constraints for high-speed processor including design optimization techniques at the die/pkg/PCB levels * Working with design teams on competitive analysis and package technology benchmark.