半導體設備商
暫不提供
70人
新竹縣竹北市台元一街8號8樓之2 (台元科技園區)
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices. Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa’s expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future.
Wedge Bonder, Ball Bonder, Blades, Capillaries, Advanced Packaging.
* 團體保險 * 年終聚餐 / 公司旅遊 * 婚喪生育補助 * 特別休假 10 天起 * 年度健康檢查 * 年終獎金
K&S was founded
IPO on OTC
Migrated to NASDAQ
Micro Swiss joined K&S (now K&S Bonding Tools)
Opened sales & service office in Japan
K&S and Delco established Flip Chip Technologies
Opened Singapore manufacturing facility
Opened China based manufacturing operations
Acquired Orthodyne Electronics Corp.
Acquired Liteq B.V.
Corporate Headquarters relocated to Singapore
Opened the Corporate Headquarters building in Singapore
Acquired Assembléon Netherlands B.V.
Opened K&S China Demo Center in Suzhou