Job Description 1. Package RFQ/process flow evaluation 2. New process/ capability development & research. 3. BOM selection and direct material evaluation 4. New technology research and set up package roadmap 5. Advance product design ( assembly process & Substract/Lead Frame design ) 6. Packaging validation and optimatization for new product development 6. team management & coordinate the RD design review meeting
待遇面議
(經常性薪資達 4 萬元或以上)
1.合理之薪資待遇 2.員工參與分紅 3.年度調薪計劃 4.年節禮券(三節) 5.同仁免費團保 6.旅遊代金發放 7.婚慶及喪唁補助 8.生育補助 9.生日禮券 10.員工團膳安排 11.年度定期體檢與健康諮詢 12.特約廠商優惠服務 13.外縣市同仁宿舍(間接同仁) 14.多元化教育訓練 15.培養員工多樣化興趣之休閒社團活動 16.年終餐宴 17.尾牙哈哈獎