Roles & Responsibilities: -To design High-Speed/High Density (Multi-Layer, Up to 46 layers) PCB Layout projects. Challenges involve highly complex electrical & mechanilcal contraint driven designs, high density interconnects and packaging, meeting client's SI,EMC, DFM, DFA, DFT. -Troubleshooting and fault finding in PCB layout at Design level. -Placement of components based on mechanical constranints and schematic flow. -Routing of signal based on SI constraints. -DFx Analysis implementation. -PCB Manufacturing/Assembly files Geneation.
待遇面議
(經常性薪資達 4 萬元或以上)
Requirements: -B-Tech/BS Tech in Electronics or equivalent. -Proficiency in any PCB layout design tool. -Familiarity with all phases of hardward development, including schematic entry, PCB design, and fabrication processes. -Strong problem-solving and analytical skills, with the ability to learn quickly in a dynamic enviroment. -Excellent written and oral communication skills, profclency in English preferred.