技術工程類-製程開發高級工程師/專案經理(覆晶封裝關鍵人才)

職務內容： • 負責 Flip Chip 封裝製程（Flip Chip Bond / Thermal Compression Bond / Assembly）的開發與優化 • 與產品、研發、設備單位合作導入新製程 • 解決量產良率、可靠度、製程參數問題 • 規劃與執行先進封裝技術平台（如FCBGA、FCCSP、HBPOP） 職務要求： • 電機/材料/化工/機械等相關科系，學士以上 • 5年以上Flip Chip製程開發或量產經驗 • 熟悉半導體封裝流程與相關設備 • 具備良好跨部門溝通能力，能獨立主導專案者尤佳 Job Description • Responsible for the development and optimization of Flip Chip packaging processes (Flip Chip Bond / Thermal Compression Bond / Assembly). • Collaborate with product, R&D, and equipment units to introduce new processes. • Resolve issues related to production yield, reliability, and process parameters. • Plan and execute advanced packaging technology platforms (such as FCBGA, FCCSP, HBPOP). Job Requirements • Bachelor's degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related fields. • Over 5 years of experience in Flip Chip process development or mass production. • Familiar with semiconductor packaging processes and related equipment. • Excellent cross-department communication skills, with the ability to independently lead projects being a plus. ＊實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。 Actual salary will be determined based on education, field of study, relevant work experience, professional certifications, special skills, and language proficiency. ＊歡迎具備日月光(高雄)、矽品(台中)、南茂、新興、臻鼎等Flip Chip量產經驗者投遞，薪資從優核敘。 Candidates with Flip Chip mass production experience from ASE (Kaohsiung), SPIL (Taichung), ChipMOS, Unimicron, and Zhen Ding are welcome to apply. Will be offered a competitive salary!