Senior R&D Package Design Engineer

• Bachelor or master degree in Electrical Engineering, Mechanical Engineering, or Engineering related. • 8+ years experience in package and/or hardware system design, assembly process engineering, and new product development. • Package/PCB layout experience using Cadence APD/SIP required. • Signal/Power/Ground integrity experience and familiarity with simulation tools such as Cadence Sigrity Package Assessment, ANSYS Q3D, and ANSYS HFSS. • Mechanical design experience using AutoCad and Solid Works. • Solid understanding of packaging assembly process and material properties. • Experience with thermal and mechanical stress simulation using finite element analysis. • Strong project management and problem solving skills required. • Able to work independently and interact with multinational team members. • Bilingual in English and Mandarin Chinese.