1. 掌握產品製程流程、連續製程之維持與改良 2. 分析製程數據,持續改進製程能力 3. 低良率分析,運用各類物/化性分析儀器及製程數據資料找出異常原因 4. 整合產品異常問題,提升品質良率 5. 缺陷、異常問題跨製程研判處理、追蹤及解決,8D Report撰寫 6. 製程產品管制點標準建立與管理 1. Master the product manufacturing process, maintain and improve continuous production processes. 2. Analyze process data and continuously enhance process capabilities. 3. Analyze low yield rates using various physical and chemical analysis instruments and process data to identify abnormal causes. 4. Integrate product abnormal issues to improve quality yield. 5. Evaluate and address defects and abnormal issues across processes, tracking and resolving them, and preparing 8D Reports. 6. Establish and manage standards for process product control points.
待遇面議
(經常性薪資達 4 萬元或以上)
1. 可獨立作業、態度積極進取,需跨部門溝通 2. 具以下相關能力佳:Cpk製程分析能力、撰寫報告(製程改善,異常分析)、品保稽核相關 (FMEA, Control Plan, intel自評, 8D Report)、數字分析 (SPC/Minitab/EXCEL)、專案彙整追蹤能力 3. 具PCB或半導體製程相關經驗者尤佳
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