Senior Project Manager Package Development

• A Master degree in Mechanical/Electrical/Material Science/ Physics disciplines or related qualifications. PhD is a plus. • Minimum 7 years of experience in semiconductor technology o manufacturing and assembly • At least 5 years of experience in leading complex development projects and IPMA C certification or equivalent. • A strong technical background and experience with advanced packaging technologies and assembly processes. • Knowledge in PCB manufacturing, Chip Embedding, Power Module packaging and assembly including related manufacturing processes is a plus. • Experience of working with or within semiconductor subcontractors. • Good understanding of quality requirements of semiconductor products, as well as packages. • The ability to work in and lead cross-functional and global teams in multicultural environment • Strong communication skills in English and Chinese, German is a plus Prefer first Location in Hsinchu , second location in Kaohsiung, third location in Taipei.