Principle Engineer - Packaging (FPGA)

We are seeking a highly motivated and experienced Principal Packaging Engineer to join our NPI Packaging team. You will be a member of the FPGA (Field Programmable Gate Array) Business Unit, which is a leader in research, development, and manufacturing of highly reliable non-volatile Field Programmable Gate Arrays. In this role, the candidate will be responsible for advanced semiconductor package development. The ideal candidate will have a background in semiconductor packaging and assembly, and a strong ability to collaborate cross-functionally, solve technical problems, and manage projects. Responsibilities: • Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages. • Work with business unit’s IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit’s roadmap for new products. • Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology. • Create package design documentation and assembly instructions. • Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology/structure development etc.) • Manage package qualification for commercial and automotive applications. • Coordinate with assembly vendors on new packages from development to high volume production.