散熱工程師 (Thermal Engineer) 台北

【工作職責 Responsibilities】 • 負責SSD相關產品的散熱設計與驗證 • 建立並維護熱模擬模型 (CFD, Thermal Simulation)，進行散熱分析、預測及優化設計 • 設計或與客戶共同開發散熱解決方案（如散熱片、VC、熱管、風道設計、液冷冷板等） • 支援 PCB/系統級的熱設計，包括器件分佈規劃、功耗預估、材料選擇與封裝散熱路徑設計 • 與電源、機構、硬體工程師跨部門合作，確保整體系統具備最佳的熱管理性能 • 撰寫並維護設計規範、測試計畫與報告，符合可靠度與國際標準 (如 JEDEC, IEC, OCP 規範) • 分析熱測試數據，提出設計改善建議，確保產品通過可靠性及壽命驗證 • Responsible for SSDs thermal design and validation of electronic products. • Build and maintain thermal simulation models (CFD, thermal analysis tools) for performance prediction and design optimization. • Design and develop thermal solutions, such as heatsinks, vapor chambers, heat pipes, airflow channels, and liquid cooling plates. • Support PCB- and system-level thermal design, including component placement planning, power estimation, material selection, and package thermal path design. • Collaborate with power, mechanical, and hardware engineers to ensure optimal system-level thermal performance. • Prepare and maintain design specifications, test plans, and reports in compliance with reliability and international standards (e.g., JEDEC, IEC, OCP). • Analyze thermal test data, provide design improvement recommendations, and ensure product reliability and lifetime validation. 【任職資格 (Requirements】 • 機械工程、熱流體工程、電子工程或相關科系學士以上學歷 • 具備 2–5 年以上熱設計相關經驗 • 熟悉熱模擬工具 (如 Ansys Icepak, FloTHERM, COMSOL, Thermal Desktop 等) • 熟悉 PCB、封裝、系統結構與材料的熱特性，能與跨部門協作進行系統級熱管理 • 了解常見散熱元件 (散熱片、熱導管、VC、TIM、風扇、液冷方案等) 的設計與應用 • • 熟悉實驗室量測儀器 (熱電偶、IR Camera、功耗分析設備) 及相關熱測試方法 • 具備良好問題分析、數據處理與報告撰寫能力 • 英文能力佳，能閱讀技術文件並與國際供應商溝通 • Bachelor’s degree or above in Mechanical Engineering, Thermal/Fluid Engineering, Electrical Engineering, or related field. • 2–5+ years of experience in thermal design. • Proficiency with thermal simulation tools (e.g., Ansys Icepak, FloTHERM, COMSOL, Thermal Desktop) . •Solid understanding of PCB, packaging, system structures, and materials’ thermal properties; capable of system-level thermal collaboration with cross-functional teams. • Knowledge of thermal components such as heatsinks, heat pipes, vapor chambers, TIMs, fans, and liquid cooling solutions. • Hands-on experience with thermal measurement instruments (thermocouples, IR cameras, power analyzers) and related testing methods. • Strong problem-solving, data analysis, and technical reporting skills. • Good command of English for reading technical documents and communicating with international vendors. 【擅長工具】 Ansys Icepak / FloTHERM, IR Camera, 熱電偶 【工作技能】 CFD 模擬, 散熱件設計, 熱測試驗證, 材料與封裝散熱 【加分條件 Preferred】 • 有伺服器、儲存裝置 (SSD, HDD, CFexpress, E1.S/E3.S 等) 或高效能運算系統散熱設計經驗 • 具備液冷或兩相散熱方案的實際開發經驗 • 熟悉 JEDEC JESD51、OCP v2.6、SNIA 或 PCIe/DDR 等相關熱測試與規範 • 具備跨國團隊合作或客戶端技術支持經驗 • Experience in thermal design for servers, storage devices (SSD, HDD, CFexpress, E1.S/E3.S), or high-performance computing systems. • Practical experience in developing liquid cooling or two-phase cooling solutions. • Familiarity with JEDEC JESD51, OCP v2.6, SNIA, or PCIe/DDR-related thermal test standards. • Experience in cross-national collaboration or providing technical support to customers.