Semiconductor Packaging Engineer, Up to Senior Staff (3078479)

【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表:https://qualcomm.wd12.myworkdayjobs.com/External/job/Hsinchu-City-TWN/Semiconductor-Packaging-Engineer--Senior-Staff-Engineer_3078479 Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and cross-functional teams. Team is looking for experienced packaging engineer who has developed with various packaging technologies Flipchip, CSP (Chip-Scale Package), PoP (Package-on-Package), SiP (System in Package), Module package. etc. Some management and integration lead experience will be a plus. • Responsible from exploring, development and HVM deployment of FCCSP, PoP and/or SiP/Module packaging technologies. • Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products. • Interface with OSATs, substrate/ material suppliers, tooling makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment. • Associate with internal design team and drive DFM methodology for new technologies. • Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging. • Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management and share with cross team members. • Good knowledges to SPC/QC concepts, failure analysis process techniques, manufacturing floor operations and Quality issue handlings.