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「PA0306 伺服器機構設計工程師/高級工程師(內湖)」的相似工作

仁寶電腦工業股份有限公司
共500筆
10/04
慶堂工業股份有限公司金屬結構及建築組件製造業
台北市松山區5年以上大學以上
1. 具5年以上設計開發工作經驗,使用SolidWorks繪製較複雜(例如不規則曲面)產品機構零組件(含組件圖、爆炸圖、依新品結構自建BOM表)。 2. 具備完整ISO 9001設計研發流程觀念,可依程序自行建置需求文件,熟悉建料號、BOM、設計變更…相關作業者。 3. 負責分析既有產品之研改設計能力,以提高產品效能,並提供跨部門之技術性支援。 4. 具優越的思考邏輯和溝通應變能力,可獨立完成業管工作。 5. 對公差配合、圖規標示可依實需判斷,並能在2D藍圖完整正確標註。 6. 負責各研發專案進度管控。 7. 主管交辦其他事項。
應徵
09/30
富世達股份有限公司其他金屬相關製造業
新北市新莊區1年以上大學以上
1. 3C產品與車用設備之機械結構設計與開發,主要為水冷接頭、滑軌及轉軸等。 2. 創新技術的開發及專案量產導入。 3. 樣品組裝與結構驗證及現有產品之問題分析及對策探討。 4. 打樣、試模、試產(SIP、SOP、PMP、DFMEA等編寫)。 5. 產品不良問題分析與對策驗證。 6. 沖壓、壓鑄、MIM模具設計檢討與改善。
應徵
09/30
緯創資通股份有限公司電腦及其週邊設備製造業
台北市內湖區5年以上大學以上
1. 伺服器產品之機構設計及文件資料維護 2. 3D和2D圖檔新增及維護 3. 機構件模具DFM檢討及試模 4. 機構件之GPM及樣品承認 5. 試產、組裝驗證、量產之機構設計確認及分析 6. PCB Design with EE & Layout
應徵
05/24
新北市中和區2年以上大學以上
1.與客戶溝通設計需求 2.風扇裝配圖繪製 3.風扇特性設計與測試 4.測試數據分析與異常處理 5.風扇外觀設計 6.風扇樣品製作 7.風扇BOM表建立 8.專案進度追蹤 9.客戶端與工廠端協調 10.配合大陸出差 具 AC/DC FAN或散熱系統相關工作經驗佳 熟 散熱/伺服器/車載巿場優
應徵
09/30
Advantech_研華股份有限公司電腦系統整合服務業
台北市內湖區8年以上大學
職務介紹: 我們正在尋找一位伺服器機構研資深工程師,專注於設計與優化伺服器產品的結構解決方案,滿足高性能計算(HPC)與人工智慧(AI)應用的需求。此職位將直接參與伺服器產品的研發,協助提升產品設計的效能、可靠性與製造效率。 主要工作內容: 1. 產品架構規劃、機構設計與開發(2D/3D圖面繪製) 2. 產品樣品發包與確認 3. 開模、試模與模具檢討 4. 產品機構相關功能驗證及測試 5. 協助產品導入試產、量產 6. 工廠端生產技術移轉、量產產品問題分析以及對策導入 7. 已量產專案設計變更需求及維護 人才需具備: 1. 工作經驗:8年以上機構研發專案經驗 2. 學歷要求:大學、碩士 3. 科系要求:機械工程相關 4. 擅長工具:SolidWorks 5. 工作技能:具塑膠、板金、壓鑄、鋁擠型材料設計能力 6. 其他條件:具備良好的團隊協作精神和溝通能力
應徵
10/01
群光電子股份有限公司電腦及其週邊設備製造業
新北市三重區1年以上專科以上
1. 手提式鍵盤按鍵產品之組立結構設計圖和零件圖之設計與審查。 2. 手提式鍵盤按鍵產品之結構開模、檢討、修正和量產確認核可。 3. 手提式鍵盤產品之按鍵結構核心技術研發、修正和確認核可。 4. 鍵盤新材料的設計運用。
應徵
10/01
富智康國際股份有限公司消費性電子產品製造業
新北市土城區經歷不拘碩士以上
FIH富智康作為全球移動通訊設備領導廠商, 並持續擴展多元商業機會, 產品專案項目多元發展,包含:手機、聯網通訊產品,目前正積極發展車用業務,您有機會可參與ODM/OEM大型國際客戶專案,不僅可強化個人與國際客戶合作溝通實務,亦可促進技術交流接軌。若您具備這些特質:執行力、整合力及追求效率,歡迎您加入FIH 車用團隊。 1、主要產品:車用、通訊(手機、5G網通) 2、負責機構相關設計與規劃, 針對新技術研究與評估開發; 3、負責與專案組員, 供應商, 生產工廠等各相關單位進行協調溝通; 4、針對專案各階段與環節發生之問題進行原因解析與改善方案導入解決;
應徵
10/02
Inventec_英業達股份有限公司電腦及其週邊設備製造業
台北市士林區2年以上大學
1. Desktop, AIO, Workstation, Thin Client產品資料蒐集、內部零件位置圖討論與建立。 2. 建立3D 機構模型/2D工程圖面。 3. 手工模型製作與檢討、開模、試模檢討與修模、機構相關事項處理。 4. 組裝、機構相關問題分析、解決及改善等。
應徵
09/30
精英電腦股份有限公司電腦及其週邊設備製造業
台北市中山區2年以上大學
1.負責PCBA 板子堆疊排列與設計方案提出 2.能完成系統結構 3D 設計、爆炸圖與公差尺寸檢討 3.模具DFM 開發檢討並跟蹤模具進度至 MP 階段 4.協助產品驗證測試達到客戶指定條件。
應徵
09/30
仁寶電腦工業股份有限公司電腦及其週邊設備製造業
台北市內湖區經歷不拘大學
1. NB主機板之電路設計、掌控線路及layout 2. 訊號量測及異常分析、排除 3. 線路圖檢查與問題修正 4. 協助工廠提升產品良率 ※依學經歷、工作年資敘薪
應徵
10/03
新北市樹林區經歷不拘專科
1. 繪製2D&3D機械零件圖 2. 詢價&發包機械零件 3. 熟悉2D&3D軟體 4. 機械相關科系尤佳
應徵
10/02
新北市汐止區5年以上碩士
【About us】 We are part of Garmin global design team and are based in Taiwan. Our job is in charge of Garmin consumer products from concept model to product delivery. Perform the mechanical design by innovation, collaboration and validation. We’re looking for the talent who has passion and professional skills. 【Responsibilities】 • Work closely with cross function team during all phases of product development. • Design and create assembly architectures to integrate mechanical, electrical, industrial design and manufacturing requirements. • Communicate ideas and design specifications through 3D model, 2D drawing, prototypes, sketches and slides. • Drive mechanical design reviews and drawing releases for all mechanical components in the product. • Solve mechanical problems during product development. Iterate quickly on prototypes, tests and refine cycles. 【Qualifications】 - 5+ years of hands-on experience in mechanical design of consumer electronics products. - Proficient in 3D CAD modeling software and workflow such as Solidworks. - Experience in Design for Manufacturability (DFM), and Design for Assembly (DFA), statistical tolerance analysis techniques, functional dimensioning, and GD&T with focus on high volume manufacturing. - Strong technical background with knowledge of manufacturing processes and mechanical engineering fundamentals;prior experience with metal stamping, forging, machining (CNC), die casting, plastic injection and compression molding is highly desirable. - Excellent communication, organization and leadership skills across cross-function teams. 【Preferred qualifications】 - Experience with wearables or ergonomically-sensitive products - Has taken at least one product from concept to completion as a PD / mechanical engineer - Wide knowledge of engineering materials. - Passion for solving wide range of difficult problems with superior solutions. - Resilience and flexibility when faced with uncertainty and changes in direction.
應徵
07/31
艾知科技股份有限公司電腦系統整合服務業
台北市內湖區經歷不拘大學以上
1. Design components and sub-assemblies for aiseed’s existing and future drone / aircraft 2. Be responsible for aircraft sub-assemblies from prototype through EVT/DVT/PVT, and support Manufacturing. 3. Create drawings, BOMs and specifications 4. Ability to work independently, communicate effectively across functional teams, navigate complex trade spaces, and to keep technical projects with tight timelines on track 5. Support schedule/budget development and coordinate with program management 6. Design for user experience of mechanical test systems * experience in drone design is preferred * 無人機相關經驗尤佳。
應徵
10/03
康舒科技股份有限公司其他電子零組件相關業
台北市北投區經歷不拘大學
1.機構設計製圖 2.新機種設計提案及成本估算 3.機種量產準備及文件圖面發行 4.料號申請及BOM建立 5.執行機構類振動、衝擊、噪音、防水防塵…等測試
應徵
09/30
台北市內湖區經歷不拘大學
主要職責 : 1. 執行機構設計類零部件結構/功能設計。 2. 規劃與執行機構設計類產品BOM手稿提供與確認。 3. 規劃與執行機構設計類零件材料選用及供應商導入。 4. 執行機構設計類工程/設計變更。 5. 執行專案進度管理。 6. 執行新產品開發。 *歡迎無經驗新鮮人應徵*
應徵
09/30
光寶科技股份有限公司消費性電子產品製造業
新北市中和區3年以上大學以上
我們是AI伺服器電源領域專家,是Green Data Centers的成長引擎,立基全球。現在招聘一位電源機構工程師加入精英團隊,工作內容如下: 【職務描述】 1. 機構零件設計與PCB 尺寸規劃 2. PCB gerber check 與3D model 建構並檢驗組裝干涉 3. 出工程規格圖並與廠商討論零件製作問題 4. 機構相關文件作業並上傳系統 5. 跨部門解決DFX問題 6. thermal, acoustic noise, shock & vibration 問題解決 7. 須配合工作需求短期出差 【我們提供】 • 充足的升遷、學習及成長機會,和光寶一同成長。 • 具有競爭力的薪酬、獎金及福利待遇。 • 充滿活力的工作環境、開放的企業文化和豐富的員工活動。 加入我們,你將與頂尖技術人才合作,扎實提升自己的技能,為業務做出實際貢獻並展開充滿激情的事業之旅。如果你對此職缺感興趣並符合以上要求,請立即投遞簡歷,我們期待你的加入!
應徵
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
新北市三重區3年以上大學
Your Job Molex is seeking an experienced mechanical Engineer to design our industry leading high-speed connector/cage for our big data and hyperscale customers. These creative, high-tech leading-edge components are critical for the data superhighways existence we use every day changing the world. Here at Molex we are leading the industry, with our smart data solutions to solve our customers’ toughest challenges. In this highly visible engineering position, you will join a team of professionals who are passionate about delivering the best products in the world to the market. Our team The New Product Development team in Datacom & Specialty Solutions (DSS) division. Project stakeholders: Product Development Engineering team, PM, MIE, Sourcing and Quality etc. from BU and Operation teams at multiple-locations. What You Will Do (Job Description) • Need to engage and collaborate with specialized cross-functional team members in signal integrity teams, manufacturing integration teams, program management, sales organizations, manufacturing and senior leadership teams. • Ability to create/modify 3D models, drawings and BOMs. • Perform mechanical design analysis, simulation, test reports and eliminate design mistakes. • Perform measurements, testing on products to ensure product performance. • Perform other related assignments. Support Manufacturing and Quality Assurance during product launches and have travel opportunities to visit our manufacturing sites and meet the global team. • Follow product development process, cooperate with cross functional team and ensure time to market. • Support sales and marketing to communicate with customers to solve engineering issues. • Help lead suppliers, evaluate and implement new technologies and methodologies to enable next generation products, improve cost and quality, and improve New Product Development (NPD) engineering processes. Who You Are (Basic Qualifications) • Bachelor’s degree or 5+ years of experience working in machinal design. With ability to file patent is not subject to 5 years’ limit. • Mechanical Engineering, Molds and Dies Design Engineering. • Design experience with connectors, notebooks, sheet metal products, light pipes, thermal solutions. What Will Put You Ahead • 2nd Language: English. Be able to join global meetings in English. • 3D /2D CAD skills: NX (preferred), Creo, SolidWorks, AutoCAD etc. • Drawing skills: Experience in GD&T and product drawings. • Design skills: Tolerance analysis, DFM, Experience with FEA. • Knowledge in molding, stamping, PCB, plating, assembly process, product development process.
應徵
09/30
廣達電腦股份有限公司電腦及其週邊設備製造業
桃園市龜山區經歷不拘大學
1. 伺服器機構開發設計、試產至量產。 2. 機構有關之issue分析及解決。 3. 新產品之評估及開發設計。
10/01
Molex Taiwan Ltd._台灣莫仕股份有限公司電腦及其週邊設備製造業
台北市信義區8年以上大學
PRIMARY PURPOSE: We are seeking individuals who are proactive, humble, unafraid of learning new things, and have the potential for growth. The R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. You are responsible for designing and optimizing a product or create valuable or quality of product that will scale with Molex continued growth. As a Product Design Engineer, you will design and evaluate product, identify product requirements and contribute to research and project planning. DUTIES AND RESPONSIBILITIES: 1. Apply design, engineering, and technical expertise to influence cross-functionally and deliver reliable mass production components and solve time-sensitive problems. 2. Make significant contributions to design, development, and validation of different solutions (Specifically focused on the cooling solution for the cage and the design of the connectors.) 3. Manage the product design, provide guidance to team members, and communicate progress, and request feedback to prevent/remove roadblocks. 4. Anticipate and address product design issues or risks, analyze data, and validate product design to suggest or implement design improvements. 5. Conducts feasibility studies for new projects leveraging existing designs while also generating new designs and IP, drives consistency and thoroughness across portfolio. EDUCATION Required: Bachelor’s degree in mechanical engineering, Process Engineering, Manufacturing Engineering or equivalent practical experience. Required Experience and Skills:  8~10+ of work experience as a hands-on engineer.  Possesses thorough understanding of the product development process (Design Concept, EVT, DVT, PVT).  Demonstrated experience working with cross functional teams in English.  Engineering Design Software: NX (preferred), Creo, Pro/E, etc.  Knowledge in molding of different kind of materials, stamping, assembly process, product development process.  Ability to independently complete design and manage projects.  Understand thermal and mechanical of liquid cooling system.  Good problem-solving skill and able to deeply analyze testing failure mode.  Tolerance stack-up Analysis, review thermal, and reliability testing report. Desirable Requirements:  Experience in server or switch liquid cooling systems.  Experience in the high-speed connector industry.  Relevant knowledge of seal product design.  Experience with simulation or performance analysis of liquid cooling thermal solutions, precision machining, brazing (furnace, vacuum), molding (plastic & metal), soldering, stamping/assy, welding or sintering processes.  Passionate about design work and innovation, creating new products to address gaps in the industry.
應徵
09/29
桃園市龜山區3年以上大學以上
職務影響力 身為電池機構工程師,你將致力於使用科學方法提升設計與解決問題,對於未知,從發想、設計到落實量產,建立假設、規劃實驗以求取答案,建立解決方案。透過與供應商、製造、品質團隊合作,制訂規格、開模生產、確保來料正確性、技術轉移及成品可靠度,同時協助取得各類國際認證,推動Gogoro能源網絡至世界各地。 職務說明 1. 利用機械工程知識結合實務應用,分析電池設計開發過程中的問題。 2. 設計測試實驗並根據實驗結果確認問題根因,建置長效能、系統性的解決方案,避免再發。 3. 制定電池機構規格,使用3D繪圖工具繪製圖面,將設計確實標準化,撰寫開發文件,作為產品準則。 4. 與製造單位合作,進行高品質自動化生產導向的設計方案,提升設計量產性。 5. 與開發、製造、品質等團隊有效地共享資訊,以能源交換系統格局考量,建立跨部門協作關係,共同創造設計上的最佳方案。 資格條件 1. 機械工程相關背景,對機構設計懷抱熱忱。 2. 具備基本電子電路知識,若有熱流、結構分析相關經歷者佳。 3. 具備資料搜集統整能力,並有進行重複測試驗證的耐心。 4. 具備操作設計繪圖軟體能力,如Creo Parametric、ProE、AutoCAD,若具備操作分析工具能力,Python、Matlab者佳。 5. 具備英文聽說讀寫中等能力。
應徵