「Senior Electrical engineer【Conferencing】」的相似工作

1. HW system block diagram and board schematic design. 2. Define and check Layout placement and rule. 3. HW platform debugging, investigations, maintenance, alternative components survey and failure analysis. 4. Support documentation for projects.

⚫ Design server system and relative boards and review high-speed PCB layout. ⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Come out test plans to ensure base function of hardware. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management topology. ⚫ Support manufacturing teams during the production phase.

【公司簡介】 LSC Ecosystem 的使命是在電動載具價值鏈上扮演關鍵領航者，你想對產業發揮自己的影響力嗎？在這裡你能夠有機會在電動載具的產業裡，串連軟體與硬體、協助傳統邁向未來，過程絕對不簡單，但是旅程保證很精彩。你喜歡新創充滿未知與挑戰的吸引力嗎？加入 LSC 和我們一起打造電動載具產業的霸業！ 【Responsibilities】 • 根據車輛需求，設計、開發和測試EV應用中的系統架構相關的電氣組件集成，以及創建、改進、解釋和實施電氣標準。(系統設計) • 開立規格需求及管理供應商硬體設計，並審核關鍵設計、DFMEA及電磁干擾等法規需求 (部件供應商設計管理) • 動力電池、馬達控制器、馬達、充電系統等高壓系統整合設計、規劃及驗證 • 常備電池、DCDC直流轉換器、VCU等低壓系統整合設計、規劃及驗證(次要) 【Requirements】 • 有電動車EV相關(HEV、PHEV、BEV、FCEV)工作經驗者優先錄取 • 有電機電子(動力系統、充電控制系統、電子控制系統)驗證及功性能的量測經驗者優先錄取 • 熟悉電子電氣法規及相關驗證經驗者優先錄取 • 有電裝件供應商合作經驗者佳 • 熟悉電子學、電路學，對I/O驅動線路有設計經驗佳 • 熟悉電源IC、電力電子應用及對功率損耗有經驗者佳 • 熟悉車用法規ISO 26262、IATF 16949者佳 【Preferred Skills】 • 熟悉電力電子、硬體選件與電路設計 (必要) • 控制理論、數位控制、馬達控制 (次要) • 使用 Altium 或 OrCAD 之 PCB 佈局軟件的經驗(次要) 【Special Requirement】 • 出色的溝通和組織能力，能夠處理多個項目和任務並確定其優先級，同時向關鍵利益相關者通報進展情況

1. X86 / ARM base 主板/周邊線路規劃、設計開發、測試驗證 2. Panel PC訊號量測、分析，方案評估與相關技術問題對策 3. OEM/ODM 專案評估與整合 4. 工廠生產異常問題分析與解決

1. 負責無線藍芽耳機、可攜式藍芽音箱...等聲學產品設計。 2. 客戶產品規格之可行性評估、元件選用、規格與效能評估、新技術平台前期評估。 3. 電路圖繪製，PCB Layout review/check。 4. 支援試產、生產測試規範訂定、產線良率改善與測試問題分析。

1. 硬體系統研發設計、電子電路設計。 2. CPLD/FPGA硬體電子電路相關設計。 3. 評估部件、裝置或系統的性能、撰寫HW規格說明和EMC驗證。

1.類比訊號分析及電路設計。 2.小信號低雜訊放大線路的設計、模擬、量測及驗證。 3.熟悉OPAMP, Filter, ADC/DAC,… 規格, 性能特性及應用。 4.電子電路硬體的設計、驗證，失效分析和故障排除 5.萬潤熱烈招募有意投入設備產業的菁英，如未具備本項職缺所需相關技能與工作資歷者 亦歡迎投遞，薪資另議。 6.上班地點 新竹：新竹市工業東四路24-2號2樓 /新竹縣竹北市保泰三路 78 號 台中：台中市西屯區工業區37路18號 高雄：高雄市路竹區路科十路1號

- Camera module design - ARM based SoC system design using nVidia, Ambarella, NXP, QUALCOMM platform. - Edge AI camera design integrated with 2D/3D camera, Wifi, PoE, Display and battery. - 硬體研發及測試技術: 1. 硬體線路設計驗證及除錯 2. 高速數位訊號量測及分析 (MIPI-CSI or DSI, Wi-Fi or BLE 4.0) 3. PCB Layout檢查及驗證 4. BOM表建立與檢察 5. 其他主管交辦事項 工作地點: 桃園市楊梅區中山北路一段199巷21號3F 或 桃園區幸福路202號8樓

公司正大幅成長, 薪資優於同業, 歡迎電力電子 有想法 想要一展長才的研發人員加入 1. 電路設計、元件選取、線路圖規劃； 2. 量測控制&通訊訊號、功率元件時序、EMC測試； 3. 配合產線制定測試規格、改善產線生產效率； 4. 新產品所需新零件、新材料引進及承認測試執行； 5. 新產品認證(安規、EMC)問題解決及對策擬定； 6. 工程樣品試作、組裝、測試。

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to the next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons, all while shaping the future of connectivity. Role Summary As a Hardware Engineer at UI, you will be responsible for the electrical design of consumer electronic products. We are looking for candidates who thrive in a fast-paced start-up-like environment. In this role, you will be the owner of all aspects of EE hardware design, including circuit/board design and validation. To be successful, you need to be highly motivated and detail-oriented while showing the highest standards of responsibility. Responsibilities - Design UI’s future products by owning architecture selection, electrical design, and validation. - Direct and review PCB layout and electrical simulation teams. - Design validation: complete functional verification, signal characterization, power modeling/test, and system coexistence testing. - Troubleshoot, debug, and resolve issues during development, including factory prototype builds. - Bring your design to mass production by setting factory test requirements and assisting in software bring-up. Minimum Qualifications - BS degree in electrical engineering or related field - 5+ years of hands-on experience in consumer electronics/embedded systems design, prototyping, bringing up, debugging, functional verification, and NPI support, DFx (Design for cost, test, manufacturing) experience - Experience with Cadence OrCAD, Allegro, PADS, or equivalent. - Electrical engineering or design experience in one or more of these areas: SOCs/MCUs, -- Power Management, Signal Integrity, and/or Analog/RF. - Knowledge of PoE converters, DC/DC converters, power management methods, audio circuit design, high-speed, and analog circuit design - Knowledge of processor architecture, digital circuit design, and various communications protocols such as I2C, UART, SPI, Ethernet, and USB, etc. - Knowledge of developing robust designs for ESD, EMI immunity, and RF Desense. - Ability to be hands-on in the lab and want to be in the details (soldering, oscilloscopes, data acquisition). - Team player with good communication skills Preferred Qualifications - Master's degree in electrical engineering or related field. - Knowledge of high-speed digital interfaces such as PCIe, DDR3/4, MIPI, LVDS, etc. - Experience with analog design, low power design, audio acoustics, various RF technologies (such as WiFi/BLE/ Zigbee/NFC) - Experience with physical characterization of sensors such as light sensors, ToF sensors, Temperature sensors, Radar sensors, G-sensors, etc.

1. 電子產品硬體設計開發與研究 2. 電子產品硬體驗證與除錯 3. 工廠端試產支援

1、影像產品硬體設計執行 2、影像產品問題點分析 3、硬體設計測試及驗證 4、生產驗證 5、生產問題排除 6、零件承認 7、BOM表製作與核對 8、系統穩定性相關測試

The Hardware Test Engineer provides crucial hands-on technical support for production test systems. This role is responsible for independent execution of issue triage and in-depth troubleshooting of production fallouts. This engineer will also actively contribute to yield improvement initiatives and assist with the development, validation, and maintenance of tester stations and fixtures. Minimum Qualifications: ● BS or MS degree in Electrical Engineering, Electronics Engineering, or a related field. ●0-1 years of practical experience in electronic manufacturing or related hardware testing environments. ● Proficiency in digital and analog circuit analysis, PCBA bring-up, and systematic troubleshooting of test failures. ● Solid command of EE lab instruments (e.g., oscilloscopes, DMMs, power supplies) and proven ability to apply these skills to solve production problems. ● Demonstrated ability to work independently on assigned tasks and communicate technical findings clearly. Preferred Qualifications: ● Foundational experience with PCBA and module failure analysis (FA) techniques. ● Familiarity with production data analysis and simple process improvement methodologies. ● Experience with Linux operating systems in a testing or manufacturing environment. Responsibilities: ● Execute and own the PCBA and module troubleshooting, bring-up, and rework processes from start to finish. ● Maintain and update product troubleshooting procedures and guides as needed. ● Analyze failure data to provide detailed failure analysis findings and clear root cause hypotheses to the test development team. ● Serve as the primary on-site technical contact for manufacturing partners, rapidly triaging production line issues and driving immediate containment actions. ● Collaborate with cross-functional teams (e.g., HW Design, Manufacturing) to ensure test integrity and high product yield.

Key job responsibilities: • Minimum 10 years of technical working experience, and knowledge of consumer, enterprise, and handheld product design • Expertise in embedded system design, system PWR architecture, and related electrical design skillset & knowledge • Expertise in electrical engineering and knowledge of multiple related areas (e.g. SoC architecture, DCDC power design) • Expertise in electrical engineering and knowledge of multiple related areas (Signal Integrity/Power Integrity, and various communications protocols such as I2C, UART, SPI, USB, MIPI, I2S, etc. • Familiar with battery knowhow experience, and power budget estimation. • Experience and familiarity with lab equipment including oscilloscopes, current/voltage probes, power meters, data loggers, and electronic loads.

1. 各電腦週邊界面產品設計。 2. 類比及數位影像介面應用（VGA / DVI / HDMI / DP / MHL）。 3. 產品規格及系統設計規劃（LCD KVM）。 4. 產品電源及訊號量測。 5. 生產問題技術分析與協助。

The Sr. Staff/Staff Engineer, Power PSU/BBU/ESS will be based in Taiwan Taipei Wugu Site. These roles perform the responsibility for system design in Tier 1 customer's BBU/ESS Projects request. What a typical day looks like: • Design high power density AC/DC and DC/DC BBU (Battery Backup Unit) system for server, telecom, datacenter and industrial application. • Support RFI and RFQ and provide design proposal. • Provide BBU design solution to implement design review with customer • Experience in leading R&D team is preferred • Component standardization, optimize design and deep drive on cost reduction • Overall project responsibility in all aspects on EE design related- from project kick off to end of M.P. • Tolerance analysis & simulation and Issue solving The experience we are looking to add to our team: • Bachelor or above degree in electronics or electrical • 8+ years' experience for PSU, UPS, BBU or EV charger design • Be highly passionate and interested in BBU development and capability of team work in multi-task environment • Solid understanding of software implementation/design experience is required. • Capability of independent research and working with new technologies is required. • Excellent written and verbal communications skills (in Mandarin and English) is required. • With strong sense of responsibility (be able to go on business trips, dispatch overseas is preferred) The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

1. In-depth knowledge of PCB layout, OrCAD/Allegro tools, circuit design, and PCB structure. 2. Prepare technical documentation including product specifications, layout instructions, test procedures, etc. 3. Transfer products to manufacturing with clear documentation and help C.M. and technical support to solve problems. 4. Hardware engineer need co-working with PM, BIOS, IPMI, EMI, Thermal, ME RD friendly. Need have good team work. Need to have the concept of project ownership. 5. Need have power VR and component design knowledge 6. Resolve complicated issues and drive to root cause on critical engineering problems

Responsibilities include: 1. Act the staff/sr. role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

職務介紹： 做為一名硬體研發工程師，您將負責產品評估、硬體規劃及設計，Layout佈局及走線檢查，電子電路訊號量測及除錯系統設計，零件料號申請、BOM表建立與修改，以及專案技轉量產，品質分析等。主要產品為Intel /AMD Server, x86 Motherboard, ODM專案等產品開發。 職務匯報： 此職務會匯報於研發主管 主要工作內容： 1. 電子電路之研發，新產品設計，硬體除錯，良率提升等工作 2. 硬體線路及工程樣品製作 3. 研發新產品，改善現有產品，改善作業流程 4. 與客戶或公司的硬體部門的同仁共同研發或解決問題 5. 舊專案維護或改良，BOM變更與維護 人才需具備： 1.工作經驗：3年以上Server/PC/Notebook相關產業x86硬體研發經驗為佳 2.學歷要求：大學、碩士 3.科系要求：電機電子工程相關為佳 4.語文條件：英文(讀:中等、寫:中等) 5.擅長工具：擅長OrCAD, Allegro 等EDA軟體、Microsoft Office 軟體和示波器、電表等儀器之操作 6.工作技能：電子零件及電子線路解析能力 7.其他條件：細心、思考靈活，積極主動，良好的溝通能力，富有團隊合作精 神以及強烈的學習意願也是我們重視的條件。

▋ 關於德州儀器 德州儀器(TI)是位居類比晶片世界領導地位的半導體設計與製造公司，持續提供創新及頂尖的半導體技術與產品，協助客戶開發最先進的電子產品。除此之外，TI也針對在校學生及初入社會新鮮人設計完整的培訓制度與挑戰性的工作內容，並提供具競爭力的薪資與福利、完善的升遷管、輪調培訓計畫以及活潑與國際化的工作環境。 ▋科技菁英計劃 - TI 應用工程師輪調培訓計畫 有思考過RD、IC設計之外的另一種職涯可能嗎? 喜歡與人互動並充滿挑戰的工作卻又擔心新鮮人無法立即上手嗎? 別擔心! TI針對FAE新鮮人提供海內外全面且扎實的系列培訓課程， 透過課堂及工作日常的任務的學習，您將具備FAE應具備的各項知識與技能，在客戶面前成為專業與自信的FAE！ 另外，TI亦提供完整的輪調計劃，透過給予新人不同職務內容的學習， 使其能在公司有更多成長及發展的機會。 ▋ 應用工程師職務說明 >>在TI做FAE，您可以… • 參與FAE完整培訓計畫，包含1對1 coach、豐富教育訓練資源 • 與全世界技術專家合作，參與跨國會議及海內外輪調計畫，在國際舞台成長 • 接觸TI多元產品線，包含熟悉的#消費性電子、時下最夯的#車用電子 ，以及工業用等產品，共超過8萬顆產品，學無止境！ • 透過專案及團隊合作，快速累積技術硬實力及溝通軟實力 • 享受開放扁平的組織氛圍，不論是專業領域或職涯發展，都能夠勇敢表達 • 走出多元職涯，不論是技術導向的技術專家(technical ladder program) 或是領導團隊的用人主管，TI提供暢通的升遷管道讓您有機會被全世界看見 >>FAE在做什麼 作為“Technical Expert”，與Technical Sales Engineer併肩合作，了解客戶的技術需求、解決客戶的技術痛點，將TI產品特性與客戶系統需求聯結起來。運用產品選擇、系統、實現和調試方面的技術能力，從而實現業務目標。 • 積極與客戶建立關係，及時掌握客戶開案訊息，進而瞭解其需求與系統設計，推展TI的產品讓客戶的設計更有市場競爭力。 • 透過TI全球技術資源，提供專業技術服務，解決TI產品應用在客戶系統上的技術問題，協助客戶順利導入量產。 • 了解TI系統及產品，並研究同業競爭的狀況，反應客戶需求及市場資訊給研發團隊做為未來產品開發的參考。 看更多徵才資訊與FAE工作介紹=> https://www.facebook.com/texasinstrumentsTW/videos/1382188632429211 歡迎至https://www.cakeresume.com/resources/texas-instruments?locale=zh-TW 看更多內容 #R&D外的另一種選擇 #IC Design的另一種選擇 #結合技術及與人溝通 #探索不同產品之技術與應用 #走出多元彈性的職涯 #年薪(含紅利)百萬起跳 ▋ 面試準備: • Phone interview: 1. 對德州儀器及此職務的了解: o 針對德州儀器的業務範圍或是德州儀器在台灣的業務發展 2. 投遞動機 o 針對此職務為什麼想要投遞 o 對職務的了解程度 o 未來工作發展方向 • 第一關面試準備: 1. 英文自我介紹 2. 簡報(碩論題目或是DC/Amplifier介紹) • 第二關面試準備: 1. 針對工作內容了解 2. 職涯發展方向 3. 情境考題