「Design Engineer 【WBG BU】」的相似工作

Overview: The Senior High Voltage LNDMOS Device Engineer at Diodes, Inc. leads the design and development of advanced power semiconductor devices. This role focuses on enhancing LNDMOS technology to deliver reliable and efficient solutions for automotive, industrial, consumer, and renewable energy applications. By combining device physics with practical manufacturing, the engineer ensures high-performance products that meet industry standards. Key Responsibilities: • Device Design: Develop high-voltage LNDMOS devices using CAD/TCAD tools, optimizing performance and reliability. • Process Integration: Work with process teams to define fabrication flows and ensure manufacturability and yield. • Characterization: Conduct electrical and reliability testing; analyze data to improve device performance. • Technology Innovation: Explore new structures and materials to enhance LNDMOS capabilities. • Failure Analysis: Investigate device issues using diagnostic tools; provide solutions and improvements. • Cross-functional Collaboration: Coordinate with design, process, test, packaging, and product teams. • Documentation: Prepare technical reports and present findings to stakeholders. • Product Qualification: Support reliability testing and ensure compliance with standards. • Yield & Cost Optimization: Analyze production data to improve yield and reduce costs. • Technical Support: Assist application teams and customers with device integration and troubleshooting. Qualifications: • At least 10 years in power semiconductor device engineering, focusing on high-voltage LNDMOS or LDMOS design and fabrication. Experience with IGBT or SiC/GaN MOSFETs is a plus. • Skilled in device/process simulation tools (e.g., Sentaurus, Atlas). • Solid understanding of semiconductor physics, breakdown mechanisms, and reliability. • Practical experience in wafer fabrication, cleanroom operations, and device testing. • Familiar with advanced failure analysis tools and techniques. • Knowledge of reliability standards and ruggedness requirements. • Proficient in statistical analysis and data-driven problem solving.

Overview: The Senior TCAD Engineer will be a key member of our technology development team, responsible for advanced modeling and simulation of semiconductor devices and fabrication processes. This role involves defining and executing TCAD projects for novel device architectures, optimizing performance, and analyzing results to guide process integration and design teams. Key Responsibilities: • Develop and validate TCAD models for advanced technology nodes. • Run simulations to assess device performance (IV, CV, breakdown, reliability). • Interpret results to guide design and process improvements. • Collaborate with engineering teams to align on technology roadmap. • Act as TCAD expert and provide technical support. • Automate simulation tasks using scripting (Python, Perl, TCL). • Compare simulations with silicon data and resolve discrepancies. • Prepare technical reports and present to cross-functional teams. • Stay updated on TCAD trends and enhance modeling capabilities. • Mentor junior engineers and contribute to IP development. Qualifications: • 5+ years of hands-on experience in TCAD process and device simulation within the semiconductor industry. • Deep understanding of semiconductor device physics and fabrication processes. • Expertise with commercial TCAD simulation tools such as Synopsys Sentaurus or Silvaco Atlas. • Proficiency in scripting languages (e.g., Python, Perl, TCL) for tool automation. • Experience with analog focused process technologies, particularly high voltage transistors such as drain extended CMOS or LDMOS devices.

Overview: This role is responsible for leading new product initiatives, crafting detailed datasheets, and fostering cross-departmental collaboration. The ideal candidate possesses a deep understanding of IC/MOSFET fabrication, semiconductor testing, and is adept at navigating Power industry nuances. Strong communication skills and self-motivation are paramount. Key Responsibilities: • Steer new product development processes, ensuring timely releases and meticulous schedule management. • Craft and disseminate product datasheets to maintain clarity and accuracy. • Provide steadfast support for Sales & Marketing teams in design-in activities, bridging technical knowledge with market needs. • Oversee product life cycles, encompassing EOL, ECR, and PCN in alignment with product roadmaps and BU strategies. • Ensure production-embedded changes through systematic controls and participate in SCS part creations. • Engage actively with multifunctional teams, crossing from Sales & Marketing, Design, and Quality, to address challenges in fabrication, packaging, testing, and application. • Accomplish additional tasks delegated by the supervisor. Qualifications: • Comprehensive knowledge of semiconductor testing, assembly, and IC/MOSFET wafer fabrication processes. • A strong foundation in electronic analysis. • Exceptional communication and negotiation skills. • A self-starter mindset with readiness for individual contributions. • Experience in the Power industry is a plus.

Reporting to MOSFET Development Manager, you will work as Sr. MOS Development Engineer to be responsible for process integration, development and optimization. About the job: Work with product designer to create new device structure ideas and develop the necessary Mosfet/ IGBT /Diode technologies Closely work with internal process experts and external foundry partners to set up the required technologies and processes to produce the prototypes and with test labs to assess results vs. simulations / expected behavior. Responsible for experimental matrix design to evaluate and optimize design vs. specification. Co-work with fab engineering teams to generate the final design rule menu and electrical parametric specifications. Participation in fab selection and evaluation for future foundry locations. Participate and help the Design Engineers and Product Engineers on reverse engineering analysis when necessary. Act as the internal expert of semiconductor devices and processes to provide the necessary information and advices to designers on new technologies. Short term travels for business trips and trainings. About you: Knowledge of semiconductor device physics, such as Diode, BJT, MOSFET, and IGBT…etc and understanding of complex interactions between different fabrication processes. Experiences in semiconductor process development, and basic knowledge in semiconductor device characterization. Ability of arranging tests with 3rd party labs and comfortable with working in Lab for device characterization. Good writing/reading/communication in English is a MUST. The ability to operate independently in a cross-cultural working environment. Experiences in both conventional Bipolar, CMOS, DMOS processe Understanding or experiences in power semiconductor devices assembly and applications would be preferred. Knowledge and experiences of material analysis or Failure analysis tools, such as SRP, SIMS, SEM…etc. Familiar with mask generation, wafer fab process flow and in-line/PCM specifications. Knowledge and experience in one or more of the following areas would be a plus, but not must: o Test pattern generation o Semiconductor process/device modeling o Basic assembly & test processes.

What you will be doing: - Planning and coordinating, and/or implementing R&D projects and processes - Design new products/process according to benchmarking results, simulation, and experiments.   - Coordinate with related departments to confirm PCEF on schedule. - Communication & coordination with other dept. source for resource or result access. - Support customer requirements & problem to assist PM & RM to expand new product business. Assist factory & QA to complete short term and long-term CIP project.

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

Overview: Basic knowledge of power electronics, including DC/DC, AC/DC converter, power devices, and magnetic components. Participate in the product development discussion and communicate with PM/PE teams to define new product’s features. Responsible to design the evaluation boards, product verification and provide technical support for customers. Responsibilities: -Design EVB board, Layout check & Debug PCB board -Product testing and verification -General application related document -Review customer’s circuit and provide technical support for worldwide Qualifications: -Knowledge in oscilloscope operation -Familiarity with Altium

工作概覽： 參與CMOS平台製程開發、元件設計與電性優化，支持新產品導入、製程整合與技術創新，為特殊應用產品提供完整的製程與元件解決方案。 主要職責： • 負責0.35um CMOS製程模組與整合開發。 • 參與元件(如MOS、HVLDMOS、電容、電阻等)之設計與TCAD模擬驗證。 • 建立元件模型(SPICE/LPE) 與電性分析，協助PDK開發。 • 協同設計團隊進行元件規格定義與效能驗證。 • 支援新產品導入、製程異常分析與良率改善。 資格條件: • 熟悉0.35um CMOS製程平台。 • 具元件設計、TCAD模擬或SPICE建模經驗者尤佳。 • 具備製程整合、電性量測與數據分析能力。

We are seeking great talent to help us build The DNA of tech.® Vishay manufactures one of the world's largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. We help the world's most in-demand technologies come to life. Every day our products touch your life and the lives of people across the world, though you likely do not know it. Come join us and help us build The DNA of tech.™ Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). Learn more at www.Vishay.com. Do you want to help us build the DNA of tech.? Vishay is currently seeking applicants for a Senior Product Engineer AUTO. You will be responsible for overseeing all phases of product engineering, new product development and production support for our Automotive Mosfet product line. Job Location: The ideal candidate will be working remote near one of our Vishay offices in Taipei, Taiwan Newport, UK. What you will be doing: • Hands-on technical ownership of new and established products within the Automotive MOSFET Division • Leads and manages new product introduction of leading-edge products from product definition and development through to characterization, qualification, and release phases, liaising with Market development, R&D, Package, Device design and other manufacturing organizations • Supports product problem solving with manufacturing, CQM, Product marketing and Application organizations within a fast-paced Automotive customer environment • Defines technical management presentations related to technical problems and project status • Liaise with Europe and Asia Pacific wafer fabrication and package assembly operations and engineering teams in yield enhancement and quality improvement programs • Defines and reviews Automotive product datasheets and technical specifications • Define statistical test methods to optimize yield and drive quality defect reduction programs • Organizes and reviews electrical and thermal characterization data and formulates device datasheets for new product releases • Supports cost reduction programs through engineering lot evaluations What you will bring along: • BS Degree in electrical engineering, Physics or Microelectronics or similar (Masters preferred) • 7 + years Product engineering experience or similar field with good knowledge of Discrete Power MOS semiconductor devices and Trench MOS Technologies Strong multi-tasking project and technical skills are required to drive new product introduction from product definition through to device characterization, qualification and final datasheet release to sales • Strong experience in product / process problem solving using statistical data analytics leading-edge yield management software Experience in the support of offshore facility to facility product transfers (package and wafer) • Familiarity with Automotive AEC Q101 testing and qualification requirements/ methods is a plus • Familiarity with MOSFET semiconductor ATE (automatic test equipment) Wafer and Package test methods are an advantage • Must have experience in interfacing with offshore Product Engineers - Europe - Asia- USA and drive international teams in a collaborative and time conscious fashion • Familiar with 8D and FMEA processes and concepts • Must be willing to travel to offshore sites in USA, Asia and Europe **Please make sure to attach your most updated English resume along with your 104 application.

Overview: Responsible for designing evaluation boards, performing product verification, and providing technical support to global customers. Key Responsibilities: • Design and develop evaluation boards (EVBs) for product validation. • Conduct product testing and verification using lab equipment. • Prepare application-related documentation. • Review customer schematics and PCB layouts. • Provide technical support to worldwide customers. Qualifications: • Strong debugging and problem-solving skills. • Experience in prototype board design and troubleshooting. • Proficient in lab equipment usage (oscilloscope, logic analyzer). • Skilled in schematic and PCB layout tools (Cadence OrCAD, Altium, PADS). • Familiarity with analog and digital IC applications. • Knowledge of high-speed interface applications and compliance standards is a plus. • Excellent verbal and written communication skills. • Team-oriented with strong cross-functional collaboration abilities.

* OSAT (Assembly/Test) 良率異常分析 & 處理。 量產測試驗證，確保量測參數 & 規格符合設計要求。 * 測試結果資料分析，提供良率改善 & 測試流程優化建議。 * CP / FT / SLT 數據追蹤，擬定調整製程參數 or 條件。 測試開發、Debug & 參數優化，提升測試效率 & 良率穩定度。 * 與內部製程/設備/品保單位進行問題分析，釐清異常並提出改善方案。 * 支援測試需求 & 技術交流，確保產品測試時程 & 品質達成量產目標。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Ref. * CP (Wafer level - Chip Probing) * FT (Packaged chip level - Final Test) * SLT (Packaged chip level - System Level Test) * ATE (Automated Test Equipment)

工作概覽： SiC新技術評估與開發、元件設計及製程整合。新產品導入、量產時程管控。 主要職責： • SiC新技術評估與開發、元件設計及製程整合。 • 電性規格訂立、量測與分析。 • 專案的執行及各支援部門的協調整合。 • 新產品Tape out 與導入。 • 產品良率改善及製程流程簡化 資格條件: • 對新技術開發產品、元件設計及製程整合等工作有興趣。 • 具半導體製程、製程整合或光電相關工作經驗者尤佳。

•Design reliability test plan process for device life time evaluation •Coordinate with third party suppliers on device WAT/CP •Coordinate with third party suppliers on reliability test and failure analysis of power devices

1.ESD/TVS保護元件設計 2.積體電路系統級ESD防護設計 3.等主管交辦事項

1.研發 SiC / GaN 新技術與產品設計，應用於 5G、IoT、AI Server、電動車等領域 2.負責新產品導入、封裝設計與量產評估 3.優化製程與成本結構，提升產品良率與競爭力 4.規劃與執行可靠度測試，撰寫技術文件並回應客戶導入需求 5.與內部團隊協作推進專案並支援技術移轉 1.Develop innovative SiC / GaN technologies and product designs for applications in 5G, IoT, AI servers, and EVs 2.Lead new product introduction, packaging structure, and mass production evaluation 3.Optimize process flow and cost performance to enhance product competitiveness 4.Plan and execute reliability testing, documentation, and customer technical engagement 5.Collaborate with cross-functional teams to ensure smooth project delivery and knowledge transfer

You will be responsible for manage and control shopfloor related to ensure quality / delivery / cost and safety meet company standard setting and meet government requirement. Coordinating related department to let production running smoothly. You will also join operation module team activity to ensure projects continue progress. 管理並掌握生產線相關事宜並確認可滿足品質/交期/成本及安全之相關需求可合乎公司標準規範或政府相關法規規定。協調支援單位提供必要支援以利產線運行。並加入營運處相關專案，以利專案推展順利。 What you will be doing: • To lead production line meet quality / delivery and cost standard 帶領生產線產出合乎品質交期成本的產品。 • To lead production line meet company policy and government requirement 帶領生產線符合公司政策及政府法規需求 • To coordinate related department let production line running smoothly. 協調其他相關部門提供必要支援以利產線順利生產。 • To support operation teams’ activity to ensure projects continue progress. 支援營運團隊相關活動並確認相關專案可順利推展。

你將在高速成長的網通產品事業單位中，扮演關鍵技術領導角色，負責Server主機板的核心設計與研發，推動創新並打造高效能解決方案。 職務內容: 1. Server主機板電路設計：主導高效能主機板的電路架構設計、原理圖繪製與Layout指導，確保設計品質與效能。 2. 技術領導與設計審查：擔任專案技術負責人，引領設計方向、進行技術審查與風險控管，確保專案技術決策正確。 3. 產品驗證與技術問題解決：負責產品功能驗證、測試與故障排除，持續提升產品穩定性與可靠度。 4. 商品化與設計優化：推動產品從設計到量產的轉化，並持續優化設計以提升品質、降低成本。 5. 專案管理與預算控管：掌握專案進度與資源分配，有效控管開發成本與預算，確保專案如期達標。 【我們在找的人】 一位對技術充滿熱情、具備深厚硬體設計經驗的工程師，渴望在Server領域發揮影響力。這個職務不只是執行者，更是技術的引領者，能夠在複雜挑戰中找到創新解法 ＊彈性工作時間，薪優福利佳，並備有新店/中和線交通車＊

1. PCB 設計（含原理圖設計、佈局佈線、Gerber 輸出）。 2. 客戶服務(PCIe/USB3相關) - 協助客戶釐清技術問題並提供可行解決方案。 - 參與客戶專案評估與設計審查（Design Review，含原理圖與佈局）並提出建議。 - 協助客戶進行產品特性分析與測試驗證。 3. 具跨部門協作與專案支援能力。 作為硬體研發工程師，您將成為我們團隊中關鍵的成員之一。您的工作將有助於產品的開發和改善，確保我們的產品能夠達到高標準的品質和性能。此職位的發展前景良好，並提供豐富的學習和專業成長機會。 如果您符合我們的要求並對此職位感興趣，請盡快申請並表達您的興趣。我們期待能夠與您共事，一起實現更好的產品和更大的成功。

【公司簡介】 LSC Ecosystem 的使命是在電動載具價值鏈上扮演關鍵領航者，你想對產業發揮自己的影響力嗎？在這裡你能夠有機會在電動載具的產業裡，串連軟體與硬體、協助傳統邁向未來，過程絕對不簡單，但是旅程保證很精彩。你喜歡新創充滿未知與挑戰的吸引力嗎？加入 LSC 和我們一起打造電動載具產業的霸業！ 【Responsibilities】 • 根據車輛需求，設計、開發和測試EV應用中的系統架構相關的電氣組件集成，以及創建、改進、解釋和實施電氣標準。(系統設計) • 開立規格需求及管理供應商硬體設計，並審核關鍵設計、DFMEA及電磁干擾等法規需求 (部件供應商設計管理) • 動力電池、馬達控制器、馬達、充電系統等高壓系統整合設計、規劃及驗證 • 常備電池、DCDC直流轉換器、VCU等低壓系統整合設計、規劃及驗證(次要) 【Requirements】 • 有電動車EV相關(HEV、PHEV、BEV、FCEV)工作經驗者優先錄取 • 有電機電子(動力系統、充電控制系統、電子控制系統)驗證及功性能的量測經驗者優先錄取 • 熟悉電子電氣法規及相關驗證經驗者優先錄取 • 有電裝件供應商合作經驗者佳 • 熟悉電子學、電路學，對I/O驅動線路有設計經驗佳 • 熟悉電源IC、電力電子應用及對功率損耗有經驗者佳 • 熟悉車用法規ISO 26262、IATF 16949者佳 【Preferred Skills】 • 熟悉電力電子、硬體選件與電路設計 (必要) • 控制理論、數位控制、馬達控制 (次要) • 使用 Altium 或 OrCAD 之 PCB 佈局軟件的經驗(次要) 【Special Requirement】 • 出色的溝通和組織能力，能夠處理多個項目和任務並確定其優先級，同時向關鍵利益相關者通報進展情況

1. 數位、類比信號PI/SI模擬及設計優化。 2. VNA、TDR、oscilloscope儀器量測及操作 。 3. 其他主管交辦事項。