「Sr. APR Engineer(台北)」的相似工作

-Working with IC design team on IC bring up and electrical verifications. -Develop evaluation hardware platforms, reference schematic and PCB board verification. -BOM cost and competition analysis. -Technical support for customer projects along with AE/DE/SW/FW/QC engineers.

1.Support Design Engineer on Signal Integrity testing and Debugging on Chip and Demo Board 2.Support Customer projects design-in stage to mass-production. 3.Support Customer projects design review (Schematics, layout, CTS report) 4.Team work with RD, AE and QA on debugging and problems solve.

DESCRIPTION: 1. Responsible for the physical design process of chip numbers from netlist to GDSII 2. Responsible for interaction with the front-end design team to realize the design convergence and optimization of the front and back ends; Comprehensive, static timing analysis 3. Floor planning, power planning and signoff, place and route, timing closure, chip static timing analysis and physical verification 4. IP integration, synthesis, verification and correction 5. Other Assigned Tasks delivered by the Line Manager QUALIFICATIONS: 1. MS degree in EE or related. 2. Familiar with physical design flow, including hierarchical design and low power design is a plus 3. Familiar with EDA tools, such as SoC Encounter/INNOVUS/ICC/ICC2 is a plus 4. Familiar with computer languages such as Perl/TCL/C-shell 5. Self-motivated with good communication skills and team spirit 6. Ability to understand and articulate technical issues. 7. Fluent English is a plus. 8. Experience in 12/5nm design is a plus.

1. Support customer projects from design-in, design-through to mass-production. 2. Team work with AE, FAE, RD and QA to solve problems.

【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表https://careers.qualcomm.com/careers/job/446705989572 【Talents who apply job through Qualcomm Career Website will be reviewed and considered as top priority】 https://careers.qualcomm.com/careers/job/446705989572 【General Summary】 As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm CPU Engineer, you will lead innovative Central Processing Unit (CPU) design efforts that have a critical impact on industries across the world. Qualcomm Engineers collaborate with cross-functional teams to design, verify, and implement multi-core CPU operations for all Qualcomm Business Units. 【Roles and Responsibilities】 • Collaborate with cross-functional teams (RTL, Physical Design, Circuits, CAD) to address critical physical design challenges in CPU implementations. • Develop innovative techniques within Physical Design and optimization space to meet stringent PPA targets. • Coordinate with CPU Software, Architecture, and RTL teams to understand various CPU use cases and propose impactful PPA optimizations. • Engage with external CAD tool vendors and internal CAD teams to identify and enhance optimization issues related to CPU designs. • Partner with all block-level implementation teams to analyze, implement, and improve optimization methods relevant to the designs. • Partner with Process, SoC and Post-silicon teams to analyze, improve design implementations. 【Must have skill/experience】 • Experience with Synthesis, place and route and signoff timing/power analysis. • Knowledge of high performance and low power implementation techniques • Proficiency in scripting (TCL, Python, Perl) 【Minimum Qualifications】 • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 6+ years of Hardware Engineering, Electrical Engineering, or related work experience. OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 4+ years of Hardware Engineering, Electrical Engineering, or related work experience. OR PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field and 3+ years of Hardware Engineering, Electrical Engineering, or related work experience.

1. 辦理股務相關作業及股務代理機構溝通窗口 2. 公開資訊觀測站重大訊息(中英文版)及各項公告申報 3. 協助安排董事會、功能性委員會、股東會及相關作業 4. 協助公司治理評鑑及相關作業執行 5. 永續資訊揭露、維護及優化: 彙編年報及股東會議事資料、永續報告書編製及查證作業 6. 其他主管交辦工作事項 1. Handle Employee stock option plan and stock affairs-related operations. 2. File material information and various announcements on the Market Observation Post System (MOPS). 3. Arrange and assist with shareholders’ meetings and other related meetings and tasks. 4. Assist in the implementation of corporate governance evaluations. 5. Disclose, maintain, and enhance sustainability information. 6. Support departmental operations and handle assignments from supervisors.

1. Frontend IC substrate design including the SIP/SOP/RF/System package by using Cadence APD or PCBs Allegro 2. Manufacturing backend Validation with CAM350 features alignment and design discrepancy comparison. 3. Mechanical drawing for manufacturing process with AutoCAD. 4. Customers TV/DUT design integration and collaboration. 5. Impedance simulation and measurement for transmission line.

The successful candidate will work with team members and apply his/her design techniques to work on different phases of complex logic design for ASIC/SOC project. The role will include working on the following tasks from time to time: HDL coding, documentation, RTL quality check, cooperate with back-end engineer etc. 【Key Responsibilities】 - Responsible for front-end digital logic design in ASIC/SOC projects. - Perform HDL coding (Verilog/SystemVerilog). - Prepare and maintain design documentation (specifications and design documents). - Conduct RTL quality checks (Lint, CDC, power analysis, etc.). - Collaborate with Backend/Physical Design engineers to achieve timing closure. 【Core Requirements】 - Education/Experience: Master’s degree with ≥ 2 years, or Bachelor’s degree with ≥ 3 years of digital ASIC/SOC design experience. - RTL Design: Proficient in RTL coding using Verilog/SystemVerilog or VHDL. - TO / Front-End Flow: Familiar with front-end design flow, including synthesis, Lint, CDC, and STA. - EDA Tools: Experience with tools such as Lint, CDC check, and PrimeTime PX (power analysis). - Documentation: Ability to write design specifications and technical documents. - Collaboration: Work closely with the Design Verification (DV) team on IP verification. 【Preferred Qualifications】 - Familiarity with CPU architectures (x86/ARM/8051). - Knowledge of AMBA bus protocols (AXI/AHB/APB). - Understanding of PCIe protocol.digital IP/SOC design verification.

Job Duties include but are not limited to: 1. Work within a cross-functional team of robotics scientists and engineers to develop next- generation autonomous mobile robots (AMR). 2. Design, develop, prototype, integrate and test advanced robotic mechatronic system and sub-system (sensing, manipulation, control, human-interaction, etc…). 3. AMR setup, integration, programming and testing using different brands of mobile robots and mobile manipulators, including proprietary robots. 4. Providing hands-on on-site support for mechatronic system development, integration, testing and troubleshooting of AMR platforms. 5. Translate new technology and research outputs into modular and re-useable mechatronic sub-systems to be integrated into various AMR platforms. 6. Design of experiments to benchmark system performance by adopting in-house and/or industrial test methodology. 7. Troubleshooting of robotic system / subsystem / module using development tools, specialized equipment and standard lab equipment. 8. Adopting latest standards and/or methodology to work (standards, open source, common platform).

1. 具 0~2年數位晶片設計，或有 0~5年類比晶片設計工作經驗。 2. 具備基本數位和類比電路知識，熟習標準晶片設計流程。 3. 熟習業界常用EDA tools, 或Matlab/ Simulink。 4. 研習過CMOS or BiCMOS 類比設計電路課程，對放大器有基礎認識。 5. Experience in these areas is preferred： * BiCMOS or CMOS high-speed (>20Gb/s) circuit, Linear electrical amplifier & equalizer, High-speed (>25G) CDR/PLL/SerDes. * Linear optical laser driver & receiver (TIA + linear amplifier) 本職位負責類比IC電路的設計、驗證和除錯。這是一個高度技術性的職位，對公司的產品開發至關重要。我們正在尋找一位熱愛類比IC設計並具有相關經驗的人才，以推動公司的技術創新和發展。 如果您對這個職位感興趣，請投遞您的履歷表，我們立即與您聯繫。

歡迎2026年畢業並正在找尋研發替代役的同學申請! 職位選擇: Direction 1: Physical Design Engineer Direction 2: ASIC Physical Design Engineer Direction 3: DFX Engineer Direction 4: CAD Tools Development Engineer Direction 5: Design Verification Engineer What you’ll be doing: Key Domains: • Physical and ASIC Design Implementation • Backend and Layout Optimization • Design-for-Excellence (DFX: Test, Manufacturability, Debug) • Development of CAD/EDA Automation Tools • Functional and Formal Design Verification What we need to see: • MS degree from EE/CS or related majors from a prestigious university. • Good knowledge in digital circuit design. • Experience in using Verilog HDL. • Experience in various EDA tools. • Fluent in English reading and writing. • Self-motivated, good team player. Ways to stand out from the crowd: • Proven ability to work independently as well as in a multi-disciplinary group environment • Good command of C/C++ or Verilog programming language. • Familiar with Perl/Python/Tcl/Shell scripting 應徵方式: 請提供以下資料： • 英文個人履歷 • 學士+碩士成績單 (中英文皆可) 提交申請: 請將上述資料投遞至104，符合資格者將會收到進一步的聯繫通知。

我們正在尋找具 2-3年以上經驗的資深版圖工程師，能獨立負責 Analog/Mixed-Signal/SoC IP 及 Top-Level Layout。 需熟悉 layout tool、CMOS 製程與 DRC/LVS 驗證，具高速介面經驗佳。 此職位需規劃 Floorplan、Power/Clock Routing、跨部門協作。 曾參與完整 Tape-out 專案者優先。 職務內容： 1.Interface IP layout 2.Ensure DRC/LVS clean 3.Ensure DRC/LVS clean 4.Fix EM/IR issue 5.Layout environment setup 6.IO planning, placement and routing 7.Help designer to debug and support FIB plan

1. SRAM library characterization flow. 2. SRAM library maintaining. 3. Develop and maintain automation flows for analog IC design.

Position Description: 1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations. 2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high-performance designs. 3. Have real design experience including floorplan and partition, place, CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis. 4. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs. 5. To play a leading role among other team members, while receive little instruction on routine and general assignments. Position Requirements: 1. A bachelor's degree is essential and 3+ years’ experience in IC design, electronic engineering or computer science applications. 2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications. 3. Requires working knowledge of one or more programming languages, and effective communication and soft skills. 4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus. 5. Good communication in English and good work attitude. 6. Be familiar with shell/Perl/Tcl etc. script language.

【主要工作內容】 1.Netlist to GDS, including floorplan/powerplan/physical synthesis/clock tree synthesis & routing 2.Chip level physical verification, including DRC/LVS/DFM & tapeout 3.IR-Drop analysis 【需求條件】 1.有使用過ICC/ICC2/laker, 曾做過fully layout & chip level PV 2.工作態度積極認真, 有獨自解決問題能力

1. 機器視覺AOI系統整合開發 2. 外觀缺陷檢測/定位等影像處理演算法程式設計 3. 光學系統架構設計及取像測試驗證，光學設備配型，規格制訂。 4. 技術文檔撰寫及維護

Job Description: In this position the individual will develop test environment, test plan, and test cases based on the product specification and related industrial standards. The individual will require initiating a test plan review with the team and updating the test plan accordingly. The candidate will require executing and developing the test cases based on test plan, debugging and reporting the test result to achieve full function coverage goal. The individual will require developing ASIC bench functional test programs and doing ASIC bring-up and ASIC bench testing. The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment. The candidate must have ability to coordinate priorities and initiatives and clear communication skill.

負責 3D-IC Interposer 與類比 IP 佈局設計 (Virtuoso / Allegro)，確保電性與實體規格，優化設計流程。 熟悉 Layout tools、Foundry PDK為佳。

Responsibilities: • Develop integrated verification environment. • Verify designs with system verilog and system verilog assertion. • Build, maintain and upgrade testbenches and their components using UVM-based methods. • Check functional coverage and code coverage • Create controlled random testcases. Pre-debug and provide debug reports. • Scripting experience using scripting languages like Perl and Python.

1. 機櫃應用架構設計 2. RFQ Proposal & development 3. Project execution (WBS) 4. Technical development 5. 機構規格確認 6. 機構設計&確認 7. 跨部門溝通 8. 設計文件建立