「半導體產品工程師」的相似工作

1.產品開發 2.開發設計 3.製程改善 4.成本優化 Job Description 1.Design new product to maintain technology competitive advantage 2.Improve and Review manufacturing process to get maximum profit

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

1.GaN, GaAs晶片設計、製程開發 2.Laser晶片設計、製程開發 3.晶片設計、製程開發 Job Description 1.GaN and GaAs chip design and process development. 2.Laser chip design and process development. 3.Chip design and process development.

* OSAT (Assembly/Test) 良率異常分析 & 處理。 量產測試驗證，確保量測參數 & 規格符合設計要求。 * 測試結果資料分析，提供良率改善 & 測試流程優化建議。 * CP / FT / SLT 數據追蹤，擬定調整製程參數 or 條件。 測試開發、Debug & 參數優化，提升測試效率 & 良率穩定度。 * 與內部製程/設備/品保單位進行問題分析，釐清異常並提出改善方案。 * 支援測試需求 & 技術交流，確保產品測試時程 & 品質達成量產目標。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Ref. * CP (Wafer level - Chip Probing) * FT (Packaged chip level - Final Test) * SLT (Packaged chip level - System Level Test) * ATE (Automated Test Equipment)

1.車用新產品與LED產品技術開發。 2.產品專案規劃與執行。 3.研發專案進度掌控與試產線經驗。 4.協助業務PM解決客戶應用端問題。 5.開發進度時程掌握/開發問題追蹤與解決。 6.競爭產品技術分析。 7.跨部門、工廠及客戶溝通協調。 8.產品研發方向與市場動態、敏銳並具整合能力者佳。 9.配合國外出差/參展。 Job Description 1. Develope and analyze new product and LED technology 2. Plan and carry out the program 3. Collaborate with PM and customers, factory ensure all product-related process would be smoothly 4. Someone who is sensitive to market trends and possesses strong integration abilities is preferred 5. Able to accommodate international business trips and participate in exhibitions abroad

1. 封裝固晶(Die-Bond)製程作業。 2. 固晶(Die-Bond)相關設備保養維護、異常排除、效能改善、改機調機。 3. 封裝固晶(Die-Bond)製程改善與開發。 【本職缺可透過104應徵，也歡迎直接至穩懋官方網站投遞，增加履歷曝光度】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址：https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1047

You will be responsible for manage and control shopfloor related to ensure quality / delivery / cost and safety meet company standard setting and meet government requirement. Coordinating related department to let production running smoothly. You will also join operation module team activity to ensure projects continue progress. 管理並掌握生產線相關事宜並確認可滿足品質/交期/成本及安全之相關需求可合乎公司標準規範或政府相關法規規定。協調支援單位提供必要支援以利產線運行。並加入營運處相關專案，以利專案推展順利。 What you will be doing: • To lead production line meet quality / delivery and cost standard 帶領生產線產出合乎品質交期成本的產品。 • To lead production line meet company policy and government requirement 帶領生產線符合公司政策及政府法規需求 • To coordinate related department let production line running smoothly. 協調其他相關部門提供必要支援以利產線順利生產。 • To support operation teams’ activity to ensure projects continue progress. 支援營運團隊相關活動並確認相關專案可順利推展。

1.新評估項目導入，稽核及品質相關會議安排與執行，有品質管理經驗佳。 2.具有客戶服務意識和了解客戶需求能力，能夠主動回應客戶並提供有效的解決方案。 3.廠商客戶品質問題的處理與回覆、後續的分析追蹤與執行。 4.撰寫與審核8D Report，具備英文撰寫能力及良好跨部門溝通能力，針對品質問題進行追蹤處理。 5.協同維護氣體鋼瓶及化學品更換，氣體及化學產品出貨與倉儲管理。 6.異常排除，緊急應變處理，需多元性發展以協助其他專案報告及設備相關維護活動。 7.主管交辦事務執行。

1. 產品電性量測分析與測試報告產出 (MOSFET、DC-DC IC、AC-DC IC) 2. 產品規格書製作 3. 新產品單體與系統驗證 4. 協助客戶問題回覆(需跨部門合作以及客戶溝通)

1.製造流程建立與SOP撰寫、維護 2.產品導入及問題處置追蹤 3.良率提升及製程優化 4.客訴、不良分析與處置 5.工程變更導入及追蹤. 6.設備治工具開發驗證及維護管理與異常檢修 7.工廠與產品開發人員之間的溝通協調 8.其他主管交辦事項

1. DRAM記憶體系統驗證除錯. 2. DRAM component/U-DIMM/SO-DIMM/R-DIMM量產導入驗證. 3. 記憶體驗證 - 取得Intel/AMD AVL認證. 4. DRAM示波器及邏輯分析儀量測. 5. DIMM module零件評估/BOM表建立

製程整合/元件開發

※實際任用職稱依個人相關經歷敘薪。 1.新產品開發生產規劃及工程驗證 2.晶圓廠製程開發及元件競爭力評估導入 3.工程/量產低良分析及良率改善 4.協助客訴品電性/物性分析

因應半導體產業成長，公司目前擴大招募各項職務專業人才！！！ 歡迎查看104所有職缺，請針對有興趣的職缺【主動應徵】讓主管看到您的履歷， 通過書面審核會主動與您聯絡邀約面試。 不管在生產製程、品質技術、自動化設備、職安環保...等 只要跟化學材料相關的，都可以找到發光發熱的舞台！ 對高階電子材料、生產製程有熱情的你，歡迎加入關東鑫林，一起為世界打造下一顆晶片的力量！ **各項職務上班時段、地點、薪資皆不相同，詳細請查看各項職務內容，或於面試時說明** **請針對有興趣的職缺【主動應徵】讓主管看到您的履歷，通過書面審核會主動與您聯絡邀約面試，勿直接投遞此職缺，謝謝您**

1. To improve device yield &CIP in order to meet customer request and customer service. 2. Identify and solve process and device problems. 3. Support for customer visit and audit.

1.Communicate with customer/partner and subcontractor to define the package design requirements, or specifications. 2.Propose the package size, structure according to requirements and specifications from customer. 3.Design the package and optimize to meet product specifications, coworking with related layout, electrical and thermal engineering teams. 4.Prototyping document preparation 5.Link with suppliers and follow up the development trend.

Reporting to MOSFET Development Manager, you will work as Sr. MOS Development Engineer to be responsible for process integration, development and optimization. About the job: Work with product designer to create new device structure ideas and develop the necessary Mosfet/ IGBT /Diode technologies Closely work with internal process experts and external foundry partners to set up the required technologies and processes to produce the prototypes and with test labs to assess results vs. simulations / expected behavior. Responsible for experimental matrix design to evaluate and optimize design vs. specification. Co-work with fab engineering teams to generate the final design rule menu and electrical parametric specifications. Participation in fab selection and evaluation for future foundry locations. Participate and help the Design Engineers and Product Engineers on reverse engineering analysis when necessary. Act as the internal expert of semiconductor devices and processes to provide the necessary information and advices to designers on new technologies. Short term travels for business trips and trainings. About you: Knowledge of semiconductor device physics, such as Diode, BJT, MOSFET, and IGBT…etc and understanding of complex interactions between different fabrication processes. Experiences in semiconductor process development, and basic knowledge in semiconductor device characterization. Ability of arranging tests with 3rd party labs and comfortable with working in Lab for device characterization. Good writing/reading/communication in English is a MUST. The ability to operate independently in a cross-cultural working environment. Experiences in both conventional Bipolar, CMOS, DMOS processe Understanding or experiences in power semiconductor devices assembly and applications would be preferred. Knowledge and experiences of material analysis or Failure analysis tools, such as SRP, SIMS, SEM…etc. Familiar with mask generation, wafer fab process flow and in-line/PCM specifications. Knowledge and experience in one or more of the following areas would be a plus, but not must: o Test pattern generation o Semiconductor process/device modeling o Basic assembly & test processes.

1. 具備矽光子相關 EDA 版圖設計軟體 使用經驗（如 Cadence Virtuoso、Synopsys OptoDesigner、Luceda IPKISS 等）。 2. 熟悉矽光子 光學模擬與設計優化，能操作 Lumerical FDTD / MODE / INTERCONNECT 等模擬軟體，並具備量測與驗證能力。 3. 具備矽光子 / 光學測試 / 光學元件開發與設計相關經驗。 4. 具有良好的技術文件撰寫能力，能清楚表達設計思路與實驗結果。

1.Conduct feasibility studies before product kick-off. 2.Coordinate with the R&D team and other related teams. 3.Check new technology/design rules. 4.Manage new product development. 5.Prepare product samples for testing. 6.Perform competition analysis.

1.評估製程專案計畫, 訂出最適化的製造流程, 符合成本與產品規格 2.定期檢測製程設備與關鍵參數, 分析數據以持續改善製程 3.處理製程異常, 找出問題點並提供解決方案 4.撰寫技術報告與標準作業手冊, 優化產線與工作流程 5.進行失效模式與效應分析(FMEA), 實驗設計(DOE), 以評估風險與優化製程 6.導入新產品製程, 進行製程檢測, 確保新產品符合檢驗標準及穩定生產 7.進行新設備的生產參數設定與量產驗收 8.部分工作需輪班, 並在無塵室環境中穿著無塵衣作業