「半導體產品工程師」的相似工作

* OSAT (Assembly/Test) 良率異常分析 & 處理。 量產測試驗證，確保量測參數 & 規格符合設計要求。 * 測試結果資料分析，提供良率改善 & 測試流程優化建議。 * CP / FT / SLT 數據追蹤，擬定調整製程參數 or 條件。 測試開發、Debug & 參數優化，提升測試效率 & 良率穩定度。 * 與內部製程/設備/品保單位進行問題分析，釐清異常並提出改善方案。 * 支援測試需求 & 技術交流，確保產品測試時程 & 品質達成量產目標。 1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc. 2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities. 3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently. 4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality. 5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team. 6. Annual salary: 800K NTD and above 7. Onsite MediaTek - Hsinchu Science Park Office This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency. Ref. * CP (Wafer level - Chip Probing) * FT (Packaged chip level - Final Test) * SLT (Packaged chip level - System Level Test) * ATE (Automated Test Equipment)

1. 光通訊新產品設計開發與資料分析 2. 執行產品研發流程及技術文件產出(BOM,測試報告等) 3. 產品開發之設備評估 4. NPI導入與良率改善 5. 其他主管交辦事項 Job Description 1.Design and develop new products for optical communication, including data analysis. 2.Execute product development processes and generate technical documents such as Bill of Materials (BOM) and test reports. 3.Evaluate equipment for product development. 4.Implement New Product Introduction (NPI) processes and improve yield rates. 5.Handling tasks assigned by superiors.

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

1. 生產檢治具設計、組立及維修 2. 生產製程規劃與SOP撰寫、DFM製作 3. 協助打樣評估測試作業 4. 產線LAYOUT規劃、新機種製程評估及DFM製作 5. 量試線設置及量試問題對應 6. 自動化開發

1. 封裝固晶(Die-Bond)製程作業。 2. 固晶(Die-Bond)相關設備保養維護、異常排除、效能改善、改機調機。 3. 封裝固晶(Die-Bond)製程改善與開發。 【本職缺可透過104應徵，也歡迎直接至穩懋官方網站投遞，增加履歷曝光度】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址：https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1047

※實際任用職稱依個人相關經歷敘薪。 1.新產品開發生產規劃及工程驗證 2.晶圓廠製程開發及元件競爭力評估導入 3.工程/量產低良分析及良率改善 4.協助客訴品電性/物性分析

1.了解基礎電路設計。 2.測量RF電信。 3.有低良率分析經驗。 4. Characterize and analyze the performance of PA/LNA/Switch and RF Front-end Module. 有以上經驗者佳。

1.新評估項目導入，稽核及品質相關會議安排與執行，有品質管理經驗佳。 2.具有客戶服務意識和了解客戶需求能力，能夠主動回應客戶並提供有效的解決方案。 3.廠商客戶品質問題的處理與回覆、後續的分析追蹤與執行。 4.撰寫與審核8D Report，具備英文撰寫能力及良好跨部門溝通能力，針對品質問題進行追蹤處理。 5.協同維護氣體鋼瓶及化學品更換，氣體及化學產品出貨與倉儲管理。 6.異常排除，緊急應變處理，需多元性發展以協助其他專案報告及設備相關維護活動。 7.主管交辦事務執行。

● 光學模組機構設計 ● 光學系統架設與檢測分析 ● 光學系統相關技術專利佈局 ● RF射頻電路設計與分析 ●矽光子產品DC/RF量測與分析

You will be responsible for manage and control shopfloor related to ensure quality / delivery / cost and safety meet company standard setting and meet government requirement. Coordinating related department to let production running smoothly. You will also join operation module team activity to ensure projects continue progress. 管理並掌握生產線相關事宜並確認可滿足品質/交期/成本及安全之相關需求可合乎公司標準規範或政府相關法規規定。協調支援單位提供必要支援以利產線運行。並加入營運處相關專案，以利專案推展順利。 What you will be doing: • To lead production line meet quality / delivery and cost standard 帶領生產線產出合乎品質交期成本的產品。 • To lead production line meet company policy and government requirement 帶領生產線符合公司政策及政府法規需求 • To coordinate related department let production line running smoothly. 協調其他相關部門提供必要支援以利產線順利生產。 • To support operation teams’ activity to ensure projects continue progress. 支援營運團隊相關活動並確認相關專案可順利推展。

【本職缺僅接受穩懋官方網站投遞】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址: https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1062 1.蝕刻製程生產線技術支援 2.製程改善/新製程開發 3.處理製程問題改善 4.改善方案提升良率 5.電性參數分析及測試 6.生產線值班，須配合on call

1.製造流程建立與SOP撰寫、維護 2.產品導入及問題處置追蹤 3.良率提升及製程優化 4.客訴、不良分析與處置 5.工程變更導入及追蹤. 6.設備治工具開發驗證及維護管理與異常檢修 7.工廠與產品開發人員之間的溝通協調 8.其他主管交辦事項

1. To improve device yield &CIP in order to meet customer request and customer service. 2. Identify and solve process and device problems. 3. Support for customer visit and audit.

因應半導體產業成長，公司目前擴大招募各項職務專業人才！！！ 歡迎查看104所有職缺，請針對有興趣的職缺【主動應徵】讓主管看到您的履歷， 通過書面審核會主動與您聯絡邀約面試。 不管在生產製程、品質技術、自動化設備、職安環保...等 只要跟化學材料相關的，都可以找到發光發熱的舞台！ 對高階電子材料、生產製程有熱情的你，歡迎加入關東鑫林，一起為世界打造下一顆晶片的力量！ **各項職務上班時段、地點、薪資皆不相同，詳細請查看各項職務內容，或於面試時說明** **請針對有興趣的職缺【主動應徵】讓主管看到您的履歷，通過書面審核會主動與您聯絡邀約面試，勿直接投遞此職缺，謝謝您**

【部門說明】 本部門在新產品開發階段負責製程設計與驗證(Process Design & Validation), 透過DFM評估以及跨部門討論來改善產品設計, 規劃生產流程並導入大量生產。 在這裡工作可以學習到： - 縱向開發與研究先進製程技術及橫向跨部門溝通協調，會應用到設備整合的知識、產線規劃與數據分析的技巧。 - 了解SMT與機構組裝未來趨勢，研究微型化與先進製程應用。 - 運用自身工程經驗，配合DFM、PFMEA等方法，評估產品的可製造性與潛在風險，並研究新的製程、材料與設備應用。 - 垂直整合完整的工廠流程，熟悉新產品從研發到量產的所有工作，深度了解設計端與製造端的連結。 - 該職位是多面向整合的要角，需統整產品開發時的問題，透過跨部門溝通協調與整合能力，解決生產線上的品質、製程、材料相關問題。 - 研發與製造團隊間的橋樑，並與國外工程師共同合作，拓展國際視野 。 【工作內容】 - New product design review for manufacturing - Introduction of new product prototype/pilot run, verification and mass production -Evaluation, development and introduction of new materials, processes and advanced production technologies. -Abnormal quality and failure analysis and improvement. (PFMEA) -To coordinate cross function team and do risk assessment for making (consolidating) the decision of production/manufacturing -To communicate production status, issues with cross function team and lead / drive cross function team on issue solving -To handle the regular PID (Product In Development) meetings and coordinate follow-ups

【主要職責】 1. 多像素車用矩陣式頭燈產品開發與光學、電子與熱管理整合、品質與良率改善 2. 進行車用開發流程與產品驗證(需熟悉或具VDA6.3相關經驗) 3. 針對產品進行 VAVE (成本降低與產品性能提升)

【本職缺僅接受穩懋官方網站投遞】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址:https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/208 負責切割/Die Sorter /封裝等製程: 1.良率目標的達成 2.異常問題的排除 3.各項部門專案執行 4.需配合輪/值班(模式:四班二輪)及on call

•Design reliability test plan process for device life time evaluation •Coordinate with third party suppliers on device WAT/CP •Coordinate with third party suppliers on reliability test and failure analysis of power devices

Overview: This role is responsible for leading new product initiatives, crafting detailed datasheets, and fostering cross-departmental collaboration. The ideal candidate possesses a deep understanding of IC/MOSFET fabrication, semiconductor testing, and is adept at navigating Power industry nuances. Strong communication skills and self-motivation are paramount. Key Responsibilities: • Steer new product development processes, ensuring timely releases and meticulous schedule management. • Craft and disseminate product datasheets to maintain clarity and accuracy. • Provide steadfast support for Sales & Marketing teams in design-in activities, bridging technical knowledge with market needs. • Oversee product life cycles, encompassing EOL, ECR, and PCN in alignment with product roadmaps and BU strategies. • Ensure production-embedded changes through systematic controls and participate in SCS part creations. • Engage actively with multifunctional teams, crossing from Sales & Marketing, Design, and Quality, to address challenges in fabrication, packaging, testing, and application. • Accomplish additional tasks delegated by the supervisor. Qualifications: • Comprehensive knowledge of semiconductor testing, assembly, and IC/MOSFET wafer fabrication processes. • A strong foundation in electronic analysis. • Exceptional communication and negotiation skills. • A self-starter mindset with readiness for individual contributions. • Experience in the Power industry is a plus.

製程整合/元件開發