「T240063-R150 電路設計工程師」的相似工作

我們專注於能源晶片與深度演算法的融合創新，誠徵類比IC演算法工程師，將傳統的手工類比設計流程轉化為自動化的智慧演算法，讓電路設計更高效、更穩定，推動類比設計的未來。 你將負責： 開發電路拓撲分析演算法 設計 sizing 最佳化演算法（基於 gm/Id methodology 等） 將手工設計流程轉化為程式化流程 協助建立類比IC設計自動化工具 與軟體團隊合作進行演算法驗證與優化 熟練使用 Vibe Coding 工具（Cursor、Github Copilot、Claude… 等）更佳 我們期待你具備： 類比IC設計實務經驗 熟悉運算放大器、ADC/DAC、電源管理電路等拓撲設計 精通 SPICE 模擬與電路參數萃取 深度理解 sizing methodology（如 gm/Id 設計法） 能清楚闡述設計 trade-off 與電路原理 加分條件： 具備 Python 程式能力 有將手工設計方法轉換為程式實現的經驗 具備統計分析能力（Monte Carlo / corner analysis） 有 EDA 工具 API 開發經驗 熟悉圖論演算法與資料結構 如果你熱愛把設計方法變成程式，並用演算法重新定義類比IC設計的可能性，歡迎加入我們！

【職位描述】 設計RVI公司新創的光通訊引擎(Optical Engine)類比電路設計工程師，負責設計、開發、測試、優化和調試類比電路及系統，產品矽中介層、玻璃中介層與高階基板。負責從概念到生產的電路設計，確保光引擎達到品質和性能標準。 【主要職責】 1.設計和開發創新的類比電路和系統，應用於光引擎和相關技術領域。 2.測試、優化和調試類比電路，確保其性能符合設計規範和功能需求。 3.與跨部門團隊合作，包括系統工程師、軟體工程師、光學工程師及其他專業人員，共同實現產品開發目標。 4.與客戶密切合作，理解其需求並提供技術支持和解決方案。 5.制定和執行測試計畫，分析測試數據，並提出改進建議。 6.保持對最新技術趨勢的了解，並將其應用於產品設計中以提升競爭力。 Position Description: As an Analog Circuit Design Engineer at RVI, you will be a key contributor to the development of our next-generation Optical Engine. You will be responsible for designing, developing, testing, optimizing, and debugging analog circuits and systems used in advanced optical communication modules, including silicon interposers, glass interposers, and high-end substrates. This role spans from initial concept to mass production, ensuring the performance and quality of the optical engine meet industry standards. Key Responsibilities: 1.Design and develop innovative analog circuits and systems for optical engines and related applications. 2.Test, optimize, and debug analog circuits to ensure performance meets design specifications and functional requirements. 3.Collaborate with cross-functional teams, including system engineers, software engineers, and optical engineers, to achieve product development goals. 4.Work closely with customers to understand their requirements and provide technical support and tailored solutions. 5.Develop and execute test plans, analyze test data, and propose design improvements. 6.Stay updated on emerging technologies and incorporate relevant advancements into circuit design to enhance product competitiveness.

1.電路板電子電路設計、週邊裝置之應用。 2.電路設計測試驗證、除錯，及開發過程之文件產出。 3.新元件搜尋驗證，PCBA 成本估算等。 4.BOM表整理。 5.與RD及PM團隊成員合作開發、分析與解決問題

1. 類比IP相關功能的設計與實現 ADC, DAC, OSC, PLL, high speed interface...etc. 2. 類比IP設計方法和品質改進 3. 類比IP仿真與分析 4. 與第三方類比 IP 供應商合作 5. 與數位電路作co-sim

Overview: This role is integral to the semiconductor technologies, process development, device design, reliability, and manufacturing teams. The ESD engineer in this setting designs and evaluates ESD protection strategies at the device, circuit, and system level, directly influencing product reliability, yield, and time-to-market for new semiconductor platforms. Key Responsibilities: • ESD Strategy Development: Define and implement ESD strategies for new technologies, devices, and processes. • Design Collaboration: Work with device, circuit, and layout teams to co-optimize ESD protection and performance. • Process Integration: Develop and qualify ESD concepts with process teams; assess materials and modules for robustness. • Testing & Characterization: Design and perform ESD/latch-up tests (HBM, CDM, TLP, etc.); analyze results and recommend improvements. • Failure Analysis: Lead root cause investigations using advanced FA tools; drive corrective actions. • Project Support: Monitor ESD performance during qualification and ramp-up; resolve issues with cross-functional teams. • Innovation: Stay updated on ESD physics, simulation, and device technology advancements. Qualifications: • 10+ years of ESD-related industry experience. • Deep knowledge of ESD mechanisms at the semiconductor device and circuit level. Familiarity with semiconductor process flows, device structures, and materials. • Hands-on experience with ESD and latch-up testing standards (HBM, CDM, MM, TLP, VF-TLP, etc.) and related test hardware. • Proficient in interpreting device layouts, TCAD/device simulation, and failure analysis techniques. • Strong analytical and problem-solving abilities, especially in root cause investigations and correlation of ESD stress to physical failures.

1. Device characterization and test key design. 2. 元件量測並提供desinger相關規格數據 3. 記憶體陣列設計

1.熟悉類比混合訊號IP開發, 例如PLL，LDO，USB PHY，MIPI PHY 2.對類比電路設計充滿熱忱者

【在華邦，學習不設限，讓AI技術力與你的未來力同步成長!】 我們深信「人才永續」是企業創新的核心動能。華邦持續投資於數據素養與AI應用的培育，支持每一位人才掌握AI與數據應用的核心能力。 ．內部學習平台提供超過4,000堂線上課程，其中包含近850堂資料科學、人工智慧、數據思維與程式技術等多元主題，支援彈性自主學習 ．建立跨部門的 AI實作班與技術社群，定期舉辦研習與交流活動，讓知識轉化為實戰力 ．完善數據應用學習資源，結合資料呈現(Power BI、Tableau)、資料處理(Python、JMP)、流程自動化(Power Automate、UiPath)、AI助手(Copilot)，協助同仁有效以數據驅動決策與創新。 ．搭配專業語言學習平台，提供學習補助與資源，鼓勵同仁持續進修，拓展國際視野 無論你是技術新秀還是資深專才，華邦鼓勵所有領域都能與AI結合，與國際接軌。持續精進、突破自我！ 【邀請您將104履歷同步上傳至華邦官方網站，將使您的履歷優先被主管看見】此職缺履歷登錄網址：https://bit.ly/4aNrlOT 1. 協同研發團隊合作制訂 CMS 產品規格 2. 開發與建置 CMS 產品的應用測試平台 3. 執行 CMS 產品應用系統的相容性驗證測試及問題分析 4. 編撰 CMS 產品應用相關技術文件及協助客戶理解並有效使用產品

1. High speed ADC/DAC design(具備Ethernet PHY RX/TX 設計經驗佳) 2. ADC/DAC IP test 3. Familiar with behavior model simulation

Job description Join our innovative team specializing in cutting-edge embedded memory solutions. We are seeking Analog Circuit Engineers to play a key role in the design and development of high-performance embedded DRAM and associated peripheral circuits. In this position, you will be responsible for the complete cycle of DRAM circuit design and simulation verification. Your tasks will involve developing novel circuit topologies, transistor-level design, optimizing performance metrics, and ensuring robust functionality through extensive simulations using industry-standard EDA tools. Required qualifications include a strong technical background in Electrical Engineering, Electronics Engineering, Computer Engineering, Physics, or a closely related field. Candidates must possess demonstrated, significant experience in DRAM circuit design and comprehensive simulation verification methodologies. Ideally, candidates will have proven design experience in specific DRAM-related circuit blocks, including but not limited to: Row and Column Decoder circuits Control path logic DC-DC converters, Charge Pumps, and Bandgap References Delay Locked Loops (DLLs) and Phase Locked Loops (PLLs) Negative voltage generators (NVG) and other critical peripheral circuits This is an excellent opportunity to contribute to state-of-the-art embedded memory designs in a dynamic, collaborative environment. If you are a skilled analog designer passionate about solving complex challenges in DRAM circuitry, we encourage you to apply and help shape the future of embedded memory technology.

Digital IC design engineer - Familiar with Verilog RTL coding - Familiar with digital design flow (pre-layout simulation, timing constraint, synthesis, post-layout simulation) - Will be working on high speed Serdes IPs - Experience or interest in all-digital PLLs or clock-data recovery circuits is a big plus

主要產品為低軌道衛星地面站與5G毫米波基站，產品型態可分為設計代工與生產代工，具體工作內容如下： 陣列天線設計代工 1. 主動相位陣列天線設計與模擬 I. 電路板材挑選與疊構設計評估 II. 單元天線之設計與模擬 III. 陣列天線之設計與模擬 IV. 功率分配器設計與模擬，整合至陣列天線 V. 相移器晶片與陣列天線之整合 VI. 主動相位陣列天線控制單元設計 2. 主動相位陣列天線實作與量測 I. 電路板製作與打件 II. 天線控制單元驗證 III. 陣列天線輻射場型校正量測與最佳化，驗證波束指向準確性 IV. 產線用快速陣列天線量測系統設計與驗證 陣列天線生產代工 1. 主動相位陣列天線實作與量測 I. 基於客戶設計，提出製程改善建議 II. 電路板製作與打件 III. 陣列天線特性量測，包含天線控制單元驗證與輻射場型量測 微波被動電路與射頻收發機設計 1. TX/RX射頻電路規畫及設計 2. 分析及挑選適合材料 3. 畫電路線路圖及與電路佈局工程師溝通、協調並完成電路及送件完成PCB製作 4. 與機械工程師溝通並完成電路板與機械結構的組裝及量產可行性評估 5. 與軟/韌體工程師合作完成整體系統運作及生產測試 6. 電路板製作與打件 7. 電路板測試驗證及除錯分析 以上模組會整合進低軌道衛星地面站或5G毫米波基站 1. 射頻收發機與陣列天線整合設計 2. 整機組裝，系統特性測試驗證與除錯分析 產品驗證完成導入量產，客戶溝通與專案進行 1. 統籌公司內部資源，達成專案需求 2. 與客戶溝通技術問題，並轉知公司內部團隊研究改良 3. 協助產品導入量產，各項文件建立及產出 4. 出差至客戶處報告專案進度

1. Ethernet Switch hardware design, debug, evaluation, and verification 2. Responsible for PCB material selection (SI/PI considered), schematics design, PCB layout constraint & review, HW DVT test and 2nd source verification...etc. 3. Writing and maintaining the hardware specification of the projects, failure analysis report if needed 4. Study tools & instruments for design & validation

1.Chip level IR drop 分析 2.Chip power estimation/calculation 3.IR drop flow 建構 4.IR drop tool 維護 5.撰寫程式

1.電子電路學(必要) 2.電力電子學 3.高頻電磁/電子學 4.應用電漿工程 ※ 2-4項需具備一項以上(含)之專長 5.主管交辦事項 ◆歡迎有物理/數學/電機/電子/控制等相關背景人才加入!!

•Design high-speed/RF analog circuits for wireless/wired communication systems. •Characterize high-speed/RF transceiver and building blocks. •Work with closely with communication algorithm/digital design team for system design and performance optimization.

1.Designs IC sockets and components using design tool provided. 2.Conduct performance forecast, simulation, and analysis 3.Modifies drawings based on NBOs. 4.Measures locally made parts and customer packages. 5.Measures IC socket and components. 6.Translates engineering documents into English (by special assignment). 7.Verifies customer package drawing to existing socket drawing. 8.Modifies and assembles parts for IC sockets. 9.Act as global engineering members. 10.Provides technical support for Sales, field support as needed. 11.Provides technical support to customers through phone, email, and on-site Work. 12.Interacts with vendors on issues of piece parts manufacturing. 13.Provides quality check for assembly and piece parts. 14.Test new products. 15.Improve design quality and speed.

Key responsibilities for the role include: • Design of high-performance wireline and analog circuits • Develop power, performance, and area optimal topologies • Co-work with layout, digital, and system teams for optimal design • Discussions and presentations with clients Qualifications: • Minimum of a Masters or PhD in Electrical Engineering • Deep knowledge and experience designing a subset of SerDes building blocks: ADC, DAC, LC-Oscillators, PLL, CDR, CTLE, DFE • High-speed circuit design (>10GS/s) experience a significant asset • Multiple designs taped out, ideally in wireline projects • Experience working with Cadence tool flow • Experience with circuit layout and floor planning • Matlab/Simulink, Python experience • Comfortable with scripting and programming • Excellent communication and presentation skills • Strong team player 歡迎身心障礙者應徵

1.系統相關的電路板電子電路設計。 2.系統相關的電路板與設備之應用。 3.依照產品需求與客戶的設計，完成產品的電子電路設計（如：器件選型、原理圖、PCB佈線圖、BOM表)。 4.協助客戶解決原理圖/PCB佈線問題與技術支援。 5.監督、評核外包廠商的品質。 6.協助工程師檢修、測試電路板。 7.電子電路焊接。 8.Design entry HDL。 9.Cadence Allegro。

先進SRAM 設計及開發