「R0158 - Hardware engineer (Wireless)」的相似工作

This role is also open to candidates at the lead level. About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to the next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons, all while shaping the future of connectivity. Responsibilities - 5~8 years’ work experience as a Key EE designer for VoIP, Conference, Mobile, or Tablet products. - Mainly focus on system schematic review and mechanical stacking review with mechanical engineers and PCB layout review with layout engineers. - Work with Audio, ME teams to figure out performance issues of radios and work with SI and DQA engineers to qualify features and make sure product quality is ready to move further. - Review design derating and suggest design update due to DFM (design for manufacturing), DFA(design for assembly), and DFC (Design For Cost). - Schematic and BOM maintenance and review. - Write test plans for testing coverage, execute tests, and document test results for projects. - Report projects’ status and issue tracking to the internal team. - Teardown and review new products in the market. - Participate in the hardware design and system architecture of VoIP products, including ATA devices, IP Phones, and voice-enabled access control systems. - Design and implement audio circuits including CODEC, I2S, SLIC/SLAC, analog amplification, echo cancellation (AEC), and noise reduction (NR). - Integrate Ethernet/PoE, USB, SPI, UART, I2S, TDM, and other communication/audio interfaces. - Collaborate with the software team to implement and debug Android/Linux audio drivers, HAL layers, and power control strategies. - Support low-power design techniques such as Dynamic Voltage and Frequency Scaling (DVFS). Minimum Qualifications - Have the MP experience with VoIP, Conference, Mobile, or Tablet products. - Solid knowledge of audio hardware design and VoIP communication protocols (SIP, RTP). - Experience with Android and/or Linux system integration for embedded hardware platforms. - Familiarity with high-speed signal design. - Solid knowledge of audio hardware design and VoIP communication protocols (SIP, RTP). - Experience with Android and/or Linux system integration for embedded hardware platforms. - Proficiency in using OrCAD Capture CIS, Power PCB viewer, and Allegro viewer - Knowledge of electronic components (Ex, R/L/C/Diode/MOS/BJT/Logic ICs/Sensors) - Strong knowledge of ESD, EMI, and Surge. - Debug skills with the basic operation of oscilloscopes and logical analyzers. - Strong knowledge to support the thermal solution. Preferred Qualifications - Experience with DVFS implementation and system-level power optimization. - Background in developing products such as SIP intercoms, IP Phones, VoIP gateways, or voice-enabled control terminals. - Proficient in diagnosing audio issues such as echo, feedback, and electrical noise. - Experience integrating ALSA, PulseAudio, or Android Audio HAL layers. - Leadership in projects - Aggressive, open-minded, and positive attitude - Familiarity with the network configuration - Familiarity with test equipment like TDR, Network Analyzers

【工作內容】 1. mmWave module EVB development, placement, PCB stack-up design, layout, Simulation guidance. 2. RF Performance verification. 3. Reliability and sample build failure debug and e-FA guidance. 4. Hardware characterization test and report preparation. 5. BOM maintenance execution.

1. 主動式電子掃描陣列 (相控陣列) 射頻元件及電路板佈局設計。 2. 評估與天線、熱控、電源、及機構之整合相容性，並進一步除錯和優化。

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to the next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons, all while shaping the future of connectivity. Responsibilities - Perform electrical validation of high-speed interfaces such as PCIe Gen3~Gen5, Ethernet (802.3 10G/25G/100G/400G), DDR4/5, SATA, and USB3 - Perform electrical validation of low-speed interface, including I2C, SPI, MDIO, eMMC, and RGMII. - Perform chip-to-chip SerDes signal validation, including SGMII+, UXSGMII interfaces. - Plan and execute power testing strategies for multiphase power stages and DC buck converters. - Perform power integrity validations, including ripple noise analysis, power sequencing verification, electronic load (E-load) operation, and power supply unit (PSU) evaluation. - Develop and execute test scripts under Linux environments, familiar with shell commands and automation scripting. - Collaborate with the HW team and chip vendor to define and document SI/PI validation plans and requirements. - Analyze and identify SI/PI issues, and work closely with HW, FW, layout teams, and chip vendors to develop improvement solutions that enhance electrical performance and signal integrity quality. Requirement - Solid experience with SI test equipment (oscilloscope, BERT, VNA, TDR). - 3+ years of hands-on experience in Signal Integrity, and SerDes/PCIe/USB/DDR validation. - Solid understanding of compliance testing methodologies, eye diagram, and litter analysis. - Strong understanding of low-speed interface protocols and comprehensive experience in AC/DC characteristic validation. - Bachelor’s/Master’s degree in Electrical Engineering, Electronics, or related fields. - Excellent problem-solving skills, ability to debug SI/PI issues, and strong cross-functional communication with HW design and layout teams. Preferred Qualifications - Experience working on system-level signal validation in server, networking, or storage platforms with high-speed interfaces. - Familiarity with Power Integrity validation, including power sequence, ripple noise, OCP, and SCP testing. Benefits - International work environment and collaboration with global development teams - Excellent work conditions - Competitive package: great pay, perks, and benefits - Group insurance and health coverage - Flexible working hours and patterns - Complimentary drinks and snacks at the office

1、主要負責藍芽通訊系統的硬體設計以及RF性能驗證 2、有無線射頻電路設計基礎，熟悉微波通訊或天線設計為佳 3、熟悉BQB&FCC驗證為佳

1. 主動式電子掃描陣列 (相控陣列) 雷達系統之硬體電路設計。 2. 熟悉RF PCB Layout Guideline與PCBA廠商管理。 3. 理解SI/PI的觀念。

Summary: Part of design automation team to enable and verify Printed Circuit Board (PCB) hardware and layout designs. Essential Duties and Responsibilities: • Execute Power Integrity (PI) tools and provide inputs to design and lab teams • Execute Signal Integrity (SI) tools and provide inputs to design and lab teams • Develop scripts to provide solutions in design and PCB manufacturing issues • Define and develop design methodologies to improve design quality and productivity • Engage with Computer Aided Design (CAD) tool vendors for tool evaluation and support • Engage with PCB and CM vendors to understand and evaluate PCB materials and stackups

1. 無線通訊RF電路的設計、優化、驗證(LTE, WiFi, BT, NFC, GPS等) 2. 設計規格評估、線路圖與電路佈局設計 3. 射頻系統共存Co-existence分析、De-sense對策、EMC射頻法規問題改善 4. 協助產品導入生產線量產

ᴘᴜʀᴘᴏsᴇ ᴏғ ᴛʜɪs ᴘᴏsɪᴛɪᴏɴ As the Sustain Hardware Technical Lead for the Industrial Ethernet Equipment product line, responsible for leading technical operations, design revisions, and customer technical support for mass-produced products. This role involves coordinating cross-functional collaboration to resolve issues and drive design improvements, with the goal of effectively extending the product lifecycle and mitigating supply chain risks. ᴍᴀᴊᴏʀ ᴀʀᴇᴀs ᴏғ ʀᴇsᴘᴏɴsɪʙɪʟɪᴛʏ 1. Hardware Sustaining & Design Optimization: Lead and execute hardware revisions and design updates in response to supply chain changes (e.g., component end-of-life) or to enhance product performance and reliability. - Project management of all hardware and validation related activities in schedule plan. - Evaluate replace solution and translation into designs. - Evaluate design change requests from customer need. 2. Cross-Functional Collaboration & Problem Solving: Coordinate with cross-functional teams, including R&D, Manufacturing, and Quality Assurance, to efficiently resolve complex hardware issues reported from the field or internal teams. You will be expected to drive root cause analysis and implement continuous improvements in both design and processes. 3. Supply chain Strategic Achievement: Ensure the long-term stability and reliability of the product portfolio. Your efforts will directly contribute to extending the product lifecycle and proactively mitigate supply chain risks to guarantee consistent product delivery. - Evaluate second source and test plan for alternative assessment procedure. - Risk management / Mitigation of Risks regarding component level in product.

Hardware Engineer will work with Product Owner, Software team, NPI team and Contract Manufacturer for being the focal point of delivering hardware solution and product design per request, both internal and external. Responsibilities • Design hardware solution (System of Systems) to fulfill company's goal • Owns EE design of the rugged products based on ARM or x86 - Create and maintain OrCAD schematic - Create layout guide and work with layout house - Guide rest of team through PCB fab's EQ process • Work with Mechanical Engineers and NPI Process Engineers for DFM • Create and maintain debugging procedures

1.熟悉硬體工程師的職責。 2.design philosophy, circuit entry , layout guidance ,performance analysis, prototype debugging。 3在ARM based 領域，Linux platform。 4.對FPGA 熟悉，或RFSOC 清楚。

1.負責陣列天線開發、設計、測試、驗證與認證。 2.具備場型, EVM, EIRP, 量測能力。 3.參與主動陣列天線量測與分析。 4.微波/毫米波電路設計與測試。 5.具PCB電路布局經驗。 6.具射頻模擬能力。

【工作內容】 1.開發無人機無線通訊模組相關電路設計（涵蓋 RF/數位/電源）。 2.執行硬體測試與效能驗證，並與韌體及飛控團隊合作進行系統整合。 3.支援新產品量產導入，協助進行硬體問題分析與解決。 4.撰寫設計文件與技術規格，確保研發成果具備完整性與可追溯性。 【工作技能】 1.無線通訊與 RF設計：熟悉調變技術（QPSK、OFDM、FSK）與鏈路預算計算。 2.具UAV 專用鏈路設計經驗（RTK GNSS、控制通訊、影像回傳）。 3.熟悉 RF 電路設計（如 LNA、PA、Filter）。 4.天線設計：具備天線設計與驗證經驗，能進行效能優化與模擬分析。 【擅長工具】 1.MATLAB / Simulink（通訊模擬） 2.ADS、HFSS、CST（RF/電磁模擬） 3.Altium Designer （PCB 設計） 【其他應備條件】 1.熟悉量測儀器操作（VNA、頻譜分析儀、訊號產生器、示波器）。 2.具備 VSWR、Return Loss、S-parameter 測試與分析經驗。 本職位在無人機通訊系統開發中扮演核心角色，負責電路設計、測試驗證及系統整合，並協助新產品量產導入。 我們期待您具備專業技術與解決問題的能力，與團隊攜手打造高效能且穩定的無人機通訊系統，共同推動產品邁向市場。 溫馨提醒：僅有經全一電子授權之人員能處理您的個人簡歷，全一電子亦將遵守相關法規與政策，妥善保護您的個人資料。投遞簡歷即表示您同意全一電子蒐集並使用您的個人資訊。

1、負責治具製作。 1、RF module製作(含layout、 RF 匹配、及文件製作)。 2、RF IC應用測試。 3、協助客戶解決RF系統應用問題。

電源測試工程師（模塊） 工作職責 1.負責伺服器電源產品軟硬體測試工作，負責通信電源產品模組（黑盒 / 白盒）、系統測試工作。 2.參與產品的前期規劃與設計。 3.負責測試方案設計、測試用例設計。 4.編寫測試規範。 5.測試平台設計。 6.負責測試過程中遇到的所有與測試相關的測試問題解決。 職位要求 1.本科及以上學歷，自動化類、電力電子、電氣相關專業。 2.具備較好的模電數電基礎，熟悉電力電子常見電路，有較強的動手能力。 3.熟悉常見的電源拓撲電路（例如 LLC / 圖騰柱 PFC 等）。 4.英語水平讀寫能力良好。 5.做事認真，有較強的原則性；工作主動性強，能獨立思考和解決問題。 優選條件 1.有開關電源、伺服器電源類產品開發經驗者優先。 2.有測試專案經理經驗者優先。

##職務說明 - RF系統電路架構規劃及設計 - 電子元件評估與選用 - 與Layout工程師、結構工程師溝通、協調並完成電路、佈局設計及確認 - 電路板測試驗證及除錯檢討 - 執行產品研發流程及技術文件產出 - 協助系統規劃、整合、測試、分析與除錯 ##技能需求 - 具電路 RF / Analog / Digital 電路設計經驗 - 熟悉量測儀器使用 - 具備基礎焊接能力 ## 12週培育計畫 - 技術基礎：掌握 RF 知識與工具操作，瞭解系統電路架構與設計權衡，建立設計與實作能力 - 實作應用：完成 RF 系統電路板設計、Layout 及測試驗證 - 儀器操作：熟練使用 RF 儀器並使用Cora Z7開發板進行數位訊號控制以及自動化控制儀器量測 - 成果呈現：展示專案成果，獲得回饋，奠定職涯基礎

Job Responsibilities : • Primary responsibilities including EMC design and test. Work closely with internal team, customer and suppliers deliver on time, cost and quality from EMC perspective, and improve EMC one time pass rate • Provide guidance during product design, like EMC risk assessment, schematic review, PCB layout review, Mechanical drawings review, lessons learn of EMC related • Be responsible for the EMC test case specification according to the product requirements • Be responsible for verification on EMC test, communication with external test laboratories analysis of test results, generate test report • Be responsible for applying the new product for safety and EMC certification, and get approval • Technical support for customer projects EMC related topics. Requirement : • Full-time Bachelor or Master Major in Microwave, EMC, electrical, electronic, Mechanical engineering, etc. • Minimum 8 years experience in EMC test, design, and certification • Proficient in EMC Principle • Proficient in EMC standard and test, Experience of EMC test equipment and test software • Proficient in using oscilloscope, spectrum analyzer and receiver • Strong ability on trouble shoot or resolve issues related to EMC and safety compliance • Familiar with world-wide certifications and agencies such as UL, TUV, FCC, VCCI, BSMI, KCC, ANATEL, NEBS • Familiar with international regulatory standards such as CISPR32/35, GR1089, EN300386, UL60950, IEC62368, etc. • Experience in EMC design of Storage/Server/Communication (Network switch products) is preferred; • Experience in AC power supply or DC power supply EMC design is preferred • Experience in HFSS/CST/SPICE or other EMC simulation is preferred • Fluent English listening, speaking, reading and writing skill, capable of international communication, CET-4. • Excellent documentation skills including record maintenance/ tracking and understanding of document traceability • Good initiative and positive personal personality , Self-motivation • A detail-oriented individual, and the ability to work in a team environment, as well as individually

FIH作為全球移動通訊設備領導廠商，持續擴展多元商業機會，跨足通訊產品生產製造、自動化機器設備研發、車載軟硬體整合研發等類別。我們相信-創新源於開放的思維和無限的可能性。我們追求的不僅僅是技術的突破，更是一個共同創造的過程，園區智能生產線連接著各個環節，我們的產品從零件到成品，都經過嚴格的品質控管，確保最優質的創新產物。 我們歡迎不同背景、不同專業領域的人才加入我們的團隊! 【主要工作職責】 1.負責AI行動裝置,手機與物聯網（IoT）相關產品之電子EE電路設計與研發。 2.執行EE基頻功能測試與問題除錯，確保產品性能與穩定性。 3.持續追蹤並研究基頻領域之新興技術，導入創新解決方案以提升產品競爭力。 4.與製造端協同合作，參與試產與量產計畫，並推動良率提升與製程優化。 5.跨部門協作並與客戶進行技術溝通，確保專案需求準確落實並維持良好合作關係。 6.其他主管交辦相關工作任務。

• Design high speed PCBs for Ethernet applications including performing pre and post layout signal and power integrity simulations. • Perform PCB layout and signal/power integrity design reviews. • Effectively plan and organize board build process, component procurement, board bring-up, debug, and testing to ensure technical objectives and schedules are met. • Interact with cross-functional teams like design, marketing, software and validation on their board requirements and update status on the board builds.

※ 目前初試皆採Teams線上面談 ※ 具相關工作經驗者依學經歷專業核薪，待遇面議 ※ 本職缺工作待遇為相關系所應屆碩士畢業者，歡迎應屆畢業生投遞 1. HFSS模擬 (PCB板材選料對應RF Trace width & PCB stack) 2. 負責RF Ku/K/Ka band射頻電路選料與Tx/Rx Link budget計算 3. 搭配模擬結果指導layout工程師進行電路板佈局設計 4. 量測CW/OFDM在RF系統的Tx/Rx規格 並 進行debug 5. EMI & RF de-sense 處理