* OSAT (Assembly/Test) 良率異常分析 & 處理。
量產測試驗證,確保量測參數 & 規格符合設計要求。
* 測試結果資料分析,提供良率改善 & 測試流程優化建議。
* CP / FT / SLT 數據追蹤,擬定調整製程參數 or 條件。
測試開發、Debug & 參數優化,提升測試效率 & 良率穩定度。
* 與內部製程/設備/品保單位進行問題分析,釐清異常並提出改善方案。
* 支援測試需求 & 技術交流,確保產品測試時程 & 品質達成量產目標。
1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc.
2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities.
3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently.
4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality.
5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team.
6. Annual salary: 800K NTD and above
7. Onsite MediaTek - Hsinchu Science Park Office
This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency.
Ref.
* CP (Wafer level - Chip Probing)
* FT (Packaged chip level - Final Test)
* SLT (Packaged chip level - System Level Test)
* ATE (Automated Test Equipment)
Join our Automotive SoC design team and drive the development of Design-for-Test (DFT) architecture for next-generation automotive system-on-chips. You will own DFT methodology definition, design, and implementation, collaborating closely with RTL, physical-design, and test-engineering teams to deliver high-quality, ISO 26262-compliant silicon.
1. Define and implement SoC-level DFT architecture (SCAN, MBIST, LBIST,
boundary scan, JTAG, etc.).
2. Support the full product life-cycle from new-product introduction (NPI)
through mass production (MP):
* Develop and debug ATE test programs.
* Drive test-coverage closure and yield improvement.
* Optimize test time and cost.
3. Interface with IP owners, test engineers, board-design, and process teams to
ensure CP/FT/SLT test requirements are met.
4. Provide technical leadership on automotive functional-safety (ISO 26262) DFT
flows and documentation.
* OSAT (Assembly/Test) 良率異常分析 & 處理。
量產測試驗證,確保量測參數 & 規格符合設計要求。
* 測試結果資料分析,提供良率改善 & 測試流程優化建議。
* CP / FT / SLT 數據追蹤,擬定調整製程參數 or 條件。
測試開發、Debug & 參數優化,提升測試效率 & 良率穩定度。
* 與內部製程/設備/品保單位進行問題分析,釐清異常並提出改善方案。
* 支援測試需求 & 技術交流,確保產品測試時程 & 品質達成量產目標。
1. Co-work w/ functional engineering team member (TME/DE/TD/TE/RE) to make new product has good definition, Risk evaluation and Build comprehensive testing plan / Qual plan, etc.
2. Co-work w/ other Engineering team member to ensure all new product can be thoroughly Manufactured, Characterized and Qualified for reliabilities and qualities.
3. Organize assignments and independently schedules to complete assigned tasks timely and make project finished efficiently.
4. Have good Coordination and Data Analysis to solve difficult problems through application of various techniques and approaches to develop effective and practical solutions that result in improved products, processes with good quality.
5. Co-work with MediaTek - Taiwan Team, and HCLTech - India Team.
6. Annual salary: 800K NTD and above
7. Onsite MediaTek - Hsinchu Science Park Office
This position is set for PE (Product Engineer) to coordinate new product development activities, ensure timely completion of all new products manufacturing, testing, characterization, qualification and releasing with good consistency, quality and efficiency.
Ref.
* CP (Wafer level - Chip Probing)
* FT (Packaged chip level - Final Test)
* SLT (Packaged chip level - System Level Test)
* ATE (Automated Test Equipment)