1. To improve device yield &CIP in order to meet customer request and customer service.
2. Identify and solve process and device problems.
3. Support for customer visit and audit.
1. Customer Engineering Account Management
-Meet and exceed customer's expectation of advanced package engineering in teams oof quality,cost and delivery.
-Offer industrial leader's advanced package solutions and services through integration of package and process development.
2.Team work
-To optimize resource allocation.
-Enhance teamwork in 360。 including customer,supplier and our colleagues.
-Develop self and others.
3. New product introduction
4. Implement and coordinate NPI plans
5. Process integration data analysis and reporting
6. Abnormal analysis and experimental DOE Plan
7. New materials and process evaluation plan
*實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。
*資深人員薪資另議。
【Customer Engineering Account Management】
(1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery
(2)Offer industrial leader’s advanced package solutions and services through integration of package and process development
【Project management】
(1)Project phase in schedule arrangement and follow up
(2)SWR arrangement ,schedule follow up, negotiation…etc.
(3)PKD/PMD creation (PLM)
(4)Reliability arrangement
【Team Work】
(1)To optimize resource allocation
(2)Enhance teamwork in 360° including customer, supplier and our colleagues
(3)Develop self and others
1. 薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘;
2. 資深人員薪資另議。
【Customer Engineering Account Management】
(1)Meet and exceed customer’s expectation of advanced package engineering in terms of quality, cost and delivery
(2)Offer industrial leader’s advanced package solutions and services through integration of package and process development
【Project management】
(1)Project phase in schedule arrangement and follow up
(2)SWR arrangement ,schedule follow up, negotiation…etc.
(3)PKD/PMD creation (PLM)
(4)Reliability arrangement
【Team Work】
(1)To optimize resource allocation
(2)Enhance teamwork in 360° including customer, supplier and our colleagues
(3)Develop self and others
執行晶圓級封裝AOI製程專案開發、製程整合、良率改善及缺陷分析
詳細職責如下:
1. Maintaining process flow and recipes on MES, and tools and recipes on RMS.
2. Handling abnormal cases on MES and conducting daily yield analysis.
3. Supporting New Product Introduction (NPI) and Design of Experiments (DOE), and preparing summary reports.
4. Developing and implementing process improvements to enhance yield and productivity.
5. Conducting root cause analysis for defects and collaborating with cross-functional teams to resolve process-related issues.
此職務需日夜輪班 (做二休二,約每三個月日夜輪調一次)
日班上班時間:07:20~19:30 (中間休息2小時10分,實際工時10小時)
夜班上班時間:19:20~07:30 (中間休息2小時10分,實際工時10小時)
* 熟悉半導體晶圓級製程或具備跨部門溝通經驗尤佳。
*實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。
*資深人員薪資另議。
【工作內容】
一、輪班人員:
.產品電性測試結果分析與改善
.客戶工程支援
.產品維護及管理
.DN發送與Release
※ 無經驗可,提供完整在職訓練
二、常日班人員(RF/Logic IC):
.新客戶工程品(新)導入量產之專案執行
.NPI各階段試產支援(HVM/LVM from EVT to PVT)
.MES, ERP,等相關製造系統操作與維護
.電性分析、RF S參數分析等相關良率改善活動與Probe card驗證
.測試程式、與其附屬之OI、UI介面驗證與優化
.量產品、工程品之日常貨批處置執行與管理
.問題分析與解決、改善之相關活動
.定期(週/月/季)客戶會議driving及客戶工程需求評估暨溝通協調與資訊反饋
.Launching New Customers and Products into Mass Production
.NPI high/low volume manufacturing support
.MES, ERP, each kind of engineering system software operating
.Electronic & s-parameter analyze, yield improvement, probe card verification
.Conducting validate test program, software, OI and UI systems
.Managing hold-lot and disposition
.Performing Problem-solving activities
.Holding regular meetings and providing reports to customers
【工作班制】
一、輪班制
.班別:作三休三 OR 作四休二
.時間:日班07:20-19:20/夜班19:20-07:20(實際工時10小時,休息2小時)
.輪調:每3個月日夜輪調一次
二、常日班
.班別:週一至週五,週休二日
.時間:08:30-17:30
【工作地區】
湖口光復廠:新竹縣湖口鄉光復路12號
【薪資說明】
.依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
.輪班人員之輪班津貼&班制津貼另計
1. Project Management by documentation, report, summary, meeting minutes, action items tracking to closure.
To work with Sales/Fab to win T/O & complete supervisors' assignment.
2. Mask tape-out initiation/coordination
3. Customer satisfaction through cross-departments coordination & collaboration
to make competitive products
4. Manage conference call meeting and customer visit.