「Senior Signal Integrity Engineer(TDC)」的相似工作

The Lead Engineer job is to design and development of Power connector and Cable. • 8 years above connector/cable design working experience. Your job is to provide power solutions to data center, telecom, industrial, and automotive customers. Work closely with key customers and management to develop custom products. • Create drawing, specification documents required to define and build products: drawings, material specifications, bills of materials and manufacturing processes. Work with cross-functional, multi-site teams to develop solutions. • Provide technical support to Sales and marketing personnel including technical training, presentations and customer visits. • Coordinate, analyze and assess testing and qualifications in order to insure product conformity with specifications. Assess the quality and functionality of prototypes and samples for customer use and adherence to performance standards. • Provide support to manufacturing facilities on cost down, quality, customer issues. • Stay abreast of technological developments in the connector and interconnection industries. • Apply patent request when applicable in order to protect intellectual property.

• As a SI engineer you will work with our internal Sr. SI and product development engineers of different Bus for customers’ inquiries. • Assist in optimizing customers’ pcb footprint and generate SI report of channel simulation. • Provide SI strategies for customer pinouts and routing challenges. • Help to measure customers’ circuit boards or in-house test fixtures for verification or debugging of our products.

This role is responsible for supporting connector installation, inspection, and related application processes at customer sites and their contract manufacturers (CMs). This position requires technical understanding of the mechanical and electrical functions of the connector components and the related impact of installation variables. This position will interface closely with customers and their CM sites to develop an understanding of their application process and will work collaboratively to improve application quality and consistency. Strong communication, technical understanding, and interpersonal skills are critical in this role. • Work closely with customers and their contract manufacturers to evaluate and address connector challenges/concerns as they relate to the production process and functional integrity of the connector • Assist customers and CMs with new process development related to the connector and establishing proper connector application and handling processes • Observe and assess customer/CM processes and provide constructive feedback • Function as the “first responder” for customer/CM quality concerns, with ability to provide initial containment feedback and collect relevant data for distribution to the internal team • Work closely with internal development, NPI, and quality engineering teams to provide feedback for continuous improvement of connector quality • Receive feedback from customer/CMs on potential product and packaging improvements and evaluate improvement feasibility with internal team • Develop and evaluate custom application tooling as specified by the customer/CM • Update customer-accessible documentation related to connector application and inspection • Monitor CM production yields related to the connector and provide feedback/assistance for process improvement as needed • Perform quantitative analysis of quality concerns at customer/CM site • Coordinate procurement of necessary application tooling in preparation of initial customer system

The Product Design Engineer for overpass solutions is mainly focusing on developing high speed cable solutions for front IO, near chip and Co-package chip applications. This position will highly engage with customer in early design stage, providing technical expertise on mechanical, cable route, and application hardware. Role and Responsibilities - Work closely with customer and their contract manufacturers to understand their design requirements, evaluate the challenging, and provide full workable interconnection solutions including connector interference, connector fitting structural, cable management, and application hardware. - Mechanical design and concepting in 3D model:  Front IO cage overpass solution.  Custom design for cage mechanism.  Work with thermal engineer to optimize thermal solution for customer.  Near chip overpass solutions:  Provide technical guidance to customer on product selection.  Design for different pairs configuration, connector fitting mechanism, cable output and management, and application hardware if needed.  Co-package copper overpass solutions:  Work with customer to complete the design that our connector can fit into customer’s package, including optimize connector layout in substrate, alignment feature and fitting mechanism, application hardware. - Verify if the design if it meets design objectives by varies engineering tools such as tolerance analysis, FEA, failure mode effect analysis… - Create complete cable assembly drawing including two ends solutions, wiring chart, cable pre-bending geometry(if needed). - Work with cross function team(mechanical, signal integrity, manufacturing) to ensure the design can be transited to mass production. - Create test plan and strategy for product in NPI status to verify the reliability, robustness in application before shipment.

THE ROLE The Lead Signal Integrity Engineer is a technical leader responsible for advancing Isola’s laminate materials to meet and exceed high-speed electrical and signal integrity (SI) performance requirements. This role provides mentorship and direction to the Signal Integrity team in Taiwan, drives innovation in SI test methodologies, and ensures strong technical engagement with global OEMs. The Lead serves as a recognized authority in SI, bridging customer needs with material performance and representing Isola in the high-performance electronics community. KEY RESPONSIBILITIES: Customer-Facing Technical Support: • Lead technical engagement with OEMs and direct customers on high-speed laminate characterization. • Act as primary technical contact for SI-related design validation and adoption cycles. • Oversee the creation of technical reports, white papers, and collateral for internal and external use. Strategic & Technical Leadership: • Define and develop advanced SI measurement, modeling, and simulation methodologies. • Collaborate with Product Management, R&D, and Sales to ensure alignment of SI capabilities with product strategy. • Represent Isola as a thought leader through publications, conferences, and industry forums. Organizational Management: • Mentor, guide, and grow the Taiwan-based Signal Integrity Engineering team. • Establish scalable, cost-effective SI test methods that accelerate R&D and customer response. • Drive alignment with global Application Engineering teams to ensure best-in-class technical service. Technology & Standards Thought Leadership: • Maintain expertise in SI methods, PCB processing effects, and high-speed digital design requirements. • Contribute to industry standards development and support customer forums on SI requirements. QUALIFICATIONS & EXPERIENCE • 8+ years of experience in signal integrity engineering, PCB laminates, or high-speed design. • Expertise in VNA measurements, probing techniques, and advanced SI methodologies. • Experience with PCB manufacturing and processing effects on SI performance. • Demonstrated leadership and mentoring experience. • Proven record of technical publications, white papers, or conference presentations. EDUCATION • PhD or Master’s in Electrical Engineering or related field required. OTHER CONSIDERATIONS • Fluent in English – required for global communication and technical documentation. • Proficiency in Mandarin Chinese – strongly preferred for engagement with Taiwan/China teams and customers. • Ability to travel regionally and globally as needed.

1、SI高頻量測與分析,測試環境架設維護、文件撰寫 2、Switch Box control Board build and re-design 3、不良分析改善及對策提供 4、導通設備維護與測試。 ＊＊實際薪資將依學經歷及相關工作核定＊＊

Your Job Molex is seeking a Senior PCB Layout Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world-class engineering team, contributing to the design and development of next-generation coherent and PAM4 optical transceivers. The Senior PCB Layout Engineer will be responsible for creating high-speed, high-density PCB layouts that meet stringent signal integrity, power integrity, and thermal requirements. This role involves close collaboration with electrical, mechanical, optics and process integration engineers across global teams to ensure optimal performance, manufacturability, and reliability of our advanced optical transceiver modules. Our Team R&D Optoelectronic Solutions What You Will Do - Lead multi-layer PCB layout design for high-speed optical transceivers (e.g., QSFP-DD, OSFP). - Translate complex schematics into production-ready layouts using EDA tools. - Define layout constraints, stack-ups, and component placement in collaboration with cross-functional teams. - Support board bring-up and debug through layout reviews, lab measurements, and issue resolution. - Ensure compliance with DFM, DFT, and IPC standards; coordinate with vendors to address fab and assembly issues. - Generate and manage all fabrication and assembly outputs (Gerbers, ODB++, BOMs, drawings). - Mentor junior engineers and drive continuous improvement in layout processes and design practices. Who You Are (Basic Qualifications) - Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field. - More than 8 years of hands-on PCB layout experience in high-speed digital or optical communication products. - Proficient in Allegro PCB design software. - Strong knowledge of high-speed signal integrity, power integrity, PCB stack-up design, and layout best practices. - Experience with interfaces such as SerDes (e.g., 112G/224G PAM4), I²C, SPI, MDIO, and power delivery networks. - Familiarity with EMI/EMC mitigation techniques and thermal design considerations. - Solid understanding of PCB fabrication and assembly processes. What Will Put You Ahead - Experience with 800G & 1.6T optical transceiver PCB layout. - Familiarity with signal and power integrity simulation tools (e.g., Sigrity, Ansys, HyperLynx). - Previous involvement in volume production and high-reliability designs for data center or telecom applications.

1. RF天線最佳化模擬。 2. 電磁元件設計模擬。 3. 相關量測(RF天線)。 4. 能獨立工作及專案執行。

該職務隸屬於LOTES嘉澤端子研發中心，為長期外派RD職缺! Job responsibilities: 1. 與產品設計人員溝通討論各項高頻參數規格。 2. 針對產品高頻與機構需求提出設計建議。 3. 設計並驗收產品之高頻測試治具。 4. 進行高頻高速信號測量與模擬。 5. 與其他研發團隊協作，提供高頻領域的技術支援和解決方案。

1. 進行訊號完整性與電源完整性(SI/PI) 模擬與優化分析 2. 執行SI實體卡測試量測與結果分析 3. 完成其他主管交辦事項

【產品範疇】 1.DDI / TP / TDDI/ TCON/ Power等顯示相關產品 【工作內容】 1. SI/PI/EM issue solving, performance optimization, and design rule development 2. Chip/PKG/Board simulation and measurement for SI/PI/EM issue. 3. Co-work with system engineers, IC designers, and customers on product design-in tasks.

PRIMARY JOB DESCRIPTION: • Responsible for performing signal integrity and power integrity simulation analyzing DIMM products in different form factors. • Work with layout team and NPI team for achieving good board routing and releasing to production • Will interface with SMART global design teams PRINCIPAL DUTIES AND RESPONSIBILITIES: • Perform channel margin analysis to provide design tradeoffs among package, board, and connector on products starting from the technical specifications from different controller and NAND flash vendors in different form factors • Perform PCB timing analysis, work with layout designers and hardware engineers to implement all signal integrity rules • Perform PCB power margin analysis, work with layout designers and hardware engineers to implement all power integrity rules • Develop layout signal/power integrity rules guideline or document on new products starting from the technical specifications from different DRAM vendors in different form factors • Capability to execute trouble shooting and provide workable solution to SMART global R&D teams and customers • Communicate and work closely with global R&D teams to achieve targeted schedule for PCB board release • Write a Layout guidance document. Organize and research technical reports and share

1. 訊號完整性模擬(PreSim and PostSim) 2. 電源完整性模擬(DC Drop/AC impedance/DeCap Optimization) 3. 針對PCB Layout提出建議。 4. 模擬與量測結果分析驗證。

PCIE/ Ethernet for AI Server High Speed EE for SI/HW/PCB design 1. 被動式(DAC)/主動式(ACC, AEC)及其他高速產品(USB, HDMI等)Paddle Card 、測試板等產品相關PCB之電子電路& PCBA設計, 並進行設計方案之電氣及 SI/PI驗證。 2. 高速系統模組之訊號匹配, 衰減, 頻率響應等各式高頻參數特性的設計。 3. 串接相關單位完成產線自製測試設備 PCB 設計及驗證。 4. 配合客戶進行高速高頻配件產品與線纜產品設計, 實現對應 PCBA電路設計並完成產品測試/驗證。

1. Performing DC IR drop and AC impedance simulation. 2. Improve simulation/validation efficiency and performance by automation. 3. Execute SI/PI/RF/EMI verification for the system requirements. 4. Build up SI/PI simulation and measurement correlation database. 5. Build up design and test capability including design guidance and lab setup. 6. Working with HW teams to optimize high-speed signal.

1. Support customer projects from design-in, design-through to mass-production. 2. Team work with AE, FAE, RD and QA to solve problems.

1. 馬達磁路設計 2. 電磁場模擬分析 3. 新技術研究與導入 4. 馬達性能測試與驗證工作 5. 馬達開發專案執行與管理 6. 供應商及產線溝通協調 7. 問題解析與處理

• Interact / Interface w/Amphenol Commercial and High-Speed BU teams on material supply, buffer inventory, manage aging inventory, etc. requirements. • Interface/communicate via e-mails, F2F, phone conversations with key account customer on expedites, COS, part number shipment details, RFQ activities. • Integrate with Sales and BU Product Managers on key Design opportunities. • Integration w/Direct and ODM account teams on key metrics that will deliver growth. • Develop a successful Business Continuity Plan. • Integrate with all BUs to develop an annual cost down plan. • Support Business Management Meetings (QBR), and strategic annual business plans. • Integration with all Bus on key metrics • Market share monitor w/BU and Sales team • Align businesses to deliver customer forecasts. • Integrate and manage PCNs internally and externally w/customers • Manage customers’ Key Initiatives by working with Sales/FAE and BU’s. • Integrate with Amphenol’s BU team to support RBA, Resilinc, plant quals., etc

1. IoT產品開發 (IP-Camera/ NVR/ IoT base station/ Smart Thermostat)；或者有線、無線之影音通訊系統產品研發 2. Circuit/PCB design, System integration, design verification (CPU/ Power/ LAN/ wireless interface/ CMOS sensor/ Battery) 3. PCBA integration, SI measurement, Function test, EMI debug

[Responsibilities] ★ Experienced in ISP (Image Signal Processing) ★ Plan design architecture. ★ Develop high quality digital design. ★ Be familiar with IC design flow. [Minimum Qualifications] ★ Outstanding problem analysis and debugging skills. ★ Experienced in C language. ★ Experienced in Verilog RTL language ★ Experienced in digital IC design front-end flow ★ Experienced in CAD tool usage such as simulation tool, linting tool, synthesis tool, member compiler [Preferred Qualifications] ★ Nice to have experiences in scripting language. ★ Nice to have experiences in FPGA flow