「Senior Signal Integrity Engineer(TDC)」的相似工作

【產品範疇】 1.DDI / TP / TDDI/ TCON/ Power等顯示相關產品 【工作內容】 1. SI/PI/EM issue solving, performance optimization, and design rule development 2. Chip/PKG/Board simulation and measurement for SI/PI/EM issue. 3. Co-work with system engineers, IC designers, and customers on product design-in tasks.

Your Job Molex is seeking a Senior PCB Layout Engineer to join our Optical Solutions Business Unit (OSBU). In this role, the successful candidate will be part of a world-class engineering team, contributing to the design and development of next-generation coherent and PAM4 optical transceivers. The Senior PCB Layout Engineer will be responsible for creating high-speed, high-density PCB layouts that meet stringent signal integrity, power integrity, and thermal requirements. This role involves close collaboration with electrical, mechanical, optics and process integration engineers across global teams to ensure optimal performance, manufacturability, and reliability of our advanced optical transceiver modules. Our Team R&D Optoelectronic Solutions What You Will Do - Lead multi-layer PCB layout design for high-speed optical transceivers (e.g., QSFP-DD, OSFP). - Translate complex schematics into production-ready layouts using EDA tools. - Define layout constraints, stack-ups, and component placement in collaboration with cross-functional teams. - Support board bring-up and debug through layout reviews, lab measurements, and issue resolution. - Ensure compliance with DFM, DFT, and IPC standards; coordinate with vendors to address fab and assembly issues. - Generate and manage all fabrication and assembly outputs (Gerbers, ODB++, BOMs, drawings). - Mentor junior engineers and drive continuous improvement in layout processes and design practices. Who You Are (Basic Qualifications) - Bachelor's degree in Electrical Engineering, Electronics Engineering, or a related field. - More than 8 years of hands-on PCB layout experience in high-speed digital or optical communication products. - Proficient in Allegro PCB design software. - Strong knowledge of high-speed signal integrity, power integrity, PCB stack-up design, and layout best practices. - Experience with interfaces such as SerDes (e.g., 112G/224G PAM4), I²C, SPI, MDIO, and power delivery networks. - Familiarity with EMI/EMC mitigation techniques and thermal design considerations. - Solid understanding of PCB fabrication and assembly processes. What Will Put You Ahead - Experience with 800G & 1.6T optical transceiver PCB layout. - Familiarity with signal and power integrity simulation tools (e.g., Sigrity, Ansys, HyperLynx). - Previous involvement in volume production and high-reliability designs for data center or telecom applications.

1. 進行訊號完整性與電源完整性(SI/PI) 模擬與優化分析 2. 執行SI實體卡測試量測與結果分析 3. 完成其他主管交辦事項

We are seeking a highly skilled and motivated Field Application Engineer to provide advanced customer engineering support across our key semiconductor customers. This role will act as a critical technical interface between customers and our internal teams, focusing on problem solving, project execution, and proactive alignment with customer requirements and technology roadmaps. The successful candidate will play a hands-on role in delivering world-class technical support, ensuring rapid issue resolution, and strengthening long-term customer relationships. Key Responsibilities: 1. Advanced Technical Support · Provide expert-level advice on hardware requirements to enable successful loadboard/module design projects. · Conduct schematic capture, component placement, and routing support when needed to address complex technical challenges. · Act as a senior technical resource for diagnosing hardware-related feasibility and performance issues. 2. Customer Engagement & Relationship Building · Gather and validate customer requirements to ensure sufficient information for initiating design projects. · Serve as the primary technical contact, managing expectations and maintaining clear communication with customer engineering teams. · Manage customer interactions throughout the project lifecycle to ensure satisfaction and successful delivery. 3. Application Engineering & Solution Development · Assess and estimate project schedule, cost, and feasibility to define realistic plans. · Support design-in activities by translating customer requirements into technical hardware solutions. · Deliver technical updates, training, and presentations to customers and internal stakeholders. 4. Cross-Functional Collaboration · Collaborate with internal design and project management teams to align project execution with customer requirements. · Provide structured feedback from design projects to influence product development and continuous improvement. · Ensure alignment of project execution with both tactical problem solving and longer-term strategic direction. Preferred Traits: · Resilient and Professional Under Pressure – Remains calm and constructive when facing challenges, escalations, or changing requirements. · Proactive Problem Solver with Strong Ownership – Takes initiative, drives resolution, and ensures customer satisfaction while balancing immediate issue-solving with long-term improvements. · Collaborative and Organized Team Player – Demonstrates a positive “can-do” attitude, manages multiple priorities effectively, and works seamlessly with cross-functional and global teams. This job description serves as a general guide to the responsibilities and qualifications expected for the role and may be subject to modification based on the specific needs of the organization.

Role Summary/Purpose: Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, solution evaluation, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology. Responsibilities: • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc. • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up) • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges. • Responsible for global end to end hardware project management to ensure best quality and on time delivery -Device testing requirement assessment and Feasibility study -Risk analysis and mitigation planning -Schedule planning and project management -Design execution -Regular review with global internal and external customers -Quality Control and Verification • Work closely with Global supply chain, provide solution to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate • New technology research, new products, new materials evaluation for next generation device testing • Deliver hardware design training and seminars to customers

工作需求 (Job Requirements) 1.電子相關科系大學或碩士以上 2.2-5年的SI(訊號完整性)設計相關工作經驗 3.熟悉相關SI模擬軟體工具相關經驗 4.需與亞洲不同地區的辦公室協助合作 5.能獨立完成公司交辦的工作 工作職責 (Job Responsibilities) 1.負責3D高頻模擬軟體之售前拜訪、技術支持、產品培訓及專業規劃與執行。 2.熟悉PCB、SI信號完整性等相關模擬經驗 3.負責3D軟體的應用及技術支持給現有與新的潛力客戶 4.負責準時完成主管分配的工作

1. 訊號完整性模擬(PreSim and PostSim) 2. 電源完整性模擬(DC Drop/AC impedance/DeCap Optimization) 3. 針對PCB Layout提出建議。 4. 模擬與量測結果分析驗證。

1. Solidworks繪圖與ANSYS Fluent/ANSYS CFX操作 2. 大型乾燥系統設計以及熱流場模擬分析 3. 二相流(固-氣系統)與顆粒追跡分析 4. 熱流場改善與多物理場耦合分析 5. 分析結果數據整理與實驗驗證

1.SI/PI量測與模分析 2.網路分析儀與探針平台操作 3.量測與模擬數彙整 4.機台操作：網路分析儀 5.專業知識需求：電磁學、微波工程、SI/PI理論分析

1. 數位、類比信號PI/SI模擬及設計優化。 2. VNA、TDR、oscilloscope儀器量測及操作 。 3. 其他主管交辦事項。

PRIMARY JOB DESCRIPTION: • Responsible for performing signal integrity and power integrity simulation analyzing DIMM products in different form factors. • Work with layout team and NPI team for achieving good board routing and releasing to production • Will interface with SMART global design teams PRINCIPAL DUTIES AND RESPONSIBILITIES: • Perform channel margin analysis to provide design tradeoffs among package, board, and connector on products starting from the technical specifications from different controller and NAND flash vendors in different form factors • Perform PCB timing analysis, work with layout designers and hardware engineers to implement all signal integrity rules • Perform PCB power margin analysis, work with layout designers and hardware engineers to implement all power integrity rules • Develop layout signal/power integrity rules guideline or document on new products starting from the technical specifications from different DRAM vendors in different form factors • Capability to execute trouble shooting and provide workable solution to SMART global R&D teams and customers • Communicate and work closely with global R&D teams to achieve targeted schedule for PCB board release • Write a Layout guidance document. Organize and research technical reports and share

1、 負責Ansys高頻電磁場模擬分析軟體之售前拜訪、資料蒐集 2、 技術支援以及技術文件製作;訓練教材製作以及教育訓練。 3、 軟體安裝、簡報製作 4、 Ansys高頻電磁場(SI/PI)模擬分析軟體產品功能研究 5、 高頻相關工程顧問服務專案執行與規劃 6、 高頻相關產業趨勢研究。

因應全球AI應用的發展，公司業務持續成長中，宜鼎國際正在尋找訊號量測工程師加入我們的團隊！ 宜鼎國際致力於服務我們的顧客與合作夥伴，鼓勵面對面的互動和團隊合作。如果您擁有 3年以上相關經驗，並對科技產業充滿熱情，誠摯地邀請您加入我們優秀的團隊，擔任訊號量測工程師，親身體驗我們充滿活力的公司文化。 【工作地點】 -此職位的辦公室設在交通便利的新北市汐止，距離 捷運南港站 或 汐止火車站 或 交流道 僅3-10分鐘車程，大樓就有停車位、Youbike及豐富的公車選擇，讓您的通勤更加便捷。 -辦公大樓過個馬路就到好市多Costco，中午或下班採買日用品超方便，使您的工作和生活更加平衡。 【主要職責】 1. 主板各訊號介面量測驗證 (X86, RISC(ARM), Server) 2. 規劃及撰寫測試計劃書 (Test Plan) 3. 協同硬體研發人員分析波形失效原因 4. 熱衷於研究技術新知，規範架構，從中收集案例，解決問題，分享心得 5. 熟悉TDR、NA的基本操作者優先考量 6. 具備良好的故障排除、解決問題、多工處理和組織管理技能者優先 7. 熟悉示波器使用 8. 協助主管交辦事項 【我們提供什麼】 -在全球AI解決方案與工業級儲存領導品牌的公司中實現自我 -在「一群夥伴、一同經營」核心精神中，積極經營自有品牌，與公司一同成長，共享豐厚的發展機會和福利！ 加入宜鼎國際，一起寫下值得回憶的故事!

☆歡迎計畫年後轉職人才，提前面試卡位!! ▲本職務技術主要運用OPAL-RT即時模擬平台，發展及模擬與電相關的應用領域，對於產品的開發、設計、規畫、模擬及驗證提供快速原型化設計 (Rapid Control Prototyping, RCP) 及硬體迴路測試 (Hardware-in-the-Loop, HIL) 平台，具有強大的分散式運算、彈性擴充以及快速 FPGA 溝通功能，開創更安全、更有效率的研究開發環境。 ▲提供在電力系統、微電網、馬達控制、車輛工程等領域OPAL-RT提供完整的軟、硬體及相關的解決方案。 ▲工作內容說明如下: 1.負責功率級硬件測試在環之系統規劃及開發 2.協助既有客戶及潛在客戶之能源管理、微電網系統之模擬及測試驗證工作。 3.系統規劃及專案管理。 4.內外部技術文章發表。 5.支援公司行銷活動。 6.售前拜訪(產品說明；釐清客戶問題、需求；提出解決方案) 7.處理產品技術問題(測試、安裝、使用...) 8.客戶售後技術服務 9.主管交辦事項 ---------------------------------------------------- ｜遠距辦公。節省通勤成本。溝通不斷線｜ ☆工程師試用期三個月通過後，即可申請遠距辦公方式！ ☆每週只需進公司辦公一天，剩下四天靈活運用外勤出差或在家辦公，節省塞車通勤時間，線上溝通快速不斷線。 ｜舒適好開公務車。公務拜訪便利又安全｜ ☆提供三年內新車預約公務拜訪使用，安全又舒適。 ☆不需自己養車，找車位，公司定期保養管理，外勤無負擔。 ｜工程師獎金加碼，挑戰創新，讓你的專業與成就獲得最大回報！｜ ☆專案獎金 ☆業務分紅 ☆盈餘獎金 ☆年終獎金 ☆中秋、端午獎金 ☆結婚禮金/生育津貼 ☆推薦人才獎金 ☆近3年平均調薪幅度3~5%

PCIE/ Ethernet for AI Server High Speed EE for SI/HW/PCB design 1. 被動式(DAC)/主動式(ACC, AEC)及其他高速產品(USB, HDMI等)Paddle Card 、測試板等產品相關PCB之電子電路& PCBA設計, 並進行設計方案之電氣及 SI/PI驗證。 2. 高速系統模組之訊號匹配, 衰減, 頻率響應等各式高頻參數特性的設計。 3. 串接相關單位完成產線自製測試設備 PCB 設計及驗證。 4. 配合客戶進行高速高頻配件產品與線纜產品設計, 實現對應 PCBA電路設計並完成產品測試/驗證。

1. 硬體電路設計與開發 • 根據專案需求進行系統架構規劃與電路設計（數位、類比、高速訊號） • 繪製原理圖（Schematic）與零件選型 • 與 PCB Layout 工程師合作進行電路板設計與佈線優化 • 評估並引入新技術與元件（CPU、GPU、DDR、Type-C、PD 等） 2. 功能實現與原型驗證 • 製作與驗證原型機（Prototype / EVT） • 分析與解決電路功能異常、訊號完整性（SI）及電源完整性（PI）問題 • 測試高速介面（USB, PCIe, HDMI, DP, Thunderbolt）與相容性驗證 • 優化功耗與散熱設計 3. 測試與驗證 • 制定並執行硬體測試計畫（功能測試、效能測試、穩定性測試） • 協助進行安規（EMI/EMC）、安規認證（UL、CE、FCC 等） • 進行系統相容性測試（各型周邊裝置、作業系統） • 與測試團隊合作分析並修正問題 4. 跨部門專案協作 • 與機構工程師（ME）協調 PCB 尺寸、元件擺放與散熱方案 • 與軟體工程師（SW）共同除錯（Debug）與韌體開發支援 • 與專案經理（PM）對齊時程與需求 • 與供應商（ODM/OEM/零件廠）討論設計、良率與成本 5. 量產支援與問題解決 • 支援試產（PVT）與量產（MP）階段的硬體異常分析 • 協助改善製造良率與穩定性 • 處理現場生產問題（SMT、組裝、測試工站） 6. 文件與版本管理 • 編寫與維護設計文件（原理圖、BOM、設計規範） • 設計變更（ECO/ECN）與版本控制 • 測試報告與問題追蹤（Issue Tracking）

如果你很懂： 1. Signal Integrity (信號完整性)分析/設計/測試，高頻測試版/測試系統設計與分析 2. CST 相關高頻模擬軟體 3. 高頻cable或零組件之訊號/雜訊設計/測試與debug 4. 會IEEE 802.3 系列或PCI-e規格 期待你可以： 1.跨部門溝通確認機構/客戶需求與高頻特性 2.針對連接器/線材高頻特性提出設計改善方向與模擬結果 3.協助分析PCB高頻特性與提出設計改善方案 4.能進行高頻分析,並建立模型讓模擬與實品盡可能趨近

嗨，我們正在尋找參與電控系統開發的新夥伴，期待您是一位能快速評估可行性，並且可以獨立開發、擅長解決問題的研發型人才。若您對醫療設備開發有熱忱，且樂於創新、挑戰，您就是我們在尋找的夥伴。 【主要工作內容】 1. 負責並參與電控系統專案開發工作 2. 依據產品需求進行電子電路工程設計 3. 完成並維護產品開發階段相關所需各項文件 4. 熟悉電子電路設計開發工具，進行相關技術產出測試與試製 5. 其他主管交辦事項 ※工作待遇將視你的工作資歷及相關能力核定。 如果你願意接受這樣的工作挑戰、並且保有一份持續學習成長的心，誠摯歡迎你的加入！

We are seeking a highly experienced and detail-oriented Senior Hardware Board Development Engineer with 10–15 years of hands-on experience in hardware system design. This role focuses on the development of evaluation boards (EVBs) and customer reference boards (CRB) for advanced SoC/ASIC platforms, including board-level architecture, high-speed signal design, and system bring-up. You will work closely with SoC/ASIC design teams, firmware engineers, and validation teams to deliver robust reference platforms for internal and customer use. The ideal candidate has deep expertise in DDR4/DDR5, PCIe Gen4/5/6, high-speed SerDes, and power delivery networks, along with strong debugging and lab skills. Responsibilities * Lead the design and development of SoC/ASIC evaluation boards, including schematic capture, PCB layout review, and component selection. * Perform board bring-up, signal integrity validation, and system-level debugging. * Collaborate with cross-functional teams to support SoC/ASIC validation and customer reference designs. * Conduct SI/PI simulations and optimize high-speed interfaces (DDR, PCIe, Ethernet). * Generate technical documentation including schematics, BOMs, test procedures, and design guides. * Interface with vendors and manufacturing teams for prototype builds and production support.

1. 車用產品電子電路系統架構規劃設計、車用零件選用、PCB SI/PI佈局 2. BOM、生產相關文件輸出 3. 產品驗證、Debug，符合客戶要求車用EMC法規測試，確保產品穩定可靠性 4. 協助業務評估RFQ、報價及協助NPI導入 5. 需跨部門溝通協調工作事宜 6. 相關文件撰寫及協助，ISO9001、IATF16949、ISO21434、ISO26262等車用法規需求文件