「軟韌體工程師 (智慧家庭 Matter/Thread 中樞產品)」的相似工作

This vacancy is open for talent pool collection. We will contact you if we have proper vacancies that fit with your profile. Job Mission Represent manufacturing and act as gatekeeper from manufacturing to D&E function Add value in overall manufacturing processes such as forming, machining, joining, and assembling Job Description Contribute to the solution of faults and takes the necessary initiatives and practical decisions to ensure zero repeat Identify gaps and drive assigned process improvement projects and successful delivery Initiate and drive new procedure changes and projects Develop and maintain networks across several functional stakeholders Prioritize works and projects based on business situation Transfer knowledge and train colleagues on existing and newly introduced products Education Master degree in technical domain (e.g. electrical engineering, mechanical engineering, mechatronics) Experience 3-5 years working experience in design engineering Personal skills Show responsibility for the result of work Show proactive attitude and willing to take initiative Drive for continuous improvement Able to think outside of standard processes Able to work independently Able to co-work with different functional stakeholders Able to demonstrate leadership skills Able to work in a multi-disciplinary team within a high tech(proto) environment Able to think and act within general policies across department levels Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

1.設備韌體開發及測試。 2.數位電路設計。 3.熟悉電路圖軟體 : ALTIUM、OrCAD。 4.熟悉數位電路 & ARM MCU系列。 5.熟悉C、C++、Python程式語言。 6.需有獨立作業能力。 ##熟悉 Camera 相關經驗更佳

We are looking for an experienced engineer with a strong background in embedded systems and Linux software development to join our R&D team. The role involves participating in the design, development, and system integration of new products. Responsibilities ◆Develop and maintain firmware and Linux daemons ◆Participate in the system integration process of new products, including design discussions, implementation, testing, and delivery ◆Design and implement network-related features, including video streaming, OAuth2.0, HTTP/HTTPS ◆Utilize Git and other source control tools to ensure code quality and efficient team collaboration ◆Communicate with international colleagues in English, including participation in video conferences for design and requirement discussions Requirements ◆Proficiency in C programming and Linux OS environments ◆Hands-on experience in embedded system development ◆Solid understanding of network protocols, such as TCP/IP, HTTP/HTTPS ◆English proficiency (listening, speaking, reading, and writing) to collaborate effectively with overseas colleagues ◆Awareness of information security practices; ability to leverage tools like GPT or DeepSeek while ensuring the confidentiality of company data

應屆畢業生可 1.無人機自駕系統開發工程參與。 2.熟悉Linux 及電腦視覺相關應用及開發流程。 3.具備Deep Learning / Edge Computing相關開發經驗。 4.具備電控或航太領域背景尤佳。 5.能貫徹執行上級交辦事項。 6.無經驗可，提供相關培訓。

1. 獨立進行ARM架構單晶片設計。 2. 數位電源電路及功能設計及驗證。 3. 程式模組化設計能力。 4. 依規劃設計(程式流程圖)需求產出程式原始碼及相應燒錄檔或執行檔。 5. 軟體原始碼及版本管理服務程序建制、使用及維護。

1.新案估價,MCU規劃.開發SCDL.費用評估 2.電子產品之軟韌體系統規劃與軟韌體開發之專案管理 3.撰寫產品軟韌體規格書,產品電氣.軟韌體功能可靠性驗證 4.與硬體工程師.營業.方案商溝通合作,完成新產開發專案 5.完成上級交辦任務

【職責說明】 主要負責強固平板產品硬體平台MCU軟體開發及維護，並有機會主導韌體專案從0-1的開發過程，親手打造差異化的IPC產品。 【工作內容】 1. 負責MCU的韌體設計與除錯，確保MCU於產品上正常且穩定運作。 2. 負責設計產品的圖形使用者界面（HMI），創造良好使用者體驗，提升客戶黏著度。 3.依照產品規格分析、討論、歸納、撰寫韌體規格 4.整合上下游，確保開發進度遵循既定計畫。 【須具備以下條件者】 1. 具5年經驗(含)以上韌體工作經驗 2. 擅長VScode, Git 3. 熟悉STMicron 開發流程 4. 熟悉Microchip開發流程 5. 熟悉C/C++語言 6. 熟悉I2C/UART/SPI protocol 7. 熟悉FreeRTOS 8. 熟悉TouchGFX (圖形使用者界面) 9. 熟悉電子電路 10. 會使用Scope 【具以下條件者尤佳】 1. 熟悉USB protocol 2. 熟悉 CAN / LIN protocolv 3. 熟悉 TCP/IP stack (LWIP)

職務描述: 保全系統開發與創新，如保全主機(Home Gateway)、各類感測器(磁簧、紅外線、偵煙...)、各類控制器(讀卡機、出力裝置、鐵捲門)之應用設計與整合。 我們提供SDK給第三供應商，快速整合公司系統與保障資訊安全，需要具有對通訊協議制訂與Home Gateway整合之熱忱的您加入! 工作內容: 1.開發/維護IoT（Smart Home）相關系統軟韌體 2.開發/維護Smart Home Gateway Middleware 3.整合IoT（Smart Home）相關設備 4.制定/實作IoT設備訊息交換協定 5.制定/實作終端設備管理機制

熟悉 Qualcomm Audio DSP 架構 (如 Hexagon DSP, ADSP/MDSP/SDSP) 及相關開發流程 責任音訊子系統模塊設計、音訊路徑配置、演算法整合並據需據擴展設計/開發文件 進行音訊處理流程的問題分析與效能優化 (如 功耗、延遲、同步) 熟悉 Audio HAL / ALSA / AFE / Audio DSP firmware 開發與調校流程 熟悉 Android 音訊架構 (如 AudioFlinger, AudioPolicyManager) 與 AOSP Audio build system 熟悉 Qualcomm 音訊平台軟體堆疊如: AudioReach / QACT / Audio Calibration Tool / Tuning Tool 等優先 與產品經理討論需求，規劃音訊系統架構與功能路線 協助整合第三方音訊演算法 (如 ANC, VAD, Beamforming) 至 DSP platform 據需擴展 Android framework 模組或更改音訊會訊路徑配置功能 據需編寫單元測試、整合測試設計，確保軟體系統穩定性與品質 【加分條件】 (Preferred Qualifications): 具備 SmartPA 調校、語音觸發 (Voice Activation)、Voice UI 開發經驗 熟悉 Qualcomm SA8155P / SA8295P / Snapdragon Ride 系列平台開發經驗

1 AC充電機韌體開發 2 DC充電機韌體開發　 3 嵌入式通訊板之OCPP通訊協定開發 ISO15118通訊協定研究開發 充電漫遊（eRoaming）協議 & OCPI通訊協定研究開發 4 技術資料蒐集與彙總 5 研發相關之內外部會議參與 6 其他主管交辦工作事項執行及回報

1.馬達驅動控制器開發及韌體撰寫 2.程式撰寫及驗證 3.系統測試驗證 4.韌體維護 5.執行相關研究(驅動控制/驅動器) 6.產品規格分析 產品應用： 跑步機產品(變頻器)

負責公司產品之嵌入式系統開發 : 1. 規劃及執行感測器驅動和MCU控制設計, 並維護量產產品。 2. 周邊晶片驅動 3. 執行產品韌體測試 4. 與 AI 團隊合作, 導入邊緣運算 5. 控制韌體開發進度、品質與成本。 6. 文件規格撰寫 必備條件: 1. 具獨立解決問題能力 2. 具良好表達能力 3. 熟悉 C programming 4. 熟悉 I2C, SPI, UART, GPIO 7. 熟悉git 做軟體控管

韌體團隊開發範疇： 1. 研究電池特性(例如：鋰電池)，開發新的電池電瓶分析演算法。 2. 完成電池測試儀器、電池充電器功能開發。 專案執行過程的常態性工作： 1. 使用MCU開發工具及程式語言，主要是C語言。 2. 進行單元功能程式整合。 3. 單元功能程式撰寫及驗證。 4. 撰寫工程規格 / 技術文件 (包含測試計畫)。 5. 韌體版本管控 (Git)。 Our FW team is responsible for: 1. Developing the functionalities of battery diagnosis/charging products. 2. Investigating new diagnosis algorithm for batteries is part of our job. Regular duties in project execution: 1. Use MCU development tools and programming languages, primarily C language. 2. Perform unit function program integration. 3. Write and verify unit function programs. 4. Write engineering specifications / technical documentation (including test plans). 5. Firmware version control (Git).

1. 主動式電子掃描陣列 (相控陣列) 雷達系統之韌體設計。 2. 熟悉嵌入式RTOS開發技術。 3. 熟悉數位通訊協定, 如: I2C, eSPI, SMBus, UART, JTAG, USB等。

1、軟體需求分析，評估選擇技術方案，編寫整體系統設計文檔與軟體流程圖 。 2、負責軟體模組的設計和編碼實現 。 3、軟體功能測試，協助電子工程師做系統集成測試 。 4、專案過程中軟體版本升級與導入、軟體文檔維護與生產指導和支持 。 5、協助產品治具的軟體發展與設計 。 6、參與專案調研、方案論證、設計，產品樣機製作、試驗 。 7、客戶現場調試與技術支援 。 8、其他主管交辦事項。

《About this Role》 We're looking for a full-stack IoT firmware engineer who takes ownership of the complete development lifecycle - from MCU integration to cloud connectivity, and from code implementation to automated testing. You'll be responsible for building IoT wireless modules that bridge device hardware with cloud services, ensuring end-to-end functionality and quality. 我們正在尋找一位全端 IoT 韌體工程師，能夠負責完整的開發生命週期 - 從 MCU 整合到雲端連接，從代碼實作到自動化測試。您將負責構建連接設備硬體與雲端服務的 IoT 無線模組，確保端到端的功能性和品質。 《What We're Looking For》 "You build it, you own it, you test it" - We believe in empowering engineers to take full ownership of their work. With modern AI tools and testing frameworks, we expect our firmware engineers to deliver production-ready, thoroughly tested solutions. 「你開發，你擁有，你測試」 - 我們相信賦權工程師完全擁有自己的工作。透過現代 AI 工具和測試框架，我們期望韌體工程師交付可投產的、經過完整測試的解決方案。 《Your Key Responsibilities》 ● End-to-End Development | 端到端開發 ○ Wireless Module Development: Build application layers for IoT wireless modules (Wi-Fi, BLE, Thread, etc.) that interface with existing MCU systems. ○ Protocol Integration: Implement communication protocols to bridge MCU data with cloud platforms efficiently. ○ Cloud Connectivity: Design and develop reliable data transmission pathways from device MCU to cloud services. ● Full Testing Ownership | 完整測試責任 ○ Automated Testing: Design and implement automated test suites for your firmware using modern testing frameworks. ○ Manual Validation: Perform thorough manual testing for edge cases and integration scenarios. ○ Performance Testing: Ensure optimal memory usage, power consumption, and network performance. ○ AI-Assisted Testing: Leverage AI tools to generate test cases, identify potential issues, and optimize testing strategies. ● Quality Assurance | 品質保證 ○ Code Quality: Write clean, maintainable, and well-documented code that passes all quality gates. ○ Debugging & Troubleshooting: Independently identify, analyze, and resolve firmware issues across the entire stack. ○ Performance Optimization: Continuously improve firmware efficiency and reliability based on testing feedback. ● DevOps & Automation | 開發維運與自動化 ○ CI/CD Integration: Set up and maintain automated build, test, and deployment pipelines for your firmware. ○ Documentation: Create comprehensive technical documentation for APIs, protocols, and testing procedures. ○ Monitoring: Implement logging and monitoring solutions to track firmware performance in production.

1. embedded C / C++ 應用程式開發 2. Open-source library porting 實務經驗 3. Socket Programming開發經驗及相關網路知識 4. 良好除錯技能

[關於團隊]  我們是IEI 醫療事業中心，專注醫療產品、器材研發設計。其研發團隊具備研發熱誠，也具備豐富的開發經驗。歡迎樂於團隊合作，並能接受國內外醫療客戶挑戰與密切合作的您，加入~ [職務需求] 1. MCU程式撰寫，以及開發技術文件撰寫。 2. 獨立作業、團隊合作、不排斥學習。 [要求條件]  1. 熟悉 C/C++程式語言。 2. 熟悉 8051/ARM MCU。 3. 看得懂硬體線路圖，會使用示波器、三用電表等量測硬體設備。   [有了更加分項]  1. 熟悉 醫療軟體文件撰寫者佳。 2. 熟悉 RTOS 程式開發。 

我們專注於Edge AI技術開發，採用ARM Based的CPU，這份工作需要從事Nature Language Processing(NLP)、Image、Camera、相關的韌體開發，依客戶需求進行產品的修改與設計。 ◎ 工作內容： 1. Edge AI產品上的ARM ASIC功能開發 2. 系統設計並與 ASIC 晶片, 硬體, 軟體整合成產品. 3. 能夠操作設備測量基礎的硬體訊號和除錯 4. 細心、邏輯性思考、能獨立作業 ◎ Job Description: 1. Edge AI product development based on ARM ASIC. 2. System design concept to integrate ASIC/HW/SW as a product. 3. Able to use equipment to measure basic HW signal for code debugging. 4. Work Independently, debug logically, systematically and carefully.

1. 熟C語言，使用C語言進行程式開發及測試 2. 技術問題排除 3. IC 驗證、應用韌體、程式庫或應用平台開發 4. 熟悉基本電子電路設計 5.了解MCU微控制器功能/除錯工具/韌體開發經驗佳 6. 需會操作示波器、電源供應器及烙鐵 7. 可閱讀英文產品規範與產品規格書 【來點加分題】 1. 懂SPI、IIC、UART等通訊協定佳 2. 具良好的分析能力及問題解決能力佳 ※依學經歷、工作年資敘薪