「Senior Hardware Design Engineer (資深電子研發工程師)」的相似工作

職務職責： 1.負責參與研發大功率開關電源； 2.負責或參與專案進度規劃與安排、產品拓撲方案選擇、安規及 EMC 設計與評估、研發樣機製作和調試； 3.負責所設計產品的製程及可生產性評估、各類設計驗證測試； 4.負責新選用電子元器件的評估、測試、驗證等。 應聘要求： 1.電力電子、自動化相關專業大學本科或以上學歷； 2.具備紮實的模電、數電及電力電子專業知識，且有較強的動手能力，熟悉三相 VIENNA、LLC 等各類電源電路基本拓撲及關鍵元件； 3.具備良好的問題解決能力及硬體電路設計能力； 4.3 年以上相關工作經驗，擁有完整的專案開發管理經驗；具備大功率產品開發直流經驗，或有充電樁模組、通訊電源、電力電源、伺服器電源設計經驗者優先考量； 5.具備強烈的求知慾、責任心與敬業精神，擁有優秀的團隊精神及溝通協調能力。

We are seeking a highly experienced and detail-oriented Senior Hardware Board Development Engineer with 10–15 years of hands-on experience in hardware system design. This role focuses on the development of evaluation boards (EVBs) and customer reference boards (CRB) for advanced SoC/ASIC platforms, including board-level architecture, high-speed signal design, and system bring-up. You will work closely with SoC/ASIC design teams, firmware engineers, and validation teams to deliver robust reference platforms for internal and customer use. The ideal candidate has deep expertise in DDR4/DDR5, PCIe Gen4/5/6, high-speed SerDes, and power delivery networks, along with strong debugging and lab skills. Responsibilities * Lead the design and development of SoC/ASIC evaluation boards, including schematic capture, PCB layout review, and component selection. * Perform board bring-up, signal integrity validation, and system-level debugging. * Collaborate with cross-functional teams to support SoC/ASIC validation and customer reference designs. * Conduct SI/PI simulations and optimize high-speed interfaces (DDR, PCIe, Ethernet). * Generate technical documentation including schematics, BOMs, test procedures, and design guides. * Interface with vendors and manufacturing teams for prototype builds and production support.

以X86為核心研發主機板在edge AI系統為架構的產品設計 1. 研究產業新技術規格，導入創新產品設計 2. 硬體線路設計，PCBA layout規劃 3. 試產階段，電子零件選用/驗證/測試/導入 4. 釐清硬體在主板端/周邊零組件/製程等相關問題，解決設計問題 5. 與研發團隊PM/SW/FW/ME/Layout/DQA/工廠端合作 6. 能自主掌握硬體設計品質與產品設計開發進度 7. 定期向主管進度報告

1. PCB 設計（含原理圖設計、佈局佈線、Gerber 輸出）。 2. 客戶服務(PCIe/USB3相關) - 協助客戶釐清技術問題並提供可行解決方案。 - 參與客戶專案評估與設計審查（Design Review，含原理圖與佈局）並提出建議。 - 協助客戶進行產品特性分析與測試驗證。 3. 具跨部門協作與專案支援能力。 作為硬體研發工程師，您將成為我們團隊中關鍵的成員之一。您的工作將有助於產品的開發和改善，確保我們的產品能夠達到高標準的品質和性能。此職位的發展前景良好，並提供豐富的學習和專業成長機會。 如果您符合我們的要求並對此職位感興趣，請盡快申請並表達您的興趣。我們期待能夠與您共事，一起實現更好的產品和更大的成功。

As the Electrical Engineering (EE) Ass. Manager/Supervisor, you will have the key responsibility for overseeing EE development from the initial concept incubation phase through to mass production (MP). Your role will involve close collaboration with a cross-functional team comprising members from Marketing, Firmware Engineering (FW), Project Management (PM), Mechanical Engineering (ME), and Quality Assurance (QA) to manage the complete design cycles for BMS-related products. Additionally, you will lead the development of new platforms and features to align with the long-term strategic business goals and enhance the competitiveness of the BMS product line.

1. 硬體設計開發產品及對應車廠需求 2. 進行實車安裝/測試、樣品製作、零件承認流程 3. 製作開發件之量產圖出圖和相關資料 4. 分析產件之不良點及提出改善對策 5. 展示車輛電子部品安裝及拆卸 6. 專案相關技術之支援 7 .主管交辦事項 必備專長: 1. 電子電路量測設備(三用電表、示波器)使用 2. 電路板焊接、零件更換能力

⚫ Design server system and relative boards and review high-speed PCB layout. ⚫ Work with function team like Power, SI, mechanical and thermal engineers to ensure optimize hardware solutions. ⚫ Come out test plans to ensure base function of hardware. ⚫ Work with suppliers and vendors to select components and solutions. ⚫ Support 2nd source solutions and validation. ⚫ Work closely with firmware teams to integrate and troubleshoot management topology. ⚫ Support manufacturing teams during the production phase.

Hardware Engineer will work with Product Owner, Software team, NPI team and Contract Manufacturer for being the focal point of delivering hardware solution and product design per request, both internal and external. Responsibilities • Design hardware solution (System of Systems) to fulfill company's goal • Owns EE design of the rugged products based on ARM or x86 - Create and maintain OrCAD schematic - Create layout guide and work with layout house - Guide rest of team through PCB fab's EQ process • Work with Mechanical Engineers and NPI Process Engineers for DFM • Create and maintain debugging procedures

##職務說明 - 相控陣列系統(通訊/雷達)射頻電路(PA/LNA/Mixer/Filter/PLL)架構規劃、模擬及電路設計。 - 根據系統規格進行電子元件評估與選用。 - 與Layout工程師、結構工程師溝通、協調並完成電路、佈局設計及確認 - 電路板及系統層級效能測試、驗證、除錯並將產品導入量產。 - 執行產品研發流程及技術文件產出 ##技能需求 - 具電路 RF / Analog / Digital 電路三年以上設計經驗 - 熟悉量測儀器使用 - 具備基礎焊接能力

1. X86 / ARM base 主板/周邊線路規劃、設計開發、測試驗證 2. Panel PC訊號量測、分析，方案評估與相關技術問題對策 3. OEM/ODM 專案評估與整合 4. 工廠生產異常問題分析與解決

✅About the job This role seeks a highly driven individual to collaborate with Skymizer's clients in effectively integrating and utilizing Skymizer LPU IP within their ASIC SoCs/systems for cutting-edge products. This position presents exciting opportunities to engage with cutting-edge Skymizer IP and the latest industry standards alongside industry-leading clients. ✅Key Responsibilities Key responsibilities include providing technical guidance to clients throughout their SoC development process to overcome integration challenges, conducting integration reviews, and offering support during silicon/system bring-up and troubleshooting phases. • Resolving complex technical challenges related to homogeneous and heterogeneous multi-core processors. • Providing technical support to customers utilizing Skymizer LPU IP and SoC platforms. • Guiding customers in transitioning to the latest generation of processors and optimizing their usage. • Creating and publishing technical articles, application notes, and white papers. • Conducting hardware benchmarks on Skymizer LPU and SoC platforms. The candidate who is familiar with software benchmarking is a plus. • Communicating customer feedback on emerging IP requirements to Skymizer's Research & Development and product teams. ✅Qualifications Working experience in any of the following areas: • ASIC/SoC design flow and FPGA prototyping • Large Language Model frameworks • Familiarity with industry-standard IP and protocols (NoC, CMN, DDR/HBM, PCIe/CXL, UCIe) • CISC/RISC/SIMD/VLIW/CGRA/GPU processor architectures is a plus • Audio/VIdeo/Speech DSP IP is a plus • Programming for SoC systems • Hardware digital design using Verilog or SystemVerilog • Familiar with EDA tool including Verdi, VCS, nWave, PTPX, DC ✅Nice to have • Hands on RTL / FPGA design and debugging. • Exceptional debugging and troubleshooting abilities, with proven experience in identifying and resolving customer issues across both hardware and software domains (e.g., system integration, performance optimization, compatibility, and usability). • A creative and results-driven approach with the ability to effectively manage multiple projects simultaneously. • Excellent verbal and written communication skills in English, enabling seamless interaction with global customers. • High levels of self-motivation and a strong sense of personal responsibility.

Immersive Optics System Engineer / AR VR Engineer ⭐有機會達到百萬年薪!歡迎對外商感興趣的你，保障年薪13.5個月⭐ Responsibilities: Provides expert knowledge regarding the selection, evaluation, qualification and procurement of visual system in different varieties of display size applications. Collaborates and communicates with internal and outsourced development partners about design requirements, regulatory requirements, and user needs. Participates as a member of project team of other engineers, Program Managers, and internal and outsourced development partners to develop reliable, cost effective and high-quality solutions for the immersive visual system products. Experience on NPI and manufacture process. Familiar with display industry production. EE experience to bring up the display system (including MIPI / Vx1 / eDP etc…). To review the EE design with supplier and system designer. Knowledge of HDMI and DP. Education and Experience Required: MS in Display Engineering, Materials Science, Optical Engineering, Physics or related field and/or equivalent experience. Typically 5+ years experience, with 3+ years at related field. Knowledge and Skills: Solid knowledge in different form factor product. Such as VR/AR, Monitor, TV, AIO etc. Display design (Array / FEOL / BEOL) and quality control Display system hardware design. Basic knowledge of Geometrical optics and Optical imagery. Camera ALS / Proximity Sensor Depth sensing (Structure light/TOF) Good communication skills in English and Mandarin with ability to work under pressure. Proven track of record on development and implementation of innovative LCD, AMOLED, or other display solutions for consumer electronics. Experience with at least one of the focus areas of visual system technology below: -VR display system (Panel + Lens) -Video passthrough system (Dual camera + ISP) -AIO touch monitor system -IWB system -SLAM system (camera + sensor fusion)

1. 主動式電子掃描陣列 (相控陣列) 雷達系統之硬體電路設計。 2. 熟悉RF PCB Layout Guideline與PCBA廠商管理。 3. 理解SI/PI的觀念。

• Design high speed PCBs for Ethernet applications including performing pre and post layout signal and power integrity simulations. • Perform PCB layout and signal/power integrity design reviews. • Effectively plan and organize board build process, component procurement, board bring-up, debug, and testing to ensure technical objectives and schedules are met. • Interact with cross-functional teams like design, marketing, software and validation on their board requirements and update status on the board builds.

*本職缺為派遣職，無法接受者請勿投遞! 工作內容: -SoC晶片感應功能測試及問題回報 -C語言編碼(RISC-V, CPU) -功能性代碼測試 資格條件: -大學以上學歷 -電子工程或資訊相關科系 -3-5年相關工作經驗 -C語言及編碼能力佳 -英語溝通無礙(主管是外國人!) 工作地點: 汐科辦公室(新北市汐止區新台五路一段95號) 工作時間: 週一至五9:00-18:00(含一小時午休) 薪資待遇: 月薪NTD$90,000-100,000(依個人學經歷敘薪) 完成專案後可領取一個月期滿獎金

職務概要： 本職位負責領導硬體設計團隊，主導醫療產品（如醫療電腦、影像系統、診斷設備等）之硬體開發與設計管理。需具備深厚的硬體架構與電路設計背景，並能整合跨部門資源，確保產品符合醫療法規、品質與可靠性要求，同時達成專案時程與成本目標。 主要工作內容： 【專案開發管理】 1. 負責醫療產品硬體開發專案之整體規劃、執行與追蹤（從概念設計至量產）。 2. 制定專案時程、預算與資源配置，確保開發進度及品質目標達成。 3. 與機構、韌體、軟體、品質與法規團隊協同合作，推動跨部門整合。 【硬體設計與技術指導】 1. 主導系統架構設計、電路設計審查、Layout Review 及整機驗證。 2. 提升團隊在 EMC/ESD、Signal Integrity、Power Management、Thermal Simulation 等核心設計能力。 3. 審查設計文件（Schematic、BOM、DFM/DFT、FMEA、Verification Plan）並確保文件完整性。 【醫療法規與產品可靠性】 1. 確保產品符合醫療相關標準（IEC 60601、ISO 13485、EMC/ESD 要求）。 2. 參與並監督 DVT/PVT 等設計驗證流程，確保設計品質與法規一致性。 【團隊領導與人才發展】 1. 帶領並培育硬體設計工程師團隊，建立標準化的設計流程與文件管理制度。 2. 推動技術交流與內部培訓，持續提升團隊技術競爭力。 【外部合作與供應鏈管理】 1. 管理 ODM/OEM 合作夥伴與關鍵零件供應商，確保設計、成本與品質一致性。 必要條件： 1. 電子工程、電機工程、通訊工程或相關科系學士以上(碩士尤佳)。 2. 15 年以上硬體設計與開發經驗，其中 5 年以上管理或專案領導經驗。 3. 具醫療設備、工業電腦或高可靠度產品開發背景者尤佳。 專業技能： 1. 精通高速介面設計（PCIe、DDR、USB、Ethernet 等）。 2. 熟悉 EMC/ESD 設計、電源管理與熱設計分析。 3. 熟悉醫療安規（IEC 60601 系列）與設計流程（ISO 13485）。 4. 熟悉 PLM 系統、Cadence Allegro、OrCAD CIS 等設計與管理工具。 軟性條件： 1. 具跨部門溝通與問題解決能力。 2. 能以結果導向推動專案並領導團隊。 3. 英文讀寫流暢，能與國際客戶及供應商溝通。 加分條件： 1. 具 FPGA、RISC、AI 加速器模組或影像處理硬體開發經驗。 2. 曾參與醫療產品安規認證（如 CE、FDA、UL）流程。 3. 具設計驗證與量產導入（NPI）管理經驗。

1. DC/DC電源線路設計 2. PCB layout 3. 波形量測、撰寫報告、電路驗證 4. 解決產品問題、電路板維修 5. 系統整合 6. 協助機種量產及發行 7. 量產後客戶端技術支援

1. HW system block diagram and board schematic design. 2. Define and check Layout placement and rule. 3. HW platform debugging, investigations, maintenance, alternative components survey and failure analysis. 4. Support documentation for projects.

Responsibilities include: 1. Act the staff/sr. role to develop shelf controller module inside OCP ORV3 21 " or 19" rack to monitor and control Power and BBU shelf for data center. 2. Familiar with ARM Cortex A7 BMC AST2600/2620 chip or Intel x86 CPU design. 3. Experiences for Linux embedded board bring up and debugging. 4. Good knowledge of protocol for IPMI, I2C, UART, SPI RS485, Redfish. 5. Lead for schematic circuit design and PCB layout review. 6. Familiar with, CanBus, Modbus communication, ethernet, PoE, eMMC, security feature 7. Familiar with DC/DC converter circuit design, buck-bust converter and flyback . 8. Signal integrity and power integrity measurement and verification. 9. Support RFI and RFQ activities and provide technical proposal. 10. Good communication in English, both oral and written. Capable to talk and discuss technical topic in front of customer. Requirements: • BS in Electrical Engineering or related field. Prefer MS degree or above • 8+ years of related experience in consumer PC/Industrial PC, laptop, RISC and networking related products; for Team Lead prefer least 3 years for people manager role. • Demonstrated strong leadership for product design in multiple-disciplinary environment. • Competence in customer focus innovation and able to drive technology growth • Good communication skills, people management, self-motivation and the ability to successfully deal with ambiguity are a must. • Cadence Orcad capture or Mentor PADS capture. The information we collect: We may collect personal information that you choose to submit to us through the Website or otherwise provide to us. This may include your contact details; information provided in online questionnaires, feedback forms, or applications for employment; and information you provide such as CV/Resume. We will use your information for legitimate business purposes such as responding to comments or queries or answering questions; progressing applications for employment; allowing you to choose to share web content with others or; where you represent one of our customers or suppliers, administering the business relationship with that customer or supplier.

We are looking for analog and mixed-signal design engineers to contribute to the development video related ICs. The candidate must have a proven record of designing complex ICs in state-of-the-art CMOS process technologies and has successfully placed products into volume production, preferably multiple times. Experience •Minimum: Masters’ degree in Electrical Engineering with 8+ years’ experience. •High-speed and analog circuit design experience including three or more of the following: ADCs, DACs, Filters, PLLs, DLLs, High-speed customized IPs and I/Os, SerDes, Clock and Data Recovery, line drivers, and equalizers •A track record of developing high volume commercial products Skills •Strong fundamentals in circuit theory, design, and layout •Working knowledge of industry best practices •Creative design ability to solve problems demanding the highest levels of speed and power performance •Experienced in Cadence design flow •Strong communication and presentation skills •Ability to work independently as well as in teams •Ability to work across functions and levels •Analog Devices, c2b knowledge Note: Authorized to work in the US will be plus