Company Overview
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.
Our breadth of offerings across the entire semiconductor value chain help our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.
Role and Responsibilities:
Provides highly visible customers support through the performance of on-site installation as well as overseeing any necessary diagnoses, troubleshooting, service, and repair of complex equipment and systems. Serves as company liaison with customers and technical matters for assigned projects for the Hsinchu site.
• Works on problems of moderate scope where analysis of situations or data requires a review of a variety of factors
• Exercises judgment within defined procedures and practices to determine appropriate action
• Performs installation, repair, retrofits, upgrades and preventive maintenance on equipment installed at customer sites
• Maintains and manages an assigned installation equipment base. This includes providing primary support, forecasting, conducting customer support meetings, and ensuring regular communication with the customer
• Has internal and some external contacts
• Performs other duties as assigned
Required Experience and Education:
• Requires a minimum of 5 years of related experience
• Bachelor's degree
如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/
1) In charge of NPI release with well document, process and recipe control
2) Direct interface Between customer and engineering to align the technical and quality requirement
3) Lead and organize internal parties to drive the excellent outcome to fulfill customer requirement
4) NPI BOM generation and release control
5) Engineering lot handling
6) Supervisor of product yield improvement
7) Map creation and control
8) Packing fitting analysis and review
• Demonstrate system solution, and cross-department leadership to approach for continuous system improvement.
• Work with IT and vendor to source new technology and solution for factory automation.
• Developing software solutions for process automation, real-time monitoring, and data analysis.- Integrating software platforms and applications to enable smooth data exchange between various factory systems and devices.
• Collaborating with other teams to ensure seamless integration between hardware and software components.
• In charge for the Amkor World Wide system fane-in-out requirement, and smoothly implement WW system solution into Amkor Taiwan.
• Process re-engineering and system architecture design.
• new technology & software application solution study, development, and implement (Spotfire, Jedox OLAP, RPA-UiPath, APS, AMA, RTD, CIM, and so on).
• Process automation: work with it to develop necessary EAP for target tools in full automation, such as CP tools for AMR/mini-OHT project.
• AS/RS, Mini-OHT, Auto GI/GR, Auto-packing: work with IT on data transaction/integration with SAP/MES/WMS etc.
• Other commercial s/w deployment: project management from requirement collection, vendor evaluation to implementation.
如欲投遞履歷,請上Amkor官網 https://careers.amkor.com.tw/
1. NPI related
2.Technique support to customer
3.Process development with customer
4.Customer quality issue handling
5.Customer Audit handling
【工作內容】
一、輪班人員:
.產品電性測試結果分析與改善
.客戶工程支援
.產品維護及管理
.DN發送與Release
※ 無經驗可,提供完整在職訓練
二、常日班人員(RF/Logic IC):
.新客戶工程品(新)導入量產之專案執行
.NPI各階段試產支援(HVM/LVM from EVT to PVT)
.MES, ERP,等相關製造系統操作與維護
.電性分析、RF S參數分析等相關良率改善活動與Probe card驗證
.測試程式、與其附屬之OI、UI介面驗證與優化
.量產品、工程品之日常貨批處置執行與管理
.問題分析與解決、改善之相關活動
.定期(週/月/季)客戶會議driving及客戶工程需求評估暨溝通協調與資訊反饋
.Launching New Customers and Products into Mass Production
.NPI high/low volume manufacturing support
.MES, ERP, each kind of engineering system software operating
.Electronic & s-parameter analyze, yield improvement, probe card verification
.Conducting validate test program, software, OI and UI systems
.Managing hold-lot and disposition
.Performing Problem-solving activities
.Holding regular meetings and providing reports to customers
【工作班制】
一、輪班制
.班別:作三休三 OR 作四休二
.時間:日班07:20-19:20/夜班19:20-07:20(實際工時10小時,休息2小時)
.輪調:每3個月日夜輪調一次
二、常日班
.班別:週一至週五,週休二日
.時間:08:30-17:30
【工作地區】
湖口光復廠:新竹縣湖口鄉光復路12號
【薪資說明】
.依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。
.輪班人員之輪班津貼&班制津貼另計
The Advanced Product Development Team at Amkor has an opening for Package mechanical simulation engineer. This team is responsible for package architecting, mechanical & stress simulation, failure analysis, and manufacturing process development.
This position involves working with Amkor's Worldwide R&D, manufacturing, quality, design and characterization teams in providing mechanical & stress simulation support, failure analysis, and manufacturing process development for wafer level and laminate based packaging technologies. This requires development of simulation methodology for stress analysis, test methods to validate the simulation, model construction for failure prediction. The candidate must be capable of using advanced Finite Element Analysis (FEA) techniques (such as sub-modeling and non-linear analysis), and test equipment for material characterization testing. They should also understand the concepts of chip, package, and board level interconnect technologies. The candidate is expected to have strong communications and project definition and execution skills.