「SI/PI 工程師」的相似工作

工作需求 (Job Requirements) 1.電子相關科系大學或碩士以上 2.2-5年的SI(訊號完整性)設計相關工作經驗 3.熟悉相關SI模擬軟體工具相關經驗 4.需與亞洲不同地區的辦公室協助合作 5.能獨立完成公司交辦的工作 工作職責 (Job Responsibilities) 1.負責3D高頻模擬軟體之售前拜訪、技術支持、產品培訓及專業規劃與執行。 2.熟悉PCB、SI信號完整性等相關模擬經驗 3.負責3D軟體的應用及技術支持給現有與新的潛力客戶 4.負責準時完成主管分配的工作

1.高速訊號應用趨勢研究 2.新材料驗證與測試 3.電性design rule建立 4.Technology roadmap建立 5.高速訊號設計專利資料收集&研究 6.客戶高速訊號應用對應與回饋

1. 訊號完整性模擬(PreSim and PostSim) 2. 電源完整性模擬(DC Drop/AC impedance/DeCap Optimization) 3. 針對PCB Layout提出建議。 4. 模擬與量測結果分析驗證。

如果你很懂： 1. Signal Integrity (信號完整性)分析/設計/測試，高頻測試版/測試系統設計與分析 2. CST 相關高頻模擬軟體 3. 高頻cable或零組件之訊號/雜訊設計/測試與debug 4. 會IEEE 802.3 系列或PCI-e規格 期待你可以： 1.跨部門溝通確認機構/客戶需求與高頻特性 2.針對連接器/線材高頻特性提出設計改善方向與模擬結果 3.協助分析PCB高頻特性與提出設計改善方案 4.能進行高頻分析,並建立模型讓模擬與實品盡可能趨近

1、 負責Ansys高頻電磁場模擬分析軟體之售前拜訪、資料蒐集 2、 技術支援以及技術文件製作;訓練教材製作以及教育訓練。 3、 軟體安裝、簡報製作 4、 Ansys高頻電磁場(SI/PI)模擬分析軟體產品功能研究 5、 高頻相關工程顧問服務專案執行與規劃 6、 高頻相關產業趨勢研究。

1. Performing DC IR drop and AC impedance simulation. 2. Improve simulation/validation efficiency and performance by automation. 3. Execute SI/PI/RF/EMI verification for the system requirements. 4. Build up SI/PI simulation and measurement correlation database. 5. Build up design and test capability including design guidance and lab setup. 6. Working with HW teams to optimize high-speed signal.

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to the next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons, all while shaping the future of connectivity. Responsibilities - Perform electrical validation of high-speed interfaces such as PCIe Gen3~Gen5, Ethernet (802.3 10G/25G/100G/400G), DDR4/5, SATA, and USB3 - Perform electrical validation of low-speed interface, including I2C, SPI, MDIO, eMMC, and RGMII. - Perform chip-to-chip SerDes signal validation, including SGMII+, UXSGMII interfaces. - Plan and execute power testing strategies for multiphase power stages and DC buck converters. - Perform power integrity validations, including ripple noise analysis, power sequencing verification, electronic load (E-load) operation, and power supply unit (PSU) evaluation. - Develop and execute test scripts under Linux environments, familiar with shell commands and automation scripting. - Collaborate with the HW team and chip vendor to define and document SI/PI validation plans and requirements. - Analyze and identify SI/PI issues, and work closely with HW, FW, layout teams, and chip vendors to develop improvement solutions that enhance electrical performance and signal integrity quality. Requirement - Solid experience with SI test equipment (oscilloscope, BERT, VNA, TDR). - 3+ years of hands-on experience in Signal Integrity, and SerDes/PCIe/USB/DDR validation. - Solid understanding of compliance testing methodologies, eye diagram, and litter analysis. - Strong understanding of low-speed interface protocols and comprehensive experience in AC/DC characteristic validation. - Bachelor’s/Master’s degree in Electrical Engineering, Electronics, or related fields. - Excellent problem-solving skills, ability to debug SI/PI issues, and strong cross-functional communication with HW design and layout teams. Preferred Qualifications - Experience working on system-level signal validation in server, networking, or storage platforms with high-speed interfaces. - Familiarity with Power Integrity validation, including power sequence, ripple noise, OCP, and SCP testing. Benefits - International work environment and collaboration with global development teams - Excellent work conditions - Competitive package: great pay, perks, and benefits - Group insurance and health coverage - Flexible working hours and patterns - Complimentary drinks and snacks at the office

※ 目前初試皆採Teams線上面談 ※ 具相關工作經驗者依學經歷專業核薪，待遇面議 ※ 本職缺工作待遇為相關系所應屆碩士畢業者，歡迎應屆畢業生投遞 1. HFSS模擬 (PCB板材選料對應RF Trace width & PCB stack) 2. 負責RF Ku/K/Ka band射頻電路選料與Tx/Rx Link budget計算 3. 搭配模擬結果指導layout工程師進行電路板佈局設計 4. 量測CW/OFDM在RF系統的Tx/Rx規格 並 進行debug 5. EMI & RF de-sense 處理

1. 針對高速介面進行信號完整性模擬。 SI simulation : TDR, S parameter,Eye diagram,Crosstalk.. 2. 電路板電源完整性模擬。 PI simulation : IR Drop , PDN.. 3. 對於佈局圖給予改良建議。 Polar應用及評估PCB & VNA材料選擇方式 4. 信號完整性異常除錯。

a. SI訊號/PI電源完整性模擬分析 (Pre-Layout & Post-Layout) b. PCB/Layout設計建議與Guideline制定 c. SI/PI/EMI新技術專研與導入

PRIMARY JOB DESCRIPTION: • Responsible for performing signal integrity and power integrity simulation analyzing DIMM products in different form factors. • Work with layout team and NPI team for achieving good board routing and releasing to production • Will interface with SMART global design teams PRINCIPAL DUTIES AND RESPONSIBILITIES: • Perform channel margin analysis to provide design tradeoffs among package, board, and connector on products starting from the technical specifications from different controller and NAND flash vendors in different form factors • Perform PCB timing analysis, work with layout designers and hardware engineers to implement all signal integrity rules • Perform PCB power margin analysis, work with layout designers and hardware engineers to implement all power integrity rules • Develop layout signal/power integrity rules guideline or document on new products starting from the technical specifications from different DRAM vendors in different form factors • Capability to execute trouble shooting and provide workable solution to SMART global R&D teams and customers • Communicate and work closely with global R&D teams to achieve targeted schedule for PCB board release • Write a Layout guidance document. Organize and research technical reports and share

1.Communicate with customer/partner and subcontractor to define the package design requirements, or specifications. 2.Propose the package size, structure according to requirements and specifications from customer. 3.Design the package and optimize to meet product specifications, coworking with related layout, electrical and thermal engineering teams. 4.Prototyping document preparation 5.Link with suppliers and follow up the development trend.

1. 進行訊號完整性與電源完整性(SI/PI) 模擬與優化分析 2. 執行SI實體卡測試量測與結果分析 3. 完成其他主管交辦事項

Enterprise Product Unit RF Engineer 1. RF development, design review and progress control of Netcom Product 2. Guide RF testing, verification and debugging 3. Discuss product RF specifications and development details with customers in English 4. Lead the R&D team members to jointly achieve the project objectives 5. Cross-departmental communication, coordination and cooperation

1.DevOps Infrastructure provision both for on-premises and cloud 2.Integrate testing into the CI/CD pipeline 3.Work closely with the SW team to define the automated testing components 4.Write, design, and execute automated tests on the Web app, Embedded System, Windows app

•Validate and test wireless software and drivers on PC platforms. •Execute automated test suites and develop new test content to improve test coverage and efficiency. •Participate in all phases of the development cycle, including feature definition, project setup, and execution. •Follow the full bug lifecycle : submit issues with detailed debug logs, track progress, and verify fixes. •Work with OEM/ODM partners to reproduce issues onsite and support root-cause analysis. •Perform bug-fix verification and validate formal software releases. •Provide technical design support to OEM/ODM partners and manage resolution of reported issues. •Deliver technical training on wireless products to field teams and customers. •Review customer specifications and data, providing feedback and recommendations for product improvements.

Responsibilities: 訊號驗證工程師 1. 擬定/執行訊號完整性測試計畫 2. 訊號問題分析 3. 客戶溝通 4. 先進訊號量測技術研究與導入 5. 專案作業流程改善與創新 1. 電子相關(訊號驗證與分析經驗) 2. 語文能力(需與客戶開會溝通) 3. 文書工作(整理測試報告) Work Location: ●新北市土城區-自由街2號

1. 測試程式開發(熟悉Analog IC測試) 2. 測試配件設計(CP/FT線路) 3. 產品功能驗證 4. 量產良率改善 5. 能配合機動性出差 6. 具測試程式開發2年經驗，熟悉C/C++語言 7. 具基本電學與數位邏輯觀念 8. 熟半導體封裝/測試流程 【工作待遇依工作經歷敘薪】 【此職務上班地點位於汐止】

1. 針對高速介面進行信號完整性模擬。 SI simulation : TDR, S parameter,Eye diagram,Crosstalk.. 2. 對於佈局圖給予改良建議。 3. 信號完整性異常除錯。 溫馨提醒：只有經過台郡授權的人員才能處理您的個人簡歷，台郡亦將遵守相關法規與政策，保護您的個人資料。投遞簡歷視同您同意台郡收集您的個人資訊。

工作職掌內容: 1.開發段產品尺寸驗證與模具承認 2.量測新技術/設備之評估/引進/開發 3.新產品測量BKM製作 4.量產段產品尺寸驗證與模具承認 5.量產段零件及成品進料，出貨檢驗