台北市內湖區8年以上大學以上
✅About the job
We're looking for a highly skilled and experienced Senior Project Manager to lead our critical ASIC and SoC development projects, with a strong emphasis on our groundbreaking LLM IP. The ideal candidate will possess deep expertise in the complete silicon development lifecycle, from initial concept and design through to successful tape-out and beyond. This role demands exceptional leadership, communication, and organizational skills to ensure projects are delivered on time, within budget, and to the highest quality standards. A solid understanding of SI/PI, package, and EVB considerations in project scheduling will be a significant advantage.
✅Responsibilities
•Lead and manage the full lifecycle of complex LLM IP-centric ASIC and SoC development projects, from definition to tape-out and production ramp.
•Develop, maintain, and track comprehensive project plans, schedules, and budgets, identifying critical paths and potential risks.
•Drive cross-functional teams, including design, verification, DFT, physical design, CAD, and validation, to achieve project milestones for our LLM IP and related silicon.
•Facilitate effective communication and collaboration between internal teams and external partners (e.g., foundries, IP vendors).
•Proactively identify and mitigate project risks and issues, developing contingency plans as needed.
•Manage change requests and their impact on project scope, schedule, and resources.
•Establish and enforce robust project management processes and methodologies.
•Provide regular and accurate project status updates to stakeholders, including executive leadership.
•Ensure adherence to quality standards and best practices throughout the development process.
•Oversee and integrate project schedules related to Signal Integrity (SI), Power Integrity (PI), package design, and Evaluation Board (EVB) development.
•Collaborate with SI/PI, package, and EVB teams to ensure design for manufacturability and system-level performance.
•Champion continuous improvement initiatives within the project management function.
✅Qualifications
•Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.
•Minimum of 8+ years of experience in project management within the semiconductor industry, with a strong focus on ASIC/SoC development.
•Minimum 2 years of experience as an IC TPM (Technical Program Manager).
•In-depth knowledge of the entire ASIC/SoC development flow, including but not limited to:
○ Architecture definition
○ RTL design and verification
○ Synthesis and STA
○ Physical design (floorplanning, placement, routing, clock tree synthesis)
○ DFT (Design for Test)
○ IP integration
○ Formal verification and simulation
○ Gate-level simulation
○ Tape-out procedures and post-silicon validation.
•Proven track record of successfully bringing complex silicon projects to tape-out.
•Excellent leadership, communication (verbal and written), and interpersonal skills.
•Strong analytical and problem-solving abilities.
•Proficiency with project management tools (e.g., Jira, Monday.com, MS Project, Asana).
•Ability to work effectively in a fast-paced, dynamic environment and manage multiple priorities.
•Fluent in English.
✅Preferred Qualifications (Nice to Have)
•PMP or equivalent project management certification.
•Direct experience managing projects with significant SI/PI, package design, and EVB integration challenges.
•Familiarity with various packaging technologies (e.g., BGA, QFN, Flip-Chip).
•Experience with high-speed interface design considerations.
•Exposure to AI accelerators or NPU (Neural Processing Unit) development, especially related to LLMs.