工作內容:
1. 熟悉PCB製程或設備/客服經驗,具PCB大廠正相關經驗5年以上,有10年以上PCB大廠主管經驗更佳,或有直接對接過國際知名大廠客戶如: Nvidia / Apple / Tesla / 全球四大型雲端服務供應商(CSP)如: Microsoft / Google / Meta / AWS,薪資可議。
2. 擅長PCB厚大板、HLC高層次板(8層至20層以上) ,HDI(高密度互連技術) ,具全製程或乾製程或濕製程相關經驗3-5年,熟CCL銅箔層壓板、車用IC載板、ABF載板更加分。
3. 可配合長期外派在泰國或其他亞洲地區
4. 英語略懂,與東南亞國家同事溝通為主,會東南亞國家第二外語佳。
1. Responsible for process design and development for new product, and contact with customer as technical window person.
2. In charge of the NPI phase process assessment, identify the critical points with potential risk for future mass production.
3. Lead the new & critical process development, drive the cross team to follow the process qualification procedure and ensure implementation.
4. Involve in the new product functional evaluation, and provide the positive support from assembly process points of view.
5. Responsible the new process validation with DOE plan definition, including of the related documentation management.
6. Support the production line to solve the critical issue during the mass production trail running.
7. Keep the effective communication with customer; ensure the customer audit smoothly as plan.
8. Take part in the continuous improvement on assembly process, to enhance the efficiency.