「交換機軟體工程師_Ethernet」的相似工作

1. Linux kernel, device driver development on embedded system. 2. Application development on embedded system. 3. Embedded System Performance Optimization.

Role Description: The IDSP Algorithm Development Engineer is responsible to develop image processing algorithm. This role focuses on researching, designing, and implementing advanced image processing algorithms for various imaging applications. The ideal candidate will have a strong background in digital signal processing, computer vision, and algorithm development. Key responsibilities: • Design and develop innovative image processing algorithms for various imaging applications. • Optimize algorithms for performance, memory usage, and power efficiency • Create and maintain technical documentation for algorithms and implementations • Collaborate with cross-functional teams to integrate algorithms into production systems • Analyze and improve existing image processing pipelines • Conduct performance analysis and optimization of implemented algorithms • Develop proof-of-concept prototypes to validate new approaches

1. 根據 Device Driver功能需求, 使用 C/C++開發 Test Program for Unit Test and Integration Test 2. 撰寫 test case測試 TV 功能 3. 維護既有 TV 平台及維護新開發功能

The Software Engineer is responsible for Bluetooth SOC Audio Kernel\HAL and Audio DSP to support Airoha Bluetooth Audio.

1. Project integration support & implementation, to deliver qualified nestlist from RTL. 2. preSTA/SYN/LEC/postSTA/etc. EDA flow execution and enhancement 3. Timing & power closure 4. Schedule control, netlist optimization, flow coordinator

1.半導體自動化設備控制軟體之分析、設計以及程式撰寫。 2. 使用C# .net , winform/Halcon Form 開發檢測/量測/介面系統 3. 各模組DLL 整合 (光源, 相機, 控制IO, DB, 影像演算法, 客戶API等) 4. 多檢/量測邏輯，及多執行續控制管理 5. 熟悉Halcon/ Opencv/ MIL/eVision軟體工具 6. 有相機或軸卡整合經驗佳 7. 機台流程控制

1. Design and develop GUI and/ or firmware to meet product requirements 2. Design software architecture for specific product family 3. Assist AE to do product function verification 4. Provision fundamental toolchain 5. Establish software framework and components 6. Bring in innovative solutions for software development process improvement

工作項目： 1. Camera firmware 負責同仁，專門處理 Tier 1 Customer firmware的需求 2. Camera firmware 底層開發，專門處理 Customer function 到 Git 的整合和標準化 3. Camera AI feature開發，專門處理Customer的AI應用 應徵條件： 1. 碩士以上，電機工程、電信工程、電控工程、電子工程、資訊工程、資訊科學、動力機械、自動控制、通訊工程相關科系畢業為主 2. 熟悉 C , C++ , Python , Git, Python 3. 熟悉 Scope , USB Analyzer , I2C Analyzer 4. 具3年以上下列相關經驗者佳： -熟悉 USB 協議和相關產品及USB Camera 相關 firmware 控制 -熟悉 firmware code compiler 環境及控管軟體 -了解 Camera ISP Pipeline 及 PC Camera相關 feature -具備基本 Hardware debug (GPIO / I2C etc..) 能力 相關經驗者為佳。

* 工作內容: 這職缺是威聯通先進儲存研發處的軟韌體研發工作，主要工作在於開發企業資訊中心及雲端資料中心所需的高階儲存裝置。工作於11人的團隊，主要是在處理資料路徑和儲存平台的韌體研發工作。開發該系統的儲存核心軟體，Linux/FreeBSD/Unix作業系統和特有的儲存系統操作及功能，處理資料服務，資料的完整性，適用性和其它關鍵儲存系統功能。 工程師必須具備在商業級軟體開發經驗。應徵者應表現出其具有靈活性，強大的抗壓性，出色的解決問題能力，並在過往的工作記錄中，能證明具有滿足專案期限性的能力。職責包括系統軟體設計，開發設計和整合儲存產品中各個組成模組。應徵者應該熟悉作業系統技術，及現代軟體工程的原則。 * 職缺條件: 1. 必須熟悉 C 語言 2. 資深工程師需具備下列兩項技能之一 -檔案系統: 例如 ZFS, EXT4, NTFS, BTRFS - 網路儲存協定: 例如 iSCSI, Fibre, SAS, NFS, CIFS 3. 熟悉儲存設備相關概念 4. 熟悉python或shell script

Main JD: 1. System firmware and diagnostic development for EVT/DVT/PVT (using C/C++)or Automated test program development for EVT/DVT/PVT (using Python) 2. Co-work with cross-functional teams on projects 3. Communicate with customers in English Secondary JD: 1. Assist cross-functional teams on projects to resolve software-related issues 2. Develop some tools to assist EVT/DVT/PVT

1. Linux kernel, device driver development on embedded system. 2. Application development on embedded system. 3. Embedded System Performance Optimization. 4. I3C/HCI related experience.

1. ARM CPU design physical implementation 2. ARM CPU power and timing sign off 3. Physical design flow enhancement for high-speed CPU

1. 觸控 FPGA 系統驗證 2. 韌體演算法開發

【產品線描述】 ASIC Solutions專注於提供高效的應用特定集成電路（ASIC）解決方案，涵蓋智能手機影像信號處理（ISP）、獨立顯示處理器、遊戲機、增強現實（AR）與虛擬現實（VR）設備，以及人工智慧生成內容（AIGC）等領域。 我們的設計不僅提升產品性能，還有效降低功耗，延長設備使用壽命。專業團隊根據客戶需求提供量身定制的方案，確保在性能和成本效益上達到最佳平衡。選擇ASIC Solutions，共同推動科技未來。 【工作說明】 軟/韌體開發人員： 1. FPGA, IC, IP驗證 2. 軟韌體系統規劃及開發 3. 軟韌體穩定性測試, 自動化測試 4. 功耗分析與優化 5. 規格討論 硬體開發人員： 1. FPGA, IC, IP/AIP 驗證 2. 生產測試硬件規劃及開發 3. 系統/IC 穩定性測試, 功耗量測 4. 封裝評估 5. 規格討論 【必要條件】 1. 電子、電機、資工相關科系畢業 2. SoC軟韌體及硬體開發經驗

請上傳英文履歷至官網(職缺代碼12427): https://careers.synopsys.com/job/hsinchu/r-and-d-engineering-sr-staff-engineer/44408/84643890752 You Are: You are a passionate and inventive engineer eager to advance the state of semiconductor technology. With a strong foundation in device physics, circuit simulation, and programming, you excel at translating complex technical challenges into innovative solutions. What You’ll Be Doing: 1.Researching, designing, and implementing advanced semiconductor component models, supporting both mainstream and emerging technologies. 2.Collaborating with peer R&D teams to integrate new technologies into SPICE/FastSPICE products, driving performance optimization. 3.Partnering with industry leaders to develop custom modeling and characterization methodologies tailored to cutting-edge applications. 4.Working closely with teams specializing in parasitic extraction, standard cell library characterization, and related domains to create comprehensive solutions for emerging technologies. 5.Providing expert-level technical support and guidance to key and strategic customers, ensuring their success with Synopsys products. 6.Driving innovation by contributing to the development of reliability modeling and advanced analysis features within SPICE/FastSPICE simulation tools. 7.Participating in cross-functional teams to ensure seamless product integration and a best-in-class user experience. The Impact You Will Have: Accelerate the adoption of next-generation semiconductor technologies through state-of-the-art modeling and simulation capabilities. Enhance the performance and reliability of SPICE/FastSPICE simulation products, directly influencing the success of global semiconductor leaders. Empower customers to innovate faster and with greater confidence by providing robust, accurate, and scalable simulation solutions. Shape the future direction of Synopsys’ EDA offerings by contributing to groundbreaking feature development and integration. Strengthen Synopsys’ reputation as a trusted partner and technology leader within the semiconductor industry. Drive industry standards for device modeling, reliability analysis, and advanced circuit simulation methodologies. Foster an inclusive and collaborative culture, mentoring junior engineers and promoting best practices across the organization. What You’ll Need: 1.MS or PhD in Electrical Engineering, Computer Science, Physics, Material Science, Applied Statistics, or Applied Mathematics, with 3+ years of relevant industry experience. 2.Strong knowledge of device physics, semiconductor process, and manufacturing flows. 3.Proficiency in programming with Linux, C/C++, and Python; solid foundation in data structures and algorithms. 4.Hands-on experience in SPICE circuit simulation or the development of related EDA software products. 5.Familiarity with Memory, Analog, Digital, High Frequency, or RF device/circuit design (a plus). 6.Experience or interest in machine learning applications and reliability analysis methodologies (a plus). Who You Are: Exceptional communicator, able to explain technical concepts clearly to diverse audiences. Strong problem-solver with a can-do attitude and resilience in the face of technical challenges. Team player who thrives in collaborative, multicultural environments. Self-motivated, organized, and able to manage multiple priorities effectively. The Team You’ll Be A Part Of: You’ll join a world-class R&D team at the forefront of SPICE/FastSPICE circuit simulation technology. The team is dedicated to developing, innovating, and implementing new technologies for device and reliability modeling, as well as advanced analysis features. Working closely with other market-leading product teams and industry partners, you will contribute to cross-functional projects that drive Synopsys’ leadership in EDA solutions. Our team values collaboration, knowledge-sharing, and a commitment to excellence in all aspects of product development and customer support.

【產品線描述】 Display Timing Controller(TCON) 內建 8bit/32bit RISC, 內涵影像/光學/色彩/觸控 處理方案，產品廣泛應用在notebook/monitor /TV/工控/醫療/車用/公用顯示 【工作說明】 1. 支援客戶面板點亮 2. 支援客戶面板影像/光學/色彩 調教 3. 面板問題處理解決 4. 終端產品 (notebook/monitor/TV/..)產品問題處理解決 【必要條件】 1. 基本儀器使用操作(示波器/電源供應器) 2. 熟悉基本硬體設計軟體使用(OrCAD/PowerPCB/…) 3. 電子電路設計經驗 4. 客戶互動有熱誠, 能配合出差

主要TDDI整合Display/Touch的IC，除了觸控相關技術外，還做為兩者的整合橋樑，發揮1加1大於2的價值 【工作內容】 1. 觸控相關韌體開發 2. 排除觸控及整合性問題 3. 訊號量測及分析實驗 4. 協助客戶產品量產導入 5. Android/Linux 平台Driver整合 【必要條件】 1. 電機/資訊/電控相關背景碩士畢業 2. 熟C程式語言 3. 客戶應對能力佳 4. 有基礎電子電路或儀錶設備控制經驗

【產品線描述】 Display Timing Controller晶片, 主要負責顯示器的影像最佳化與面板時序驅動, 並具有一MCU系統及完整的色彩/影像處理方案, 得廣泛應用在NB / Monitor / TV / 工控 / 醫療 / 車用 / 公用顯示 【工作說明】 1. 制定IC規格書 2. FPGA 功能驗證及環境架設 3. HW PCB相關設計開發 4. ESD,EMI 問題處理與改善 5. Tooling製作及開發 6. IC 及系統相關驗證 7. FW & SW 開發及驗證 8. IP驗證及相關認證. 9. 支援客戶問題處理 【必要條件】 1. 具備PCB電路設計經驗 2. 具備 IC或FPGA開發驗證相關經驗 3. 對工作細心，有熱忱

▼封裝領導廠▼AT BU 產品服務： 晶圓重組、晶圓/成品測試&生技醫療產品封裝、通訊模組封裝─Bio、RF 1.新產品導入與製程風險評估 2.蒐集產品數據分析及完成報告撰寫 3.新產品品質異常解決與客戶需求回覆 4.新產品專案開發與追蹤 *工作待遇/職稱：將依學經歷及專長等條件進行敘薪。

研發網路相關控制、安全、加速等功能，提供底層驅動程式、系統維護、通訊軟體、應用程式並進行軟體整合驗証與正式發行。 1. 擅長 C/C++ 或 C#/WPF 或 Android/iOS 或 Laravel 前後端 程式設計。 2. 具 Linux 開發經驗 或 網路封包處理 或 網路安全開發經驗者尤佳。 3. 學習力強、喜歡思考、具研發熱忱、積極有責任感。 4. 需有良好溝通能力及抗壓性。 5. 具備解決問題與分析能力。