「軟韌體工程師-TW」的相似工作

韌體團隊開發範疇： 1. 研究電池特性(例如：鋰電池)，開發新的電池電瓶分析演算法。 2. 完成電池測試儀器、電池充電器功能開發。 專案執行過程的常態性工作： 1. 使用MCU開發工具及程式語言，主要是C語言。 2. 進行單元功能程式整合。 3. 單元功能程式撰寫及驗證。 4. 撰寫工程規格 / 技術文件 (包含測試計畫)。 5. 韌體版本管控 (Git)。 Our FW team is responsible for: 1. Developing the functionalities of battery diagnosis/charging products. 2. Investigating new diagnosis algorithm for batteries is part of our job. Regular duties in project execution: 1. Use MCU development tools and programming languages, primarily C language. 2. Perform unit function program integration. 3. Write and verify unit function programs. 4. Write engineering specifications / technical documentation (including test plans). 5. Firmware version control (Git).

應屆畢業生可 1.無人機自駕系統開發工程參與。 2.熟悉Linux 及電腦視覺相關應用及開發流程。 3.具備Deep Learning / Edge Computing相關開發經驗。 4.具備電控或航太領域背景尤佳。 5.能貫徹執行上級交辦事項。 6.無經驗可，提供相關培訓。

1. 主動式電子掃描陣列 (相控陣列) 雷達系統之韌體設計。 2. 熟悉嵌入式RTOS開發技術。 3. 熟悉數位通訊協定, 如: I2C, eSPI, SMBus, UART, JTAG, USB等。

1.無人飛行器航控系統開發參與。 2.RTOS及姿態演算法開發工作。 3.具備電控或航太領域背景尤佳。 4.熟悉 ARM Cortex M系列 等微處理器架構及開發流程 5.能貫徹執行上級交辦事項。 6.協助客戶教育訓練課程及相關工作。 7.無經驗或應屆畢業生可，提供相關培訓。

1. System integration on HIMAX chip for NB customer(USB camera) 2. Focus on UVC(USB video class) related function 3. support Windows Hello certicifation 4. Technical support for NB customer design In

Firmware Engineer (Sr - Staff) We are aiming for the best mmWave solution provider in Taiwan to provide decent and novel mmWave development kits, testing solutions and AiP designs. We are looking for a Firmware Engineer to be responsible for designing and implementing firmware for RF frontend products. The Firmware Engineer works with the hardware development team to evaluate and test the latest mmWave RF IC solutions and design into our products. TMYTEK致力於成為最好的mmWave RF方案供應商. 我們在招募資深經驗的嵌入式系統軟體工程師, 主要負責開發RF前端模組的軟體解決方案. 會需要與RF和硬體工程師深入合作包含評估與導入設計各式新款mmWave RF IC. ★ Job Overview You will be maintaining firmware, library, tools, and verification scripts of TMYTEK’s mmWave RF front-end products. You will also be responsible for design and development of the next generation of TMYTEK’s mmWave RF front-end products. ★ 職位概述 維護TMYTEK現有的mmWave相關RF射頻前端產品的韌體, 各種開發測試工具. 設計並且實做TMYTEK最新的mmWaveRF射頻前端產品相關的各種軟體方案. ★ Job Duties and Responsibilities • RF IC evaluation and design-in • Review circuit designs and schematics with the hardware design team. • Develop automated verification and measurement software for circuit testing • Analyzing test results and feedback to the hardware design team. • Develop embedded software to control RF ICs to meet 3GPP or related telecommunication standards. • Develop PC-side libraries for device control • Development of RF IC calibration methods ★ 工作內容與職責 • 各種RF IC的評估, 驗證, 量測和導入設計 • 與硬體開發團隊一起review硬體架構和原理圖 • 開發與維護自動化硬體驗證/量測的軟體 • 分析硬體驗證結果並且反饋硬體開發團隊 • 根據3GPP或是相關規範開發與設計RF前端產品韌體 • 開發PC端的控制用library和application • RF IC的calibration ★ Job Requirements and Qualifications • At least 3 years of experience as a embedded software engineer • Strong coding skills in C/C++/Python • Familiarity with ARM family MCU and tool chains • Familiarity with software development process such as version control, test methodology, issue tracking, design review, code review, ...etc • Strong background in RTOS • Master degree in relevant fields, EE/CS/communication are preferred • Excellent interpersonal and communication skills • A good working knowledge of communication systems. • Familiarity with testing equipments including oscilloscope, network analyzer, spectrum, signal generator, signal analyzer • Detail oriented • Critical thinker • Problem solver and customer-centered ★ 條件要求 • 三年以上嵌入式系通開發除錯經驗 • C/C++/Python • 熟悉任何一款ARM架構MCU的架構與tool chain • 非常熟悉軟體開發流程, 包含基本的design review, code review, 版本管理 (git, github), bug追蹤, 測試方法等 • RTOS與計算機結構 • 電機資工通訊領域碩士以上學位 • 溝通能力與抗壓性 • 熟悉通訊系統基本架構 • 熟悉測試儀器包含示波器, 電源供應器, 電表, 網路分析儀, Spectrum, SG, SA • 注重細節 • 具有批判性思考的能力 • 專注於解決問題 • 客戶導向 ★ Preferred Qualifications • Experiences in WiFi/BT/4G LTE related products • Knowledge of design patterns and refactoring • LabVIEW • MATLAB • FPGA development ★ 加分條件 • WiFi/BT/4G LTE相關產品經驗 • 熟悉軟體工程概念與方法, 例如design patterns, 重構等 • LabVIEW • MATLAB • FPGA programming ★ Salary • 60K/month NTD ~ 100K/month NTD • Stock option

負責公司產品之嵌入式系統開發 : 1. 規劃及執行感測器驅動和MCU控制設計, 並維護量產產品。 2. 周邊晶片驅動 3. 執行產品韌體測試 4. 與 AI 團隊合作, 導入邊緣運算 5. 控制韌體開發進度、品質與成本。 6. 文件規格撰寫 必備條件: 1. 具獨立解決問題能力 2. 具良好表達能力 3. 熟悉 C programming 4. 熟悉 I2C, SPI, UART, GPIO 7. 熟悉git 做軟體控管

韌體團隊開發範疇： 1. 研究電池特性(例如：鋰電池)，開發新的電池電瓶分析演算法。 2. 完成電池測試儀器、電池充電器功能開發。 專案執行過程的常態性工作： 1. 使用MCU開發工具及程式語言，主要是C語言。 2. 進行單元功能程式整合。 3. 單元功能程式撰寫及驗證。 4. 撰寫工程規格 / 技術文件 (包含測試計畫)。 5. 韌體版本管控 (Git)。 Our FW team is responsible for: 1. Developing the functionalities of battery diagnosis/charging products. 2. Investigating new diagnosis algorithm for batteries is part of our job. Regular duties in project execution: 1. Use MCU development tools and programming languages, primarily C language. 2. Perform unit function program integration. 3. Write and verify unit function programs. 4. Write engineering specifications / technical documentation (including test plans). 5. Firmware version control (Git).

1. MCU/SOC 軟/韌體開發與設計 2. RTOS/MCU之軟/韌體開發 3. 整合 WIFI/BT module，開發無線通訊相關功能的軟韌體應用。 4. IOT週邊Sensor開發驗證 5. 熟C, Python, Windows UI 簡單控制界面

1.電子、電機相關科系 。 2.熟悉C語言程式設計。 3.對PIC16/24,ARM Cortex-M 韌體開發有興趣者。 4.具ADC(Analog to digital converter)測量領域相關知識。 5.有MCU相關周邊 I2C、I2S、SPI、UART、USB等介面韌體開發經驗者佳。 6.協助公司電控部門規劃。 7.支援其他部門電控產品開發。

1. 工業標準研讀 2. 產品韌體開發與維護 3. C#工程軟體開發與維護 4. 產品測試分析與除錯

1.Embedded Linux OS/Platform 開發 2.Embedded Linux Platform 架構及系統調整 3.規劃Embedded Linux 平台開發流程並領導團隊執行計畫

Embedded Linux BSP Engineer (ARM team) Job description: - Work on u-boot/SPL and linux kernel to bring up new platforms - Enhance Yocto BSP meta layer to add more features - Maintain and update u-boot/kernel/Yocto for existing products Preferred Skills: - C/C++, linux toolchain - Git - Debug skills in Linux kernel/user space - Docker

《About this Role》 We're looking for a full-stack IoT firmware engineer who takes ownership of the complete development lifecycle - from MCU integration to cloud connectivity, and from code implementation to automated testing. You'll be responsible for building IoT wireless modules that bridge device hardware with cloud services, ensuring end-to-end functionality and quality. 我們正在尋找一位全端 IoT 韌體工程師，能夠負責完整的開發生命週期 - 從 MCU 整合到雲端連接，從代碼實作到自動化測試。您將負責構建連接設備硬體與雲端服務的 IoT 無線模組，確保端到端的功能性和品質。 《What We're Looking For》 "You build it, you own it, you test it" - We believe in empowering engineers to take full ownership of their work. With modern AI tools and testing frameworks, we expect our firmware engineers to deliver production-ready, thoroughly tested solutions. 「你開發，你擁有，你測試」 - 我們相信賦權工程師完全擁有自己的工作。透過現代 AI 工具和測試框架，我們期望韌體工程師交付可投產的、經過完整測試的解決方案。 《Your Key Responsibilities》 ● End-to-End Development | 端到端開發 ○ Wireless Module Development: Build application layers for IoT wireless modules (Wi-Fi, BLE, Thread, etc.) that interface with existing MCU systems. ○ Protocol Integration: Implement communication protocols to bridge MCU data with cloud platforms efficiently. ○ Cloud Connectivity: Design and develop reliable data transmission pathways from device MCU to cloud services. ● Full Testing Ownership | 完整測試責任 ○ Automated Testing: Design and implement automated test suites for your firmware using modern testing frameworks. ○ Manual Validation: Perform thorough manual testing for edge cases and integration scenarios. ○ Performance Testing: Ensure optimal memory usage, power consumption, and network performance. ○ AI-Assisted Testing: Leverage AI tools to generate test cases, identify potential issues, and optimize testing strategies. ● Quality Assurance | 品質保證 ○ Code Quality: Write clean, maintainable, and well-documented code that passes all quality gates. ○ Debugging & Troubleshooting: Independently identify, analyze, and resolve firmware issues across the entire stack. ○ Performance Optimization: Continuously improve firmware efficiency and reliability based on testing feedback. ● DevOps & Automation | 開發維運與自動化 ○ CI/CD Integration: Set up and maintain automated build, test, and deployment pipelines for your firmware. ○ Documentation: Create comprehensive technical documentation for APIs, protocols, and testing procedures. ○ Monitoring: Implement logging and monitoring solutions to track firmware performance in production.

1. 電力產品韌體(軟體控制及程序)研發及驗證,第二貨源零件驗證確認,線路討論及軟體控制驗證及特性驗證 2. 產品維護及生產維護處理 3. 產品驗證報告處理 4. 教育訓練安排及直屬主管或專案工程交辦工作事項

1. embedded C / C++ 應用程式開發 2. Open-source library porting 實務經驗 3. Socket Programming開發經驗及相關網路知識 4. 良好除錯技能

1.負責MCU韌體功能的實施與開發。 2.識別並解決韌體相關的問題和故障。 3.執行單元測試和集成測試，確保韌體的穩定性和功能完整性。 4.與硬體工程師合作，進行電路板的功能整合和測試。 5.撰寫技術規格、測試報告等技術文檔。

1. Board Bring up and BSP provide 2. Driver development for customer requirement 3. Design diagnostic plan and release image. 4. Ethernet switch software potocol design. 5. Trouble shooting for complex development issues.

散熱機櫃BMC韌體控制設計規劃 需能配合主管指派之工作 需要能整合機櫃各個感測元件數據整理以及對外設備通訊傳輸的需求 具有機櫃BMC設計開發的相關經歷 需了解data center security的需求

銓安智慧科技為嵌入式安全的服務公司，基於「金鑰管理」與「密碼學實作」，研發獨家硬體資安解決方案。 公司的產品為安全運算平台，採用(1)安全晶片、(2)密碼算法安全實作、(3)軟硬體入侵防護措施等，為客戶的應用提供可信賴的基礎。 職責 • 協助SoC密碼晶片/SoM密碼模組等相關應用韌體開發與測試工作 • 協助密碼模組與PC端的整合工作 • 協助產品之量產工具開發