「功率模組封裝設計主管」的相似工作

Introduction to the job Do you like challenges and do you want to work in a fast pacing supply chain environment to support some of the biggest semiconductor companies worldwide? Are you familiar with Logistics Operations and like to managing urgent demands on a daily basis?  If this sounds like you and if you have a strong customer oriented mindset, here is your mission. Role and responsibilities For our Global Operations Center in Taiwan we are searching for Supply Chain Professionals. You fulfill the demand of our customers for spare parts and tools for their maintenance activities on some of the most complex machines in the right quantity and at the right time & cost. Time is of the essence to ensure a seamless production of our customers without interruptions on our machines. -Handling of urgent material requests from worldwide customers in a rolling 24/7 shift system with the right customer focus, while meeting all milestones related to communication and execution -Monitoring of worldwide shipments  -Ability to resolve complex issues and drive improvements to further optimize processes -Ability to support escalations and provide communication proposals for review -Constructive and reliable communication with worldwide stakeholders from all departments within ASML -This position requires shift work. Education and Experience Bachelor's Degree in related subject i.e. Supply Chain Management, Information Science, Engineering etc. preferred -Minimum 1 year of relevant experience in an international company, semiconductor industry is preferred -A tactical thinker with strong interpersonal and communication skills -Analytical thinking and ability to organize and prioritize workload Skills Working at the cutting edge of tech, you’ll always have new challenges and new problems to solve – and working together is the only way to do that. You won’t work in a silo. Instead, you’ll be part of a creative, dynamic work environment where you’ll collaborate with supportive colleagues.  There is always space for creative and unique points of view. You’ll have the flexibility and trust to choose how best to tackle tasks and solve problems. To thrive in this job, you’ll need the following skills: -Stress-resistant; act under high pressure -Flexible; willing to go the extra mile for the customer -Excellent professional communication in English, written and oral -Drive for results; does not stop until solution has been found, even when obstacles arise -Team player -Change management competencies -Convincing, pro-active and “can do” mentality -Cultural awareness -Experience with ERP system(s), SAP R/3 knowledge preferred -Ability to prioritize Diversity and inclusion ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that diversity and inclusion is a driving force in the success of our company. Need to know more about applying for a job at ASML? Read our frequently asked questions.

▼封裝領導廠▼AT BU 產品服務： 晶圓重組、晶圓/成品測試&生技醫療產品封裝、通訊模組封裝 1、封裝產品熱應力與電性模擬。 2、封裝產品熱阻模擬量測與優化。 3、維護模擬專案資料庫。 4、熟悉Ansys Mechanical、Q3D模擬套件等。 5、熟悉Inventor 3D Layout 設計等。 6、熟悉功率元件封裝尤佳。 7、熟悉車用可靠度等執行尤佳(AEC-Q101、AQG-324)。 *工作待遇/職稱：將依學經歷及專長等條件進行敘薪。

1、產品設計審查及測試驗證、RD會議參與 2、APQP , PPAP , CP , MSA , SPC , FMEA六大核心工具應用 3、測試規範解析與導入 4、稽核應對

1. 封裝固晶(Die-Bond)製程作業。 2. 固晶(Die-Bond)相關設備保養維護、異常排除、效能改善、改機調機。 3. 封裝固晶(Die-Bond)製程改善與開發。 【本職缺可透過104應徵，也歡迎直接至穩懋官方網站投遞，增加履歷曝光度】請至穩懋官方網站投遞個人履歷表，此職缺履歷登錄網址：https://www.winfoundry.com/WinTalentPool/JobRequirement/Edit/1047

•Design reliability test plan process for device life time evaluation •Coordinate with third party suppliers on device WAT/CP •Coordinate with third party suppliers on reliability test and failure analysis of power devices

1. Solidworks繪圖與ANSYS Fluent/ANSYS CFX操作 2. 大型乾燥系統設計以及熱流場模擬分析 3. 二相流(固-氣系統)與顆粒追跡分析 4. 熱流場改善與多物理場耦合分析 5. 分析結果數據整理與實驗驗證

1.半導體封裝製程執行： 負責半導體封裝前段與後段製程操作，懂 Die Saw、Die Bond、Wire Bond 等設備操作與維護尤佳。 2.製程與品質管理： 撰寫與維護 SOP 及 QC Flow Chart，針對製程異常進行問題排除、改善與持續追蹤，提升製程穩定度與生產效率。 3.樣品與專案管理： 負責樣品製作進度追蹤，協調跨部門資源，確保客戶需求按時完成。 4.人員訓練與指導： 執行新進工程師與技術員的培訓與技術指導，提升團隊整體技能。 5.需接受短期大陸蘇州廠區出差，學習機台操作與製程，約1-2個月。 6.熟悉專利撰寫尤佳。

NZXT is seeking a highly motivated Thermal Engineer to help develop best in class, innovative cooling solutions for Desktop, mobile and wearable systems. The role involves architecture, design, analysis, prototyping and validation of cooling solutions. The position requires working closely with cross-functional teams as well as external suppliers. We need a creative thinker who can solve complex and challenging problems both independently as well as within a team environment. This position involves working in a dynamic and fast-pace environment with tight timing and dynamic constraints. 【Responsibilities】 • Responsible for Desktop and peripheral products thermal design • Design air/air and liquid/air cooling solution for consumer electronics • Define thermal policy and control algorithms and characterize system response • Develop analytical models of conductive and convective thermal systems • Drive component selection (Heat Exchanger, Fan, Pump, TIM etc…) • Optimize cooling solutions for all aspects of their performance and reliability • Develop validation test plans for thermal components to determine if they meet design requirements • Conduct tests, post-processing data, and communicating results to stakeholders • Review and maintain DFMEA, and test standards for the thermal system • Drive development programs with both internal and external engineering teams • Optimize design for cost and system-level reliability

1. Ensure PKG design is optimized with SI/PI/Thermal requirements. 2. Create the PKG/RDL/Subtract SI 3D modeling and perform extraction of S-Parameters and RLGC model. 3. Full-wave modeling of VIAs, Connectors, Package and PCB channels, components using 3D full-wave EM tools. 4. Provide the CM(Construction rules) and Design Rules(guidelines) for the PKG/RDL/Subtract design. 5. Provide the Substrate manufacturing process and material property. 6. SI(Signal integrity) simulation and optimization on package stack-up, power/ ground plane assignment and optimization, decoupling cap locations to minimize power ground noise. 7. PI(Power integrity) analysis for state of art package/system designs, which include but not limited to package layout model extraction, transient noise analysis to meet the silicon noise spec, decoupling strategy and analysis. 8. CTK(Crosstalk) analysis and reduction on-package considering mutual-effect by on-die, on-silicon interposer and on-PCB. 9. SSN(Simultaneous Switching Noise)/SSO analysis for I/O (DDR5/4/3, LPDDR5/4/3, etc.) power domain. 10. Eye diagram(ZRZ/PAM4) and jitter analysis for CPS(Die Chip-PKG-System PCB) co-simulations. 11. Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements. 12. Familiar with assembly and substrate manufacturing process is a plus. 13. Familiar with programming/scripting in Java, VBScript, PERL, TCL, MatLab and/or equivalent. 14. Experienced in SI PI automation tool development with Python or PyAEDT is a plus. 15. Working with ASIC/HW/Production team.

Overview: MOSFET Design Team offers the innovative environment for talents to dive deep into the world of device design, platform development, and research. We offer working locations in both Xindian and Tainan. Come and join us to focus on the most cutting-edge semiconductor materials and applications! Key Responsibilities: • Develop and execute innovative device layouts in line with customer requirements, ensuring optimal functionality and efficiency. • Partner with PE and Quality teams to enhance device reliability and address any arising issues in time. • Establish and continuously optimize SPICE models to reflect the characteristics of both new and existing devices. • Work alongside the PIE team and collaborate with external foundries, paving the way for the next generation of advanced devices. • Drive the research and patenting efforts centered around novel designs, applications, and advanced materials, such as GaN and SiC. • Accomplish additional tasks delegated by the supervisor. Qualifications: • A Master’s degree in EE, Physics, or a related field. • Expertise in power devices, with a spotlight on UMOS, SGT, LDMOS, MLSJ, GaN and SiC. • Comprehensive understanding of device physics and semiconductor manufacturing processes. • Proficiency in semiconductor simulation tools. • Strong English communication skills, catering to both technical and non-technical stakeholders.

1. 負責二級體生產線設備的保養與維修 2. 依據設備保養規範及PM表單執行維修保養作業 3. 學習設備並撰寫學習報告 4. 針對頻發機故,能積極思考改善 5. 執行主管交辦事項

We are seeking great talent to help us build The DNA of tech.® Vishay manufactures one of the world's largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. We help the world's most in-demand technologies come to life. Every day our products touch your life and the lives of people across the world, though you likely do not know it. Come join us and help us build The DNA of tech.™ Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). Learn more at www.Vishay.com. Do you want to help us build the DNA of tech.? Vishay is currently seeking applicants for a Senior Product Engineer AUTO. You will be responsible for overseeing all phases of product engineering, new product development and production support for our Automotive Mosfet product line. Job Location: The ideal candidate will be working remote near one of our Vishay offices in Taipei, Taiwan Newport, UK. What you will be doing: • Hands-on technical ownership of new and established products within the Automotive MOSFET Division • Leads and manages new product introduction of leading-edge products from product definition and development through to characterization, qualification, and release phases, liaising with Market development, R&D, Package, Device design and other manufacturing organizations • Supports product problem solving with manufacturing, CQM, Product marketing and Application organizations within a fast-paced Automotive customer environment • Defines technical management presentations related to technical problems and project status • Liaise with Europe and Asia Pacific wafer fabrication and package assembly operations and engineering teams in yield enhancement and quality improvement programs • Defines and reviews Automotive product datasheets and technical specifications • Define statistical test methods to optimize yield and drive quality defect reduction programs • Organizes and reviews electrical and thermal characterization data and formulates device datasheets for new product releases • Supports cost reduction programs through engineering lot evaluations What you will bring along: • BS Degree in electrical engineering, Physics or Microelectronics or similar (Masters preferred) • 7 + years Product engineering experience or similar field with good knowledge of Discrete Power MOS semiconductor devices and Trench MOS Technologies Strong multi-tasking project and technical skills are required to drive new product introduction from product definition through to device characterization, qualification and final datasheet release to sales • Strong experience in product / process problem solving using statistical data analytics leading-edge yield management software Experience in the support of offshore facility to facility product transfers (package and wafer) • Familiarity with Automotive AEC Q101 testing and qualification requirements/ methods is a plus • Familiarity with MOSFET semiconductor ATE (automatic test equipment) Wafer and Package test methods are an advantage • Must have experience in interfacing with offshore Product Engineers - Europe - Asia- USA and drive international teams in a collaborative and time conscious fashion • Familiar with 8D and FMEA processes and concepts • Must be willing to travel to offshore sites in USA, Asia and Europe **Please make sure to attach your most updated English resume along with your 104 application.

1.Conduct feasibility studies before product kick-off. 2.Coordinate with the R&D team and other related teams. 3.Check new technology/design rules. 4.Manage new product development. 5.Prepare product samples for testing. 6.Perform competition analysis.

1.Ansys 機械分析 2.Icepack溫昇分析 3.連接器塑膠模流分析 4.與研發人員討論並提出改善意見 5.主管交辦等事宜 6.測試驗證與分析並提出最佳化對策提案 7.新分析技術案例蒐集及彙整。 8.材料實驗規劃及實驗後數據處理 9.實驗規範蒐集及彙整 10.CAE相關數據應用平台與決策支援系統建立

(1) VB6 / C# / Java 程式開發 (2) 熟悉 SECS/GEM, EAP及相關自動化系統之開發與維護 (3) 機台測試資料處理, 有 Tango 系統維護經驗尤佳 (4) TCP/IP 協定程式開發經驗, 熟悉 Windows / Linux / Unix 作業系統 (5) 有封測半導體自動化經驗尤佳

1. 產品電性量測分析與測試報告產出 (MOSFET、DC-DC IC、AC-DC IC) 2. 產品規格書製作 3. 新產品單體與系統驗證 4. 協助客戶問題回覆(需跨部門合作以及客戶溝通)

1、針對組裝、焊接、UC清洗製程，持續進行製程優化、問題改善。 2、客戶抱怨或退貨的材料，進行研究及分析，並提出改善措施。 3、執行各項製程的改善實驗及提出相關的對策。 4、進行製程簡化、改善及降低成本之研究。 5、參與部門內或跨部門專案改善項目。 6、針對原物料異常，進行跨部門的合作並提出研究成果。 7、進行製程文件的發行及修改。

Reporting to MOSFET Development Manager, you will work as Sr. MOS Development Engineer to be responsible for process integration, development and optimization. About the job: Work with product designer to create new device structure ideas and develop the necessary Mosfet/ IGBT /Diode technologies Closely work with internal process experts and external foundry partners to set up the required technologies and processes to produce the prototypes and with test labs to assess results vs. simulations / expected behavior. Responsible for experimental matrix design to evaluate and optimize design vs. specification. Co-work with fab engineering teams to generate the final design rule menu and electrical parametric specifications. Participation in fab selection and evaluation for future foundry locations. Participate and help the Design Engineers and Product Engineers on reverse engineering analysis when necessary. Act as the internal expert of semiconductor devices and processes to provide the necessary information and advices to designers on new technologies. Short term travels for business trips and trainings. About you: Knowledge of semiconductor device physics, such as Diode, BJT, MOSFET, and IGBT…etc and understanding of complex interactions between different fabrication processes. Experiences in semiconductor process development, and basic knowledge in semiconductor device characterization. Ability of arranging tests with 3rd party labs and comfortable with working in Lab for device characterization. Good writing/reading/communication in English is a MUST. The ability to operate independently in a cross-cultural working environment. Experiences in both conventional Bipolar, CMOS, DMOS processe Understanding or experiences in power semiconductor devices assembly and applications would be preferred. Knowledge and experiences of material analysis or Failure analysis tools, such as SRP, SIMS, SEM…etc. Familiar with mask generation, wafer fab process flow and in-line/PCM specifications. Knowledge and experience in one or more of the following areas would be a plus, but not must: o Test pattern generation o Semiconductor process/device modeling o Basic assembly & test processes.

1.協助擬定並執行太陽能工程施工計畫，依據專案時程推動各階段作業順利進行。 2.執行現場環境勘查與初步設置條件評估，審核基礎設計圖說及配置方案。 3.負責掌控工程進度、預算與施工時程，確保專案如期完成並符合成本效益。 4.進行太陽能系統現勘與容量／效能設計優化，編製物料清單並進行成本估算。 5.審查專案規劃內容，確認其符合建築法規、安全規範與技術章程。 6.協助與業主開會,溝通設計變更、施工進度與現場執行事項，確保資訊即時傳遞與問題處理。 7. 其他主管交辦事項。

1. 執行產品可靠度測試及報告管理、與RD討論問題分析 2. 可靠度計畫的規劃與管理 3. 設計資料蒐集、匯整與分析能力 4. 撰寫可靠性測試之軟體程式。 5. 負責新產品可靠度標準的研究。 6 負責品質工程文件之制定。 7. 產品設計審查的參與。