1.撰寫並開發測試程序於 93K / S100等平台 2.製作與驗證 Load Board、Probe Card 並處理 Debug 問題 3.進行 bin map / yield report / fail log 之分析與報告 4.使用

package assembly operations and engineering teams in yield enhancement and quality improvement programs 6. Define statistical

expected yield estimation 3.Contribute to on-going report / projects, such as ALM study, IFRS17, Solvency II, ICS, Local

【Main responsibilities】 1. Support technical discussion in promotion stage based on the knowledge of process and IP roadmap. 2. Provide design guidance based on SF design methodology, and support technical QnA for design issues. 3. Support technical discussion for process related QnA and issues resolving after tapeout. 4. Communicate for technical QnA and issue resolving between customer and HQ 【Objective, Mission】 1. Understanding SF process and IP roadmap for technical support in promotion stage 2. Understanding SF chip design flow and design methodology for customer design support 3. Understanding HQ technical team's role and communication channel

technology adoption. 2. Deliver analysis and recommendations to maximize publishers revenue. 3. Yield optimization with

resolve issues and improve production yield 4. Ensure program documents are complete, current and available for staff and

the test process optimization with a focus on productivity improvements to cycle time and yield across a factory serving

reports, CAPA) to ensure continuous quality improvement *建立供應商品質績效指標（如 PPM, OQA Yield, DPPM）並定期追蹤 Establish and monitor

the Hotel Room Yield, Average Rate and Occupancy targets, as laid out in the Marketing Plan. •To ensure that the Relative Rev

platforms. • - Integration: Integrate software components with hardware and yield a functioning system. Testing and Validation

yield, and consistency. • Evaluate and implement new technologies and equipment (e.g., closed-system bioreactors) to

1. 熟悉FAB 8”wafer Driver、Power IC/MOS/CSP Module等產品製程相關經驗 2. 具備量產WAT/CP/FT driver與MOS產品良率分析與異常處置 3. 熟悉電性分析、FA失效分析工具、Yield

debug test failures, ensuring correlation between lab bench and ATE results. ◎ Identify root cause for yield loss,

status • Liaise with Europe and Asia Pacific wafer fabrication and package assembly operations and engineering teams in yield

customer improve yield rate • Managing multiple customer accounts with multiple projects and distributor FAEs • Collecting

TABLEAPP. By adhering to digital transformation (DX) and yield management with AI, we are revolutionizing the retail industry and

TABLEAPP. By adhering to digital transformation (DX) and yield management with AI, we are revolutionizing the retail industry

with manufacturer team to improve the Total quality yield rate to meet customer requirements. 4.Act as NPI lead to

achievement. 3.Work order management and production scheduling. 4.Work-in-progress (WIP) management and yield tracking. 5.Executing

China to fulfill customer daily shipment activities. 3. Monitor the production yield, manufacturing quality and material